JPS5511365A - Semiconductor memory - Google Patents
Semiconductor memoryInfo
- Publication number
- JPS5511365A JPS5511365A JP8435478A JP8435478A JPS5511365A JP S5511365 A JPS5511365 A JP S5511365A JP 8435478 A JP8435478 A JP 8435478A JP 8435478 A JP8435478 A JP 8435478A JP S5511365 A JPS5511365 A JP S5511365A
- Authority
- JP
- Japan
- Prior art keywords
- film
- range
- recess
- substrate
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/37—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor being at least partially in a trench in the substrate
Landscapes
- Semiconductor Memories (AREA)
Abstract
PURPOSE:For increasing a capacity section in capacitance without increasing the size of cell surface, to provide in a semiconductor substrate a recess contacting with a source and drain range and a source range through the medium of insulating film. CONSTITUTION:An N-type source range 3 and a drain range 4 are diffusedly formed on an P-type Si substrate 1, and SiO2 film 10 is formed on the whole surface of said substrate 1. Next, plasma etching is made by using the mask of photo resist film 11 to form a deep recess 12 in said substrate 1 with the side faces of said range 3 exposed. Thereafter, said film 11 is removed. SiO2 film 2 is deposited on the exposed surface of said recess 12 and combined with said film 10, said film 10 located between said ranges 3 and 4 is decreased in thickness into a thin film 5, and a gate electrode 6 is fitted on said film 5. Next, an opening is provided in said film 10, a drain electrode 7 is fitted to connect with said range 4, and a polycrystalline Si capacity section electrode 8 is buried in said recess 12. Thereafter, thick film SiO2 film 13 is formed between said electrodes 6, 7 and 8, and electrodes 6', 7' and 8' are made by increasing said electrodes 6, 7 and 8 in volume.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8435478A JPS5511365A (en) | 1978-07-11 | 1978-07-11 | Semiconductor memory |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8435478A JPS5511365A (en) | 1978-07-11 | 1978-07-11 | Semiconductor memory |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5511365A true JPS5511365A (en) | 1980-01-26 |
Family
ID=13828171
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8435478A Pending JPS5511365A (en) | 1978-07-11 | 1978-07-11 | Semiconductor memory |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5511365A (en) |
Cited By (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62169362A (en) * | 1987-01-09 | 1987-07-25 | Agency Of Ind Science & Technol | Capacitor device |
US4721987A (en) * | 1984-07-03 | 1988-01-26 | Texas Instruments Incorporated | Trench capacitor process for high density dynamic RAM |
US4751557A (en) * | 1982-03-10 | 1988-06-14 | Hitachi, Ltd. | Dram with FET stacked over capacitor |
US4763180A (en) * | 1986-12-22 | 1988-08-09 | International Business Machines Corporation | Method and structure for a high density VMOS dynamic ram array |
JPH02354A (en) * | 1989-02-08 | 1990-01-05 | Hitachi Ltd | Large scale semiconductor memory and its manufacture |
JPH0295547U (en) * | 1988-06-13 | 1990-07-30 | ||
US4978634A (en) * | 1989-07-25 | 1990-12-18 | Texas Instruments, Incorporated | Method of making trench DRAM cell with stacked capacitor and buried lateral contact |
US5013676A (en) * | 1987-04-27 | 1991-05-07 | Nec Corporation | Structure of MIS-type field effect transistor and process of fabrication thereof |
US5017506A (en) * | 1989-07-25 | 1991-05-21 | Texas Instruments Incorporated | Method for fabricating a trench DRAM |
US5057887A (en) * | 1989-05-14 | 1991-10-15 | Texas Instruments Incorporated | High density dynamic ram cell |
US5102817A (en) * | 1985-03-21 | 1992-04-07 | Texas Instruments Incorporated | Vertical DRAM cell and method |
US5105245A (en) * | 1988-06-28 | 1992-04-14 | Texas Instruments Incorporated | Trench capacitor DRAM cell with diffused bit lines adjacent to a trench |
US5109259A (en) * | 1987-09-22 | 1992-04-28 | Texas Instruments Incorporated | Multiple DRAM cells in a trench |
US5111259A (en) * | 1989-07-25 | 1992-05-05 | Texas Instruments Incorporated | Trench capacitor memory cell with curved capacitors |
US5164917A (en) * | 1985-06-26 | 1992-11-17 | Texas Instruments Incorporated | Vertical one-transistor DRAM with enhanced capacitance and process for fabricating |
US5170234A (en) * | 1984-07-03 | 1992-12-08 | Texas Instruments Incorporated | High density dynamic RAM with trench capacitor |
US5208657A (en) * | 1984-08-31 | 1993-05-04 | Texas Instruments Incorporated | DRAM Cell with trench capacitor and vertical channel in substrate |
US5225363A (en) * | 1988-06-28 | 1993-07-06 | Texas Instruments Incorporated | Trench capacitor DRAM cell and method of manufacture |
US5273648A (en) * | 1992-07-15 | 1993-12-28 | Caiozza Joseph C | Filter cartridge magnetic belt |
US5354462A (en) * | 1992-04-10 | 1994-10-11 | Shane Marie Owen | Magnetic filter strap |
US5714063A (en) * | 1996-05-28 | 1998-02-03 | Brunsting; William J. | Apparatus for the removal of ferrous particles from liquids |
-
1978
- 1978-07-11 JP JP8435478A patent/JPS5511365A/en active Pending
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4751557A (en) * | 1982-03-10 | 1988-06-14 | Hitachi, Ltd. | Dram with FET stacked over capacitor |
US4721987A (en) * | 1984-07-03 | 1988-01-26 | Texas Instruments Incorporated | Trench capacitor process for high density dynamic RAM |
US5374580A (en) * | 1984-07-03 | 1994-12-20 | Texas Instruments Incorporated | Method of forming high density DRAM having increased capacitance area due to trench etched into storage capacitor region |
US5170234A (en) * | 1984-07-03 | 1992-12-08 | Texas Instruments Incorporated | High density dynamic RAM with trench capacitor |
US5208657A (en) * | 1984-08-31 | 1993-05-04 | Texas Instruments Incorporated | DRAM Cell with trench capacitor and vertical channel in substrate |
US5102817A (en) * | 1985-03-21 | 1992-04-07 | Texas Instruments Incorporated | Vertical DRAM cell and method |
US5164917A (en) * | 1985-06-26 | 1992-11-17 | Texas Instruments Incorporated | Vertical one-transistor DRAM with enhanced capacitance and process for fabricating |
US4763180A (en) * | 1986-12-22 | 1988-08-09 | International Business Machines Corporation | Method and structure for a high density VMOS dynamic ram array |
JPS62169362A (en) * | 1987-01-09 | 1987-07-25 | Agency Of Ind Science & Technol | Capacitor device |
US5013676A (en) * | 1987-04-27 | 1991-05-07 | Nec Corporation | Structure of MIS-type field effect transistor and process of fabrication thereof |
US5109259A (en) * | 1987-09-22 | 1992-04-28 | Texas Instruments Incorporated | Multiple DRAM cells in a trench |
JPH0295547U (en) * | 1988-06-13 | 1990-07-30 | ||
US5105245A (en) * | 1988-06-28 | 1992-04-14 | Texas Instruments Incorporated | Trench capacitor DRAM cell with diffused bit lines adjacent to a trench |
US5225363A (en) * | 1988-06-28 | 1993-07-06 | Texas Instruments Incorporated | Trench capacitor DRAM cell and method of manufacture |
JPH0426788B2 (en) * | 1989-02-08 | 1992-05-08 | Hitachi Ltd | |
JPH02354A (en) * | 1989-02-08 | 1990-01-05 | Hitachi Ltd | Large scale semiconductor memory and its manufacture |
US5057887A (en) * | 1989-05-14 | 1991-10-15 | Texas Instruments Incorporated | High density dynamic ram cell |
US5111259A (en) * | 1989-07-25 | 1992-05-05 | Texas Instruments Incorporated | Trench capacitor memory cell with curved capacitors |
US4978634A (en) * | 1989-07-25 | 1990-12-18 | Texas Instruments, Incorporated | Method of making trench DRAM cell with stacked capacitor and buried lateral contact |
US5017506A (en) * | 1989-07-25 | 1991-05-21 | Texas Instruments Incorporated | Method for fabricating a trench DRAM |
US5354462A (en) * | 1992-04-10 | 1994-10-11 | Shane Marie Owen | Magnetic filter strap |
US5273648A (en) * | 1992-07-15 | 1993-12-28 | Caiozza Joseph C | Filter cartridge magnetic belt |
US5714063A (en) * | 1996-05-28 | 1998-02-03 | Brunsting; William J. | Apparatus for the removal of ferrous particles from liquids |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5511365A (en) | Semiconductor memory | |
JPS5681968A (en) | Manufacture of semiconductor device | |
KR900001045A (en) | Stacked Capacitor DRAM Cells and Manufacturing Method Thereof | |
KR910006977A (en) | Dram cell having structure of separate merged groove and manufacturing method | |
JPS56125868A (en) | Thin-film semiconductor device | |
JPS56107571A (en) | Semiconductor memory storage device | |
JPS57137847A (en) | Chemically sensitive element and its preparation | |
JPS54102982A (en) | Charge transfer type semiconductor device | |
JPS5567161A (en) | Semiconductor memory storage | |
JPS54143076A (en) | Semiconductor device and its manufacture | |
JPS57100760A (en) | Manufacture of semiconductor device | |
JPS56133844A (en) | Semiconductor device | |
KR910010748A (en) | Multilayer Capacitor and Manufacturing Method | |
JPS55154759A (en) | Manufacture of semiconductor memory device | |
JPS5451383A (en) | Production of semiconductor element | |
JPS5565456A (en) | Manufacture of semiconductor device | |
JPS558062A (en) | Manufacture of semiconductor | |
JPS6447068A (en) | Semiconductor integrated circuit device and manufacture thereof | |
JPS5555557A (en) | Dynamic memory cell | |
JPS5664467A (en) | Mos type semiconductor device | |
JPS5492180A (en) | Manufacture of semiconductor device | |
JPS5453869A (en) | Semiconductor device | |
JPS5778181A (en) | Semiconductor variable capacity element | |
JPS56150857A (en) | Dynamic memory device | |
KR910020902A (en) | DRAM Cell Manufacturing Method |