DE60320004D1 - Harzzusammensetzung für leiterplatte und lack, prepreg und metallplattiertes laminat unter verwendung davon - Google Patents

Harzzusammensetzung für leiterplatte und lack, prepreg und metallplattiertes laminat unter verwendung davon

Info

Publication number
DE60320004D1
DE60320004D1 DE60320004T DE60320004T DE60320004D1 DE 60320004 D1 DE60320004 D1 DE 60320004D1 DE 60320004 T DE60320004 T DE 60320004T DE 60320004 T DE60320004 T DE 60320004T DE 60320004 D1 DE60320004 D1 DE 60320004D1
Authority
DE
Germany
Prior art keywords
prepreg
resin composition
pcb
paint
metal plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60320004T
Other languages
English (en)
Other versions
DE60320004T2 (de
Inventor
Yasuyuki Mizuno
Daisuke Fujimoto
Hiroshi Shimizu
Kazuhito Kobayashi
Takayuki Sueyoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of DE60320004D1 publication Critical patent/DE60320004D1/de
Application granted granted Critical
Publication of DE60320004T2 publication Critical patent/DE60320004T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0638—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
    • C08G73/065—Preparatory processes
    • C08G73/0655—Preparatory processes from polycyanurates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2363/00—Epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
DE60320004T 2002-09-30 2003-09-29 Harzzusammensetzung für leiterplatte und lack, prepreg und metallplattiertes laminat unter verwendung davon Expired - Lifetime DE60320004T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002286878 2002-09-30
JP2002287071 2002-09-30
JP2002287071 2002-09-30
JP2002286878 2002-09-30
PCT/JP2003/012399 WO2004029127A1 (ja) 2002-09-30 2003-09-29 印刷配線板用樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板

Publications (2)

Publication Number Publication Date
DE60320004D1 true DE60320004D1 (de) 2008-05-08
DE60320004T2 DE60320004T2 (de) 2009-04-16

Family

ID=32044657

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60320004T Expired - Lifetime DE60320004T2 (de) 2002-09-30 2003-09-29 Harzzusammensetzung für leiterplatte und lack, prepreg und metallplattiertes laminat unter verwendung davon

Country Status (10)

Country Link
US (1) US7816430B2 (de)
EP (1) EP1550678B1 (de)
JP (5) JP4639806B2 (de)
KR (2) KR20100094586A (de)
CN (1) CN100528927C (de)
AT (1) ATE390450T1 (de)
AU (1) AU2003266671A1 (de)
DE (1) DE60320004T2 (de)
TW (1) TWI235020B (de)
WO (1) WO2004029127A1 (de)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100094586A (ko) * 2002-09-30 2010-08-26 히다치 가세고교 가부시끼가이샤 인쇄 배선판용 수지 조성물, 및 이것을 사용한 와니스, 프리프레그 및 금속 피복 적층판
KR100561070B1 (ko) * 2003-09-05 2006-03-15 주식회사 엘지화학 고속전송 회로기판용 열경화성 수지 조성물
US20050186434A1 (en) * 2004-01-28 2005-08-25 Ajinomoto Co., Inc. Thermosetting resin composition, adhesive film and multilayer printed wiring board using same
TW200602427A (en) * 2004-03-30 2006-01-16 Taiyo Ink Mfg Co Ltd Thermosetting resin composition and multilayered printed wiring board comprising the same
JP2006131743A (ja) * 2004-11-05 2006-05-25 Hitachi Chem Co Ltd 熱硬化性樹脂組成物及びそれを用いたプリプレグ、金属張積層板、プリント配線板
JP5335683B2 (ja) * 2007-09-27 2013-11-06 パナソニック株式会社 エポキシ樹脂組成物、そのエポキシ樹脂組成物を用いたプリプレグ、金属張積層板、及びプリント配線板
WO2009040921A1 (ja) * 2007-09-27 2009-04-02 Panasonic Electric Works Co., Ltd. エポキシ樹脂組成物、そのエポキシ樹脂組成物を用いたプリプレグ及び金属張積層板
JP5428212B2 (ja) * 2008-06-17 2014-02-26 住友ベークライト株式会社 樹脂組成物、プリプレグおよびそれを用いたプリント配線板
KR101109397B1 (ko) * 2009-07-17 2012-01-30 삼성전기주식회사 인쇄회로기판용 수지 조성물 및 이를 이용한 인쇄회로기판
JP5861995B2 (ja) * 2010-07-05 2016-02-16 住友ベークライト株式会社 樹脂組成物、プリプレグ、樹脂層、回路基板および半導体装置
US10155835B2 (en) 2011-08-09 2018-12-18 Mitsubishi Gas Chemical Company, Inc. Cyanate ester compound and method for producing the same, and curable resin composition comprising the compound, and cured product thereof composition
US8889770B2 (en) 2011-08-25 2014-11-18 Chemtura Corporation Brominated flame retardant, antimony oxide free polymer formulations
US10865332B2 (en) * 2011-09-29 2020-12-15 Showa Denko Materials Co., Ltd. Epoxy resin composition and electronic component device
CN103131130B (zh) * 2011-11-22 2015-01-21 台光电子材料股份有限公司 环氧树脂组成物及应用其的低介电常数绝缘材料
SG11201402889YA (en) 2011-12-07 2014-11-27 Mitsubishi Gas Chemical Co Resin composition, prepreg, and laminate
CN104011163A (zh) * 2011-12-12 2014-08-27 株式会社Lg化学 用于制造电路板的氰酸酯树脂组合物以及含有其的柔性覆金属层压制品
US9670362B2 (en) * 2011-12-29 2017-06-06 Shengyi Technology Co., Ltd. Thermoset resin composition, and prepreg and laminate for printed circuit board manufactured therefrom
CN103319853B (zh) * 2012-03-23 2016-01-13 台光电子材料股份有限公司 绝缘膜用树脂组成物及含有其的绝缘膜、电路板
US9247636B2 (en) * 2013-03-12 2016-01-26 International Business Machines Corporation Area array device connection structures with complimentary warp characteristics
JP6156075B2 (ja) * 2013-05-17 2017-07-05 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、樹脂シート、金属箔張積層板及びプリント配線板
JP5881179B2 (ja) * 2013-08-28 2016-03-09 信越化学工業株式会社 半導体封止用樹脂組成物及びその硬化物を備えた半導体装置
KR101556658B1 (ko) * 2013-11-26 2015-10-01 주식회사 두산 내열성 및 저유전 손실 특성을 가진 열경화성 수지 조성물, 이를 이용한 프리프레그, 및 동박적층판
DE102014101413A1 (de) * 2014-02-05 2015-08-06 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Chemisch Abbaubares Epoxidharzsystem
DE102014106885B4 (de) * 2014-05-15 2022-01-20 Pictiva Displays International Limited Verfahren zur Herstellung einer Isolatorschicht, Verfahren zur Herstellung eines organischen optoelektronischen Bauelements umfassend eine Isolatorschicht und organisches optoelektronisches Bauelement umfassend eine Isolatorschicht
US9879163B2 (en) 2014-06-06 2018-01-30 General Electric Company Composition for bonding windings or core laminates in an electrical machine, and associated method
US9911521B2 (en) 2014-06-06 2018-03-06 General Electric Company Curable composition for electrical machine, and associated method
CN106687869B (zh) * 2014-09-10 2019-04-16 佳能株式会社 电子照相用导电性构件和季铵盐
CN107207834B (zh) * 2015-01-30 2018-05-29 三菱瓦斯化学株式会社 印刷电路板用树脂组合物、预浸料、覆金属箔层叠板、树脂片和印刷电路板
JP6631834B2 (ja) * 2016-01-26 2020-01-15 パナソニックＩｐマネジメント株式会社 金属張積層板、樹脂付き金属部材、及び配線板
CN107325277B (zh) * 2016-04-28 2020-01-03 江苏和成新材料有限公司 聚苯醚树脂及其应用
CN106700475B (zh) * 2016-12-28 2019-03-19 广东生益科技股份有限公司 一种阻燃的聚苯醚树脂组合物
TWI656158B (zh) * 2017-12-25 2019-04-11 聯茂電子股份有限公司 樹脂組合物、膠片、與銅箔基板
CN110628310A (zh) * 2018-06-22 2019-12-31 联茂电子股份有限公司 多层结构与基板
JP7364243B2 (ja) 2018-12-04 2023-10-18 ナミックス株式会社 ミリ波基板用樹脂組成物、ミリ波基板用接着フィルム、ミリ波基板、ミリ波レーダー基板および半導体装置
CN114685944B (zh) * 2020-12-28 2024-01-30 陕西生益科技有限公司 一种热固性树脂组合物、包含其的预浸料、层压板及印制电路板
JP7469748B1 (ja) 2023-07-27 2024-04-17 三菱瓦斯化学株式会社 シアン酸エステル化合物及びその製造方法、樹脂組成物、並びに硬化物
JP7469747B1 (ja) 2023-07-27 2024-04-17 三菱瓦斯化学株式会社 シアン酸エステル化合物及びその製造方法、樹脂組成物、並びに硬化物

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57143320A (en) * 1981-02-28 1982-09-04 Mitsubishi Gas Chem Co Inc Novel curable resin composition
US4477629A (en) 1983-07-27 1984-10-16 The Dow Chemical Company Cyanate-containing polymers
KR100272785B1 (ko) 1995-06-27 2000-11-15 우찌가사끼 이사오 인쇄배선판용프리프래그,수지니스,수지조성물및상기물질을사용하여제조된인쇄배선판용적층판
JP3019758B2 (ja) 1995-10-02 2000-03-13 信越化学工業株式会社 熱硬化性樹脂組成物
TW462922B (en) 1996-03-21 2001-11-11 Hitachi Chemical Co Ltd Copper-clad laminate, multilayer copper-clad laminate and process for producing the same
DE69807793T2 (de) * 1997-07-04 2003-08-14 Hitachi Chemical Co., Ltd. Mit einem Cyanatester modifizierte härtbare Harzzusammensetzung und daraus hergestellter Lack, Prepreg, mit Metall bedeckte Schichtplatte, Film, gedruckte Leiterplatte und Mehrschichtleiterplatte
JP3261076B2 (ja) * 1997-07-04 2002-02-25 日立化成工業株式会社 積層板用変性シアネートエステル系硬化性樹脂組成物並びにこれを用いたプリプレグ及び積層板
JPH11106613A (ja) * 1997-10-08 1999-04-20 Hitachi Chem Co Ltd 印刷配線板用樹脂組成物及びそれを用いた印刷配線板
JPH11228806A (ja) * 1998-02-18 1999-08-24 Hitachi Chem Co Ltd シアネートエステル樹脂組成物及びその製造方法
JP2000191776A (ja) * 1998-12-24 2000-07-11 Mitsubishi Gas Chem Co Inc シアン酸エステル・コ−プレポリマー
JP2000336188A (ja) * 1999-03-23 2000-12-05 Hitachi Chem Co Ltd プリプレグ及び積層板
JP2000319509A (ja) * 1999-05-14 2000-11-21 Hitachi Chem Co Ltd 難燃性樹脂組成物の製造方法及び積層板
JP2001048982A (ja) * 1999-08-09 2001-02-20 Mitsubishi Gas Chem Co Inc 感光性樹脂。
JP2001172473A (ja) * 1999-10-07 2001-06-26 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
JP2001240723A (ja) * 1999-12-22 2001-09-04 Hitachi Chem Co Ltd 熱硬化性樹脂組成物並びにそれを用いたプリプレグ、金属張積層板及び印刷配線板
EP1275696B1 (de) * 2000-03-21 2007-11-14 Hitachi Chemical Co., Ltd. Harzzusammensetzung mit exzellentem dielektrischem verhalten, verfahren zur herstellung einer harzzusammensetzung, mit der zusammensetzung hergestellter lack, verfahren zur herstellung des lacks, mit dem lack hergestellte schichtplatten sowie metallbeschichtetes laminat
JP4872160B2 (ja) * 2000-03-21 2012-02-08 日立化成工業株式会社 誘電特性に優れる樹脂組成物並びにこれを用いて作製されるワニス、ワニスの製造方法、プリプレグ及び金属張積層板
JP2002194121A (ja) * 2000-12-26 2002-07-10 Mitsubishi Gas Chem Co Inc プリプレグ及び金属箔張り積層板
JP4738622B2 (ja) * 2001-04-13 2011-08-03 住友ベークライト株式会社 耐熱性樹脂組成物、これを用いたプリプレグ及び積層板
US7022777B2 (en) * 2001-06-28 2006-04-04 General Electric Moldable poly(arylene ether) thermosetting compositions, methods, and articles
KR100618511B1 (ko) * 2002-03-05 2006-08-31 히다치 가세고교 가부시끼가이샤 수지 부착 금속박, 금속 피복 적층판, 그를 이용한 프린트배선판 및 그의 제조 방법
KR20100094586A (ko) * 2002-09-30 2010-08-26 히다치 가세고교 가부시끼가이샤 인쇄 배선판용 수지 조성물, 및 이것을 사용한 와니스, 프리프레그 및 금속 피복 적층판

Also Published As

Publication number Publication date
JP5605035B2 (ja) 2014-10-15
CN1684995A (zh) 2005-10-19
EP1550678A4 (de) 2006-10-11
CN100528927C (zh) 2009-08-19
JP2010196059A (ja) 2010-09-09
KR100990316B1 (ko) 2010-10-26
US20060167189A1 (en) 2006-07-27
JP2010212689A (ja) 2010-09-24
JP4639806B2 (ja) 2011-02-23
KR20050055734A (ko) 2005-06-13
US7816430B2 (en) 2010-10-19
WO2004029127A1 (ja) 2004-04-08
ATE390450T1 (de) 2008-04-15
JP2011006685A (ja) 2011-01-13
EP1550678B1 (de) 2008-03-26
JPWO2004029127A1 (ja) 2006-01-26
JP2010189646A (ja) 2010-09-02
EP1550678A1 (de) 2005-07-06
TWI235020B (en) 2005-06-21
KR20100094586A (ko) 2010-08-26
DE60320004T2 (de) 2009-04-16
AU2003266671A1 (en) 2004-04-19
TW200415964A (en) 2004-08-16

Similar Documents

Publication Publication Date Title
DE60320004D1 (de) Harzzusammensetzung für leiterplatte und lack, prepreg und metallplattiertes laminat unter verwendung davon
EP1731554A4 (de) Prepreg, metallumhülltes laminat und leiterplatte unter verwendung davon
MY117878A (en) Inter-laminar adhesive film for multi-layer printed wiring board and multi-layer printed wiring board using the same
TW200635985A (en) Modified phenolic resin and its manufacturing method, epoxy resin composition containing the same, and prepreg impregnated with the composition
TW200700220A (en) Adhesive sheet with base material for flexible printed wiring board, production method therefor, multilayer flexible printed wiring board, and flex-rigid printed wiring board
TW200621852A (en) Resin composition and its use
TW200617053A (en) Epoxy resin composition for prepreg, prepreg, and multilayered printed wiring board
TW200727744A (en) Multilayer wiring board
WO2006110634A3 (en) Connection method of a flexible printed circuit board with two printed circuit boards, and electric or electronic component with parts connected by the connection method
EP1985654A4 (de) Wärmehärtbare harzzusammensetzung, die einen komplex vom semi-ipn-typ enthält, und klarlack, prepreg und metallumhüllte laminatplatte damit
ATE335777T1 (de) Harzkomponente zum formen einer isolierenden zwischenschicht in einer gedruckten leiterplatte, harzfolie und kupferfolie mit einem harz zur herstellung einer isolierschicht unter verwendung des harzes sowie diese verwendendes kupferkaschiertes laminat
DE69312049D1 (de) Kupferkaschiertes Laminat und Leiterplatte
WO2009072534A1 (ja) 変性ナフタレンホルムアルデヒド樹脂並びにトリシクロデカン骨格含有ナフトール化合物およびエステル化合物
DE60335671D1 (de) Vernetzungsverfahren für eine Epoxidharzzusammensetzung enthaltend reaktives Phosphonat
ATE524308T1 (de) Laminat für elektronisches material
TW200638813A (en) Flexible printed wiring board, multilayer flexible printed wiring board and portable telephone terminal using the multilayer flexible printed wiring board
AU2003235203A1 (en) Flame-retarded epoxy resin composition, prepregs containing the same, laminated sheets and printed wiring boards
DE602004022558D1 (de) Harzzusammensetzung für leiterplatte und damit hergestellte prepregs, laminate und leiterplatten
DE69807793D1 (de) Mit einem Cyanatester modifizierte härtbare Harzzusammensetzung und daraus hergestellter Lack, Prepreg, mit Metall bedeckte Schichtplatte, Film, gedruckte Leiterplatte und Mehrschichtleiterplatte
WO2003076515A1 (fr) Composition de resine thermodurcissable, produits stratifies et substrats pour carte de circuits imprimes fabriques a l'aide de ceux-ci
MY140700A (en) Resin-coated copper foil, and printed wiring board using the resin-coated copper foil
TW200505994A (en) Thermosetting resin composition for multilayer printed wiring board, thermosetting adhesive film and multilayer printed board made by using them
SG108282A1 (en) Imcombustible resin composition, prepreg, laminated plate, meta-clad laminated plate, printed wiring board and multi-layer printed wiring board
TW200602405A (en) Thermosetting resin composition and its cured film
KR980002195A (ko) 폴리카르보디이미드 수지함유 접착제 및 가요성 프린트 배선용 기판

Legal Events

Date Code Title Description
8364 No opposition during term of opposition