DE69028245D1 - Dynamische RAM-Zelle mit hoher Dichte - Google Patents
Dynamische RAM-Zelle mit hoher DichteInfo
- Publication number
- DE69028245D1 DE69028245D1 DE69028245T DE69028245T DE69028245D1 DE 69028245 D1 DE69028245 D1 DE 69028245D1 DE 69028245 T DE69028245 T DE 69028245T DE 69028245 T DE69028245 T DE 69028245T DE 69028245 D1 DE69028245 D1 DE 69028245D1
- Authority
- DE
- Germany
- Prior art keywords
- high density
- ram cell
- dynamic high
- density ram
- dynamic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/37—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor being at least partially in a trench in the substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/03—Making the capacitor or connections thereto
- H10B12/038—Making the capacitor or connections thereto the capacitor being in a trench in the substrate
- H10B12/0387—Making the trench
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P80/00—Climate change mitigation technologies for sector-wide applications
- Y02P80/30—Reducing waste in manufacturing processes; Calculations of released waste quantities
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/90—MOSFET type gate sidewall insulating spacer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/366,801 US5057887A (en) | 1989-05-14 | 1989-05-14 | High density dynamic ram cell |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69028245D1 true DE69028245D1 (de) | 1996-10-02 |
DE69028245T2 DE69028245T2 (de) | 1997-02-06 |
Family
ID=23444579
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69028245T Expired - Fee Related DE69028245T2 (de) | 1989-05-14 | 1990-05-10 | Dynamische RAM-Zelle mit hoher Dichte |
Country Status (6)
Country | Link |
---|---|
US (2) | US5057887A (de) |
EP (1) | EP0401537B1 (de) |
JP (1) | JPH03129769A (de) |
KR (1) | KR900019235A (de) |
CN (1) | CN1051105A (de) |
DE (1) | DE69028245T2 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2746730B2 (ja) * | 1990-05-17 | 1998-05-06 | 富士通株式会社 | 半導体記憶装置 |
US5216265A (en) * | 1990-12-05 | 1993-06-01 | Texas Instruments Incorporated | Integrated circuit memory devices with high angle implant around top of trench to reduce gated diode leakage |
JPH07112049B2 (ja) * | 1992-01-09 | 1995-11-29 | インターナショナル・ビジネス・マシーンズ・コーポレイション | ダイナミック・ランダム・アクセス・メモリ・デバイスおよび製造方法 |
KR950012731A (ko) * | 1993-10-25 | 1995-05-16 | 사토 후미오 | 반도체기억장치 및 그 제조방법 |
JP3660391B2 (ja) * | 1994-05-27 | 2005-06-15 | 株式会社東芝 | 半導体装置の製造方法 |
US5627092A (en) * | 1994-09-26 | 1997-05-06 | Siemens Aktiengesellschaft | Deep trench dram process on SOI for low leakage DRAM cell |
US5444013A (en) * | 1994-11-02 | 1995-08-22 | Micron Technology, Inc. | Method of forming a capacitor |
US5521422A (en) * | 1994-12-02 | 1996-05-28 | International Business Machines Corporation | Corner protected shallow trench isolation device |
DE19549486C2 (de) * | 1995-11-28 | 2001-07-05 | Siemens Ag | Festwert-Speicherzellenanordnung und Verfahren zu deren Herstellung |
DE19544327C2 (de) * | 1995-11-28 | 2001-03-29 | Siemens Ag | Festwert-Speicherzellenanordnung und Verfahren zu deren Herstellung |
US5614431A (en) * | 1995-12-20 | 1997-03-25 | International Business Machines Corporation | Method of making buried strap trench cell yielding an extended transistor |
JPH10256394A (ja) | 1997-03-12 | 1998-09-25 | Internatl Business Mach Corp <Ibm> | 半導体構造体およびデバイス |
US5920785A (en) * | 1998-02-04 | 1999-07-06 | Vanguard International Semiconductor Corporation | Dram cell and array to store two-bit data having merged stack capacitor and trench capacitor |
US6410399B1 (en) * | 2000-06-29 | 2002-06-25 | International Business Machines Corporation | Process to lower strap, wordline and bitline contact resistance in trench-based DRAMS by silicidization |
TWI253748B (en) * | 2004-09-17 | 2006-04-21 | Powerchip Semiconductor Corp | Nonvolatile memory and manufacturing method and operating method thereof |
US7633110B2 (en) * | 2004-09-21 | 2009-12-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Memory cell |
GB0904645D0 (en) | 2009-03-19 | 2009-04-29 | Delphi Tech Inc | Actuator arrangement |
JP2011204927A (ja) * | 2010-03-25 | 2011-10-13 | Seiko Instruments Inc | 半導体装置およびその製造方法 |
Family Cites Families (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5812739B2 (ja) * | 1975-05-07 | 1983-03-10 | 株式会社日立製作所 | 半導体記憶装置 |
US4225945A (en) * | 1976-01-12 | 1980-09-30 | Texas Instruments Incorporated | Random access MOS memory cell using double level polysilicon |
JPS5511365A (en) * | 1978-07-11 | 1980-01-26 | Pioneer Electronic Corp | Semiconductor memory |
JPS5681968A (en) * | 1979-12-07 | 1981-07-04 | Toshiba Corp | Manufacture of semiconductor device |
US4353086A (en) * | 1980-05-07 | 1982-10-05 | Bell Telephone Laboratories, Incorporated | Silicon integrated circuits |
US4364074A (en) * | 1980-06-12 | 1982-12-14 | International Business Machines Corporation | V-MOS Device with self-aligned multiple electrodes |
US4397075A (en) * | 1980-07-03 | 1983-08-09 | International Business Machines Corporation | FET Memory cell structure and process |
JPS58137245A (ja) * | 1982-02-10 | 1983-08-15 | Hitachi Ltd | 大規模半導体メモリ |
JPS58154256A (ja) * | 1982-03-10 | 1983-09-13 | Hitachi Ltd | 半導体装置 |
JPS5982761A (ja) * | 1982-11-04 | 1984-05-12 | Hitachi Ltd | 半導体メモリ |
JPS59161860A (ja) * | 1983-03-07 | 1984-09-12 | Hitachi Ltd | 半導体メモリ装置 |
JPS6012752A (ja) * | 1983-07-01 | 1985-01-23 | Nippon Telegr & Teleph Corp <Ntt> | 半導体記憶装置およびその製造方法 |
US4717942A (en) * | 1983-07-29 | 1988-01-05 | Nec Corporation | Dynamic ram with capacitor groove surrounding switching transistor |
JPS6023507B2 (ja) * | 1983-11-21 | 1985-06-07 | 株式会社日立製作所 | 半導体記憶装置 |
JPS60126861A (ja) * | 1983-12-13 | 1985-07-06 | Fujitsu Ltd | 半導体記憶装置 |
JPS60213053A (ja) * | 1984-04-09 | 1985-10-25 | Oki Electric Ind Co Ltd | 半導体メモリ素子 |
JPH073858B2 (ja) * | 1984-04-11 | 1995-01-18 | 株式会社日立製作所 | 半導体装置の製造方法 |
JPH0616549B2 (ja) * | 1984-04-17 | 1994-03-02 | 三菱電機株式会社 | 半導体集積回路装置 |
US4615102A (en) * | 1984-05-01 | 1986-10-07 | Fujitsu Limited | Method of producing enhancement mode and depletion mode FETs |
KR900000170B1 (ko) * | 1984-06-05 | 1990-01-23 | 가부시끼가이샤 도오시바 | 다이내믹형 메모리셀과 그 제조방법 |
DE3572422D1 (en) * | 1984-06-14 | 1989-09-21 | Ibm | Dynamic ram cell |
US4721987A (en) * | 1984-07-03 | 1988-01-26 | Texas Instruments Incorporated | Trench capacitor process for high density dynamic RAM |
JPH079944B2 (ja) * | 1984-07-30 | 1995-02-01 | 株式会社東芝 | 半導体メモリ装置 |
JPS6156445A (ja) * | 1984-08-28 | 1986-03-22 | Toshiba Corp | 半導体装置 |
JPS61135151A (ja) * | 1984-12-05 | 1986-06-23 | Mitsubishi Electric Corp | 半導体記憶装置 |
US4673962A (en) * | 1985-03-21 | 1987-06-16 | Texas Instruments Incorporated | Vertical DRAM cell and method |
US4686000A (en) * | 1985-04-02 | 1987-08-11 | Heath Barbara A | Self-aligned contact process |
JPS61258468A (ja) * | 1985-05-13 | 1986-11-15 | Hitachi Ltd | 半導体記憶装置およびその製造方法 |
JPS61280651A (ja) * | 1985-05-24 | 1986-12-11 | Fujitsu Ltd | 半導体記憶装置 |
JPS61289657A (ja) * | 1985-06-18 | 1986-12-19 | Toshiba Corp | 半導体記憶装置 |
JPS6251248A (ja) * | 1985-08-30 | 1987-03-05 | Toshiba Corp | 半導体装置の製造方法 |
JPS62136069A (ja) * | 1985-12-10 | 1987-06-19 | Hitachi Ltd | 半導体装置およびその製造方法 |
JPH0810755B2 (ja) * | 1986-10-22 | 1996-01-31 | 沖電気工業株式会社 | 半導体メモリの製造方法 |
JPH0793374B2 (ja) * | 1986-12-18 | 1995-10-09 | 沖電気工業株式会社 | Cmis型ダイナミツクメモリ装置 |
JPH0810757B2 (ja) * | 1987-05-25 | 1996-01-31 | 松下電子工業株式会社 | 半導体装置の製造方法 |
JPH0654801B2 (ja) * | 1987-07-13 | 1994-07-20 | 日本電気株式会社 | 半導体メモリセルおよびその製造方法 |
US5100823A (en) * | 1988-02-29 | 1992-03-31 | Motorola, Inc. | Method of making buried stacked transistor-capacitor |
US4964561A (en) * | 1989-06-12 | 1990-10-23 | Inland Container Corporation | Self-locking carton |
-
1989
- 1989-05-14 US US07/366,801 patent/US5057887A/en not_active Expired - Lifetime
-
1990
- 1990-05-10 EP EP90108796A patent/EP0401537B1/de not_active Expired - Lifetime
- 1990-05-10 DE DE69028245T patent/DE69028245T2/de not_active Expired - Fee Related
- 1990-05-12 KR KR1019900006792A patent/KR900019235A/ko not_active Application Discontinuation
- 1990-05-14 JP JP2123982A patent/JPH03129769A/ja active Pending
- 1990-05-14 CN CN90103572A patent/CN1051105A/zh active Pending
-
1993
- 1993-07-01 US US08/086,524 patent/US5364812A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1051105A (zh) | 1991-05-01 |
EP0401537B1 (de) | 1996-08-28 |
JPH03129769A (ja) | 1991-06-03 |
EP0401537A3 (de) | 1991-02-27 |
DE69028245T2 (de) | 1997-02-06 |
US5057887A (en) | 1991-10-15 |
US5364812A (en) | 1994-11-15 |
EP0401537A2 (de) | 1990-12-12 |
KR900019235A (ko) | 1990-12-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |