DE68926645D1 - Halbleiteranordnung und Verfahren zu ihrer Herstellung - Google Patents
Halbleiteranordnung und Verfahren zu ihrer HerstellungInfo
- Publication number
- DE68926645D1 DE68926645D1 DE68926645T DE68926645T DE68926645D1 DE 68926645 D1 DE68926645 D1 DE 68926645D1 DE 68926645 T DE68926645 T DE 68926645T DE 68926645 T DE68926645 T DE 68926645T DE 68926645 D1 DE68926645 D1 DE 68926645D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacture
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/15747—Copper [Cu] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/243,363 US5001545A (en) | 1988-09-09 | 1988-09-09 | Formed top contact for non-flat semiconductor devices |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68926645D1 true DE68926645D1 (de) | 1996-07-18 |
DE68926645T2 DE68926645T2 (de) | 1997-01-16 |
Family
ID=22918463
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68926645T Expired - Fee Related DE68926645T2 (de) | 1988-09-09 | 1989-08-28 | Halbleiteranordnung und Verfahren zu ihrer Herstellung |
Country Status (7)
Country | Link |
---|---|
US (1) | US5001545A (de) |
EP (1) | EP0358077B1 (de) |
JP (1) | JP2978510B2 (de) |
KR (1) | KR0139540B1 (de) |
CN (1) | CN1016298B (de) |
DE (1) | DE68926645T2 (de) |
MY (1) | MY104177A (de) |
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US5403785A (en) * | 1991-03-03 | 1995-04-04 | Matsushita Electric Works, Ltd. | Process of fabrication IC chip package from an IC chip carrier substrate and a leadframe and the IC chip package fabricated thereby |
US5319242A (en) * | 1992-03-18 | 1994-06-07 | Motorola, Inc. | Semiconductor package having an exposed die surface |
JP2708320B2 (ja) * | 1992-04-17 | 1998-02-04 | 三菱電機株式会社 | マルチチップ型半導体装置及びその製造方法 |
US5404265A (en) * | 1992-08-28 | 1995-04-04 | Fujitsu Limited | Interconnect capacitors |
US6205654B1 (en) * | 1992-12-11 | 2001-03-27 | Staktek Group L.P. | Method of manufacturing a surface mount package |
US5484959A (en) * | 1992-12-11 | 1996-01-16 | Staktek Corporation | High density lead-on-package fabrication method and apparatus |
US5341979A (en) * | 1993-09-03 | 1994-08-30 | Motorola, Inc. | Method of bonding a semiconductor substrate to a support substrate and structure therefore |
JP2833996B2 (ja) * | 1994-05-25 | 1998-12-09 | 日本電気株式会社 | フレキシブルフィルム及びこれを有する半導体装置 |
FR2742000B1 (fr) * | 1995-11-30 | 1998-04-24 | Sgs Thomson Microelectronics | Composant semiconducteur a montage par brasure |
US5830781A (en) * | 1997-04-22 | 1998-11-03 | General Instrument Corp. | Semiconductor device soldering process |
US6572387B2 (en) | 1999-09-24 | 2003-06-03 | Staktek Group, L.P. | Flexible circuit connector for stacked chip module |
JP2001237358A (ja) * | 2000-02-21 | 2001-08-31 | Rohm Co Ltd | パッケージ型二端子半導体装置の構造 |
FR2811475B1 (fr) * | 2000-07-07 | 2002-08-23 | Alstom | Procede de fabrication d'un composant electronique de puissance, et composant electronique de puissance ainsi obtenu |
US6608763B1 (en) | 2000-09-15 | 2003-08-19 | Staktek Group L.P. | Stacking system and method |
US6462408B1 (en) | 2001-03-27 | 2002-10-08 | Staktek Group, L.P. | Contact member stacking system and method |
JP2004111745A (ja) * | 2002-09-19 | 2004-04-08 | Toshiba Corp | 半導体装置 |
US20060255455A1 (en) * | 2005-05-13 | 2006-11-16 | Stmicroelectronics, Inc. | Reliability and improved frequency response package for extremely high power density transistors |
US7285849B2 (en) * | 2005-11-18 | 2007-10-23 | Fairchild Semiconductor Corporation | Semiconductor die package using leadframe and clip and method of manufacturing |
JP5018013B2 (ja) * | 2006-10-25 | 2012-09-05 | 富士電機株式会社 | 樹脂封止半導体装置 |
US8018042B2 (en) * | 2007-03-23 | 2011-09-13 | Microsemi Corporation | Integrated circuit with flexible planar leads |
JP5863602B2 (ja) * | 2011-08-31 | 2016-02-16 | 三菱電機株式会社 | 電力用半導体装置 |
DE102011086687A1 (de) * | 2011-11-21 | 2013-05-23 | Robert Bosch Gmbh | Verfahren zum Kontaktieren eines Halbleiters und Kontaktanordnung für einen Halbleiter |
JP5800778B2 (ja) * | 2011-11-25 | 2015-10-28 | 三菱電機株式会社 | 接合方法および半導体装置の製造方法 |
JP5653974B2 (ja) * | 2012-08-01 | 2015-01-14 | ローム株式会社 | パッケージ型二端子半導体装置 |
US8871572B2 (en) * | 2012-12-20 | 2014-10-28 | Intersil Americas LLC | Lead frame having a perimeter recess within periphery of component terminal |
JP6239840B2 (ja) * | 2013-03-27 | 2017-11-29 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
CN207038515U (zh) * | 2014-10-30 | 2018-02-23 | 三菱电机株式会社 | 半导体装置 |
JP6316221B2 (ja) * | 2015-01-30 | 2018-04-25 | 三菱電機株式会社 | 半導体装置 |
JP6394489B2 (ja) * | 2015-05-11 | 2018-09-26 | 株式会社デンソー | 半導体装置 |
JP2017079228A (ja) * | 2015-10-19 | 2017-04-27 | 株式会社三社電機製作所 | 半導体素子用端子 |
US10825757B2 (en) * | 2016-12-19 | 2020-11-03 | Nexperia B.V. | Semiconductor device and method with clip arrangement in IC package |
KR20190108163A (ko) | 2017-02-20 | 2019-09-23 | 신덴겐코교 가부시키가이샤 | 전자 장치 및 접속자 |
US10910292B2 (en) | 2017-02-20 | 2021-02-02 | Shindengen Electric Manufacturing Co., Ltd. | Electronic device and connection body |
US11309232B2 (en) * | 2017-10-26 | 2022-04-19 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor device |
JP6417462B2 (ja) * | 2017-11-02 | 2018-11-07 | ローム株式会社 | 半導体装置 |
WO2019167102A1 (ja) * | 2018-02-27 | 2019-09-06 | 新電元工業株式会社 | 半導体装置及び半導体装置の製造方法 |
DE102018130147A1 (de) | 2018-11-28 | 2020-05-28 | Infineon Technologies Ag | Halbleitervorrichtung und verfahren zum herstellen einer halbleitervorrichtung |
US11557564B2 (en) * | 2019-04-08 | 2023-01-17 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor device |
DE102019134680A1 (de) * | 2019-12-17 | 2021-06-17 | Kme Germany Gmbh | Verfahren zur Herstellung eines Lotdepots sowie Lotdepot |
JP2021141235A (ja) * | 2020-03-06 | 2021-09-16 | 株式会社東芝 | 半導体装置 |
CN115295510A (zh) * | 2022-09-06 | 2022-11-04 | 日月新半导体(威海)有限公司 | 半导体分立器件封装件 |
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US3290564A (en) * | 1963-02-26 | 1966-12-06 | Texas Instruments Inc | Semiconductor device |
DE1614364C3 (de) * | 1966-06-01 | 1979-04-05 | Rca Corp., New York, N.Y. (V.St.A.) | Verfahren zur Montage eines Halbleiter-Kristallelementes |
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US3569797A (en) * | 1969-03-12 | 1971-03-09 | Bendix Corp | Semiconductor device with preassembled mounting |
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US4012765A (en) * | 1975-09-24 | 1977-03-15 | Motorola, Inc. | Lead frame for plastic encapsulated semiconductor assemblies |
US4117508A (en) * | 1977-03-21 | 1978-09-26 | General Electric Company | Pressurizable semiconductor pellet assembly |
US4158745A (en) * | 1977-10-27 | 1979-06-19 | Amp Incorporated | Lead frame having integral terminal tabs |
US4346396A (en) * | 1979-03-12 | 1982-08-24 | Western Electric Co., Inc. | Electronic device assembly and methods of making same |
JPS5619627A (en) * | 1979-07-25 | 1981-02-24 | Mitsubishi Electric Corp | Assembly of semiconductor device |
JPS5627941A (en) * | 1979-08-17 | 1981-03-18 | Hitachi Ltd | Manufacture of semiconductor device |
US4252864A (en) * | 1979-11-05 | 1981-02-24 | Amp Incorporated | Lead frame having integral terminal tabs |
US4616412A (en) * | 1981-01-13 | 1986-10-14 | Schroeder Jon M | Method for bonding electrical leads to electronic devices |
US4626478A (en) * | 1984-03-22 | 1986-12-02 | Unitrode Corporation | Electronic circuit device components having integral spacers providing uniform thickness bonding film |
US4631820A (en) * | 1984-08-23 | 1986-12-30 | Canon Kabushiki Kaisha | Mounting assembly and mounting method for an electronic component |
JPH0719865B2 (ja) * | 1985-04-10 | 1995-03-06 | 九州日立マクセル株式会社 | 半導体装置のリ−ドフレ−ム製造方法 |
DE3528427A1 (de) * | 1985-08-08 | 1987-04-02 | Bbc Brown Boveri & Cie | Elektrische verbindungslasche fuer halbleiterbauelemente |
JPH0438524Y2 (de) * | 1986-12-19 | 1992-09-09 | ||
US4862249A (en) * | 1987-04-17 | 1989-08-29 | Xoc Devices, Inc. | Packaging system for stacking integrated circuits |
US4827376A (en) * | 1987-10-05 | 1989-05-02 | Olin Corporation | Heat dissipating interconnect tape for use in tape automated bonding |
-
1988
- 1988-09-09 US US07/243,363 patent/US5001545A/en not_active Expired - Lifetime
-
1989
- 1989-08-24 MY MYPI89001162A patent/MY104177A/en unknown
- 1989-08-28 EP EP89115822A patent/EP0358077B1/de not_active Expired - Lifetime
- 1989-08-28 DE DE68926645T patent/DE68926645T2/de not_active Expired - Fee Related
- 1989-09-08 CN CN89106991A patent/CN1016298B/zh not_active Expired
- 1989-09-08 JP JP1231825A patent/JP2978510B2/ja not_active Expired - Lifetime
- 1989-09-08 KR KR1019890013004A patent/KR0139540B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
MY104177A (en) | 1994-02-28 |
KR0139540B1 (ko) | 1998-06-01 |
CN1041067A (zh) | 1990-04-04 |
CN1016298B (zh) | 1992-04-15 |
KR900005587A (ko) | 1990-04-14 |
EP0358077B1 (de) | 1996-06-12 |
JPH02126659A (ja) | 1990-05-15 |
US5001545A (en) | 1991-03-19 |
DE68926645T2 (de) | 1997-01-16 |
EP0358077A3 (de) | 1991-04-03 |
JP2978510B2 (ja) | 1999-11-15 |
EP0358077A2 (de) | 1990-03-14 |
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8327 | Change in the person/name/address of the patent owner |
Owner name: SEMICONDUCTOR COMPONENTS INDUSTRIES L.L.C. (N.D.GE |
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8339 | Ceased/non-payment of the annual fee |