KR970004979A - 인쇄 회로 기판 - Google Patents

인쇄 회로 기판 Download PDF

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Publication number
KR970004979A
KR970004979A KR1019960020037A KR19960020037A KR970004979A KR 970004979 A KR970004979 A KR 970004979A KR 1019960020037 A KR1019960020037 A KR 1019960020037A KR 19960020037 A KR19960020037 A KR 19960020037A KR 970004979 A KR970004979 A KR 970004979A
Authority
KR
South Korea
Prior art keywords
circuit board
printed circuit
printed
board
circuit
Prior art date
Application number
KR1019960020037A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of KR970004979A publication Critical patent/KR970004979A/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/046—Means for drawing solder, e.g. for removing excess solder from pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
KR1019960020037A 1995-06-06 1996-06-05 인쇄 회로 기판 KR970004979A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US46929395A 1995-06-06 1995-06-06

Publications (1)

Publication Number Publication Date
KR970004979A true KR970004979A (ko) 1997-01-29

Family

ID=23863235

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960020037A KR970004979A (ko) 1995-06-06 1996-06-05 인쇄 회로 기판

Country Status (4)

Country Link
US (1) US5736680A (ko)
JP (1) JPH08339838A (ko)
KR (1) KR970004979A (ko)
TW (1) TW387203B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19650154C2 (de) * 1996-12-04 1999-06-10 Lemfoerder Metallwaren Ag Schaltvorrichtung für ein Getriebe eines KFZ mit einer mit Sensoren, Leuchtdioden, Prozessen und anderen elektronischen Bauelementen bestückten Leiterplatte und Verfahren zur Herstellung einer gekrümmten Leiterplatte zur Verwendung in einer solchen Schaltvorrichtung
US6292372B1 (en) * 1999-07-15 2001-09-18 Lucent Technologies, Inc. Solder thieving pad for wave soldered through-hole components
JP2001298052A (ja) * 2000-02-09 2001-10-26 Interuniv Micro Electronica Centrum Vzw 接着剤を用いた半導体素子のフリップチップアセンブリ方法
US6889346B2 (en) * 2001-07-16 2005-05-03 International Business Machines Corporation Scoping of real time signals of remote communication systems over a computer network: systems, methods and program products
US6707683B1 (en) * 2001-07-27 2004-03-16 Daktronics, Inc. Circuit board having improved soldering characteristics
CN101420817A (zh) * 2007-10-22 2009-04-29 鸿富锦精密工业（深圳）有限公司 具有改良焊盘的电路板
CN102833958A (zh) * 2011-06-17 2012-12-19 纬创资通股份有限公司 电路板锁孔emi防制方法及治具
CN110199578A (zh) * 2017-08-11 2019-09-03 华为技术有限公司 一种印制电路板和终端
CN113573491B (zh) * 2021-09-26 2021-12-14 深圳飞骧科技股份有限公司 一种贴片器件的换料机及自动换料的方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3567844A (en) * 1969-06-23 1971-03-02 Mc Donnell Douglas Corp Terminal pad for perforated circuit boards and substrates
US4225900A (en) * 1978-10-25 1980-09-30 Raytheon Company Integrated circuit device package interconnect means
DE3020196C2 (de) * 1980-05-28 1982-05-06 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Mehrebenen-Leiterplatte und Verfahren zu deren Herstellung
US4339784A (en) * 1980-08-11 1982-07-13 Rca Corporation Solder draw pad
US4543715A (en) * 1983-02-28 1985-10-01 Allied Corporation Method of forming vertical traces on printed circuit board
JPS63142894A (ja) * 1986-12-06 1988-06-15 株式会社東芝 フラツトパツケ−ジ集積回路の配線基板
US4851614A (en) * 1987-05-22 1989-07-25 Compaq Computer Corporation Non-occluding mounting hole with solder pad for printed circuit boards
US4891472A (en) * 1987-09-10 1990-01-02 Siemens Aktiengesellschaft Interconnects on a printed circuit board having connecting points for an electronic component with a plurality of terminals
US4835345A (en) * 1987-09-18 1989-05-30 Compaq Computer Corporation Printed wiring board having robber pads for excess solder
JP2514378B2 (ja) * 1987-10-14 1996-07-10 九州日立マクセル株式会社 プリント配線板への半田付け方法
JPH01300588A (ja) * 1988-05-28 1989-12-05 Nec Home Electron Ltd プリント配線板及びそのはんだ付け方法
US4893216A (en) * 1988-08-09 1990-01-09 Northern Telecom Limited Circuit board and method of soldering
US5243143A (en) * 1990-11-13 1993-09-07 Compaq Computer Corporation Solder snap bar
US5227589A (en) * 1991-12-23 1993-07-13 Motorola, Inc. Plated-through interconnect solder thief
US5414223A (en) * 1994-08-10 1995-05-09 Ast Research, Inc. Solder pad for printed circuit boards

Also Published As

Publication number Publication date
JPH08339838A (ja) 1996-12-24
US5736680A (en) 1998-04-07
TW387203B (en) 2000-04-11

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Legal Events

Date Code Title Description
N231 Notification of change of applicant
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid