AU4714001A - Method for applying polymer film to a metal foil - Google Patents

Method for applying polymer film to a metal foil

Info

Publication number
AU4714001A
AU4714001A AU47140/01A AU4714001A AU4714001A AU 4714001 A AU4714001 A AU 4714001A AU 47140/01 A AU47140/01 A AU 47140/01A AU 4714001 A AU4714001 A AU 4714001A AU 4714001 A AU4714001 A AU 4714001A
Authority
AU
Australia
Prior art keywords
metal foil
polymer film
applying polymer
applying
foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU47140/01A
Inventor
John Andresakis
Dave Paturel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oak Mitsui Inc
Original Assignee
Oak Mitsui Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oak Mitsui Inc filed Critical Oak Mitsui Inc
Publication of AU4714001A publication Critical patent/AU4714001A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
AU47140/01A 1999-12-23 2000-12-08 Method for applying polymer film to a metal foil Abandoned AU4714001A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US47155799A 1999-12-23 1999-12-23
US09471557 1999-12-23
PCT/US2000/042681 WO2001047327A2 (en) 1999-12-23 2000-12-08 Method for applying polymer film to a metal foil

Publications (1)

Publication Number Publication Date
AU4714001A true AU4714001A (en) 2001-07-03

Family

ID=23872071

Family Applications (1)

Application Number Title Priority Date Filing Date
AU47140/01A Abandoned AU4714001A (en) 1999-12-23 2000-12-08 Method for applying polymer film to a metal foil

Country Status (3)

Country Link
AU (1) AU4714001A (en)
TW (1) TWI284329B (en)
WO (1) WO2001047327A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10406791B2 (en) * 2011-05-12 2019-09-10 Elantas Pdg, Inc. Composite insulating film

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE661207A (en) * 1968-05-13 1965-07-16
JPS5235281A (en) * 1975-09-16 1977-03-17 Sumitomo Bakelite Co Ltd Peparation of flexible base for printed circuit
JPS52140862A (en) * 1976-05-19 1977-11-24 Nitto Electric Ind Co Method of producing flexible printed circuit substrate
JPS5466966A (en) * 1977-11-07 1979-05-29 Kanegafuchi Chem Ind Co Ltd Manufacture of composite sheet
JPS5694689A (en) * 1979-12-27 1981-07-31 Sumitomo Bakelite Co Method of manufacturing resin film metallcoated plate
JPH0362988A (en) * 1989-07-31 1991-03-19 Chisso Corp Flexible printed circuit board and its manufacturing method
US5470936A (en) * 1993-05-28 1995-11-28 Industrial Technology Research Institute Process for preparing high-adhesion and high-solubility poly (amide-imide-ester)
US5679230A (en) * 1995-08-21 1997-10-21 Oak-Mitsui, Inc. Copper foil for printed circuit boards

Also Published As

Publication number Publication date
WO2001047327A3 (en) 2002-02-07
TWI284329B (en) 2007-07-21
WO2001047327A2 (en) 2001-06-28

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase