DE68920571D1 - Halbleiterlaser-Vorrichtung und Verfahren zu ihrer Herstellung. - Google Patents

Halbleiterlaser-Vorrichtung und Verfahren zu ihrer Herstellung.

Info

Publication number
DE68920571D1
DE68920571D1 DE68920571T DE68920571T DE68920571D1 DE 68920571 D1 DE68920571 D1 DE 68920571D1 DE 68920571 T DE68920571 T DE 68920571T DE 68920571 T DE68920571 T DE 68920571T DE 68920571 D1 DE68920571 D1 DE 68920571D1
Authority
DE
Germany
Prior art keywords
production
semiconductor laser
laser device
semiconductor
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68920571T
Other languages
English (en)
Other versions
DE68920571T2 (de
Inventor
Hitoshi C O Mitsubishi Kagawa
Tetsuya C O Mitsubishi De Yagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of DE68920571D1 publication Critical patent/DE68920571D1/de
Publication of DE68920571T2 publication Critical patent/DE68920571T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/223—Buried stripe structure
    • H01S5/2231—Buried stripe structure with inner confining structure only between the active layer and the upper electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
    • H01S5/1231—Grating growth or overgrowth details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
    • H01S5/2206—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers based on III-V materials
    • H01S5/221—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers based on III-V materials containing aluminium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
    • H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/072—Heterojunctions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/095—Laser devices

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Semiconductor Lasers (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
DE68920571T 1989-04-06 1989-07-28 Halbleiterlaser-Vorrichtung und Verfahren zu ihrer Herstellung. Expired - Fee Related DE68920571T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1088708A JPH0719931B2 (ja) 1989-04-06 1989-04-06 半導体レーザ装置およびその製造方法

Publications (2)

Publication Number Publication Date
DE68920571D1 true DE68920571D1 (de) 1995-02-23
DE68920571T2 DE68920571T2 (de) 1995-05-18

Family

ID=13950393

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68920571T Expired - Fee Related DE68920571T2 (de) 1989-04-06 1989-07-28 Halbleiterlaser-Vorrichtung und Verfahren zu ihrer Herstellung.

Country Status (4)

Country Link
US (2) US4984243A (de)
EP (1) EP0390995B1 (de)
JP (1) JPH0719931B2 (de)
DE (1) DE68920571T2 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH088394B2 (ja) * 1989-06-30 1996-01-29 三菱電機株式会社 半導体レーザおよびその製造方法
JPH03293790A (ja) * 1990-04-11 1991-12-25 Eastman Kodak Japan Kk 広ストライプ型レーザダイオード
US5268328A (en) * 1990-09-07 1993-12-07 Matsushita Electric Industrial Co., Ltd. Method of fabricating a semiconductor laser
DE69115808T2 (de) * 1990-09-10 1996-06-20 Sharp Kk Halbleiterlaser mit verteilter Rückkopplung und Verfahren zu seiner Herstellung
JP2706369B2 (ja) * 1990-11-26 1998-01-28 シャープ株式会社 化合物半導体の成長方法及び半導体レーザの製造方法
EP0526128B1 (de) * 1991-07-24 1997-06-11 Sharp Kabushiki Kaisha Verfahren zur Herstellung eines Halbleiterlasers mit verteilter Rückkoppelung
US5346855A (en) * 1993-01-19 1994-09-13 At&T Bell Laboratories Method of making an INP-based DFB laser
EP0627799B1 (de) * 1993-06-04 1997-10-08 Sharp Kabushiki Kaisha Lichtmittierende Halbleitervorrichtung mit einer dritten Begrenzungsschicht
US5398641A (en) * 1993-07-27 1995-03-21 Texas Instruments Incorporated Method for p-type doping of semiconductor structures formed of group II and group VI elements
JPH07154024A (ja) * 1993-11-30 1995-06-16 Fuji Photo Film Co Ltd 半導体レーザー
US6194240B1 (en) * 1993-12-21 2001-02-27 Lucent Technologies Inc. Method for fabrication of wavelength selective electro-optic grating for DFB/DBR lasers
JPH07183618A (ja) * 1993-12-22 1995-07-21 Ricoh Co Ltd 半導体レーザ装置、半導体レーザ装置製造方法並びに集積型半導体レーザ装置
JPH0888439A (ja) * 1994-09-16 1996-04-02 Rohm Co Ltd 半導体レーザおよびその製法
CA2249053A1 (en) * 1997-09-30 1999-03-30 Mitsui Chemicals, Incorporated Semiconductor laser device
JP4079393B2 (ja) * 1998-03-10 2008-04-23 シャープ株式会社 窒化物系化合物半導体レーザ素子及びその製造方法
JP2000323789A (ja) * 1999-05-11 2000-11-24 Nec Corp 窓型半導体レーザおよびその製造方法
US7050472B2 (en) 2000-03-01 2006-05-23 Matsushita Electric Industrial Co., Ltd. Semiconductor laser device and method for manufacturing the same
US6747259B1 (en) 2000-10-03 2004-06-08 Xerox Corporation Assembly of imaging arrays for large format documents
JP2003133638A (ja) * 2001-08-14 2003-05-09 Furukawa Electric Co Ltd:The 分布帰還型半導体レーザ素子及びレーザモジュール
US7369863B2 (en) * 2001-11-30 2008-05-06 Siemens Aktiengesellschaft Positional data recording
JP2006190782A (ja) * 2005-01-05 2006-07-20 Fujitsu Ltd 光半導体装置及びその製造方法
JP2006202935A (ja) * 2005-01-20 2006-08-03 Nec Corp 半導体レーザ及びその製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4178604A (en) * 1973-10-05 1979-12-11 Hitachi, Ltd. Semiconductor laser device
JPS594190A (ja) * 1982-06-30 1984-01-10 Fujitsu Ltd 半導体発光装置
JPS5946081A (ja) * 1982-09-09 1984-03-15 Nippon Telegr & Teleph Corp <Ntt> 周期構造を有する埋込形半導体レ−ザ
JPS59103393A (ja) * 1982-12-06 1984-06-14 Agency Of Ind Science & Technol 半導体レ−ザの製造方法
JPS59229889A (ja) * 1983-06-13 1984-12-24 Agency Of Ind Science & Technol 半導体レ−ザ製造方法
JPS603178A (ja) * 1983-06-21 1985-01-09 Toshiba Corp 半導体レ−ザ装置
JPS6066484A (ja) * 1983-09-22 1985-04-16 Toshiba Corp 半導体レ−ザ装置及びその製造方法
JPS60192380A (ja) * 1984-03-13 1985-09-30 Mitsubishi Electric Corp 半導体レ−ザ装置
DE3437209A1 (de) * 1984-10-10 1986-04-17 Siemens AG, 1000 Berlin und 8000 München Verbesserung zu einem monomoden-diodenlaser
US4837775A (en) * 1985-10-21 1989-06-06 General Electric Company Electro-optic device having a laterally varying region
US4845014A (en) * 1985-10-21 1989-07-04 Rca Corporation Method of forming a channel
JPS63140591A (ja) * 1986-12-02 1988-06-13 Mitsubishi Electric Corp 半導体レ−ザ装置の製造方法
JPS63166285A (ja) * 1986-12-26 1988-07-09 Toshiba Corp 半導体発光装置の製造方法
JP2768940B2 (ja) * 1987-07-08 1998-06-25 三菱電機株式会社 単一波長発振半導体レーザ装置
JPH073909B2 (ja) * 1987-09-08 1995-01-18 三菱電機株式会社 半導体レーザの製造方法

Also Published As

Publication number Publication date
DE68920571T2 (de) 1995-05-18
US4984243A (en) 1991-01-08
JPH0719931B2 (ja) 1995-03-06
EP0390995B1 (de) 1995-01-11
JPH02266583A (ja) 1990-10-31
US5079185A (en) 1992-01-07
EP0390995A2 (de) 1990-10-10
EP0390995A3 (de) 1991-05-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee