DE60335671D1 - Vernetzungsverfahren für eine Epoxidharzzusammensetzung enthaltend reaktives Phosphonat - Google Patents
Vernetzungsverfahren für eine Epoxidharzzusammensetzung enthaltend reaktives PhosphonatInfo
- Publication number
- DE60335671D1 DE60335671D1 DE60335671T DE60335671T DE60335671D1 DE 60335671 D1 DE60335671 D1 DE 60335671D1 DE 60335671 T DE60335671 T DE 60335671T DE 60335671 T DE60335671 T DE 60335671T DE 60335671 D1 DE60335671 D1 DE 60335671D1
- Authority
- DE
- Germany
- Prior art keywords
- phosphonate
- epoxy resin
- resin composition
- composition containing
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5317—Phosphonic compounds, e.g. R—P(:O)(OR')2
- C08K5/5333—Esters of phosphonic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4071—Curing agents not provided for by the groups C08G59/42 - C08G59/66 phosphorus containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
- C08K5/523—Esters of phosphoric acids, e.g. of H3PO4 with hydroxyaryl compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/34—Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C08L61/04, C08L61/18 and C08L61/20
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US42519602P | 2002-11-08 | 2002-11-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60335671D1 true DE60335671D1 (de) | 2011-02-17 |
Family
ID=32312940
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60335671T Expired - Lifetime DE60335671D1 (de) | 2002-11-08 | 2003-11-07 | Vernetzungsverfahren für eine Epoxidharzzusammensetzung enthaltend reaktives Phosphonat |
DE60308548T Expired - Lifetime DE60308548T2 (de) | 2002-11-08 | 2003-11-07 | Epoxidharzzusammensetzung enthaltend reaktives flammhemmendes phosphonat oligomer und füllstoff |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60308548T Expired - Lifetime DE60308548T2 (de) | 2002-11-08 | 2003-11-07 | Epoxidharzzusammensetzung enthaltend reaktives flammhemmendes phosphonat oligomer und füllstoff |
Country Status (12)
Country | Link |
---|---|
US (1) | US7427652B2 (de) |
EP (2) | EP1570000B1 (de) |
JP (1) | JP2006505679A (de) |
KR (1) | KR101169658B1 (de) |
CN (1) | CN100402605C (de) |
AT (2) | ATE340220T1 (de) |
AU (1) | AU2003290646A1 (de) |
CA (1) | CA2505396A1 (de) |
DE (2) | DE60335671D1 (de) |
ES (2) | ES2359226T3 (de) |
TW (1) | TWI335926B (de) |
WO (1) | WO2004044054A1 (de) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003029258A1 (en) * | 2001-10-04 | 2003-04-10 | Akzo Nobel N.V. | Oligomeric, hydroxy-terminated phosphonates |
CN1795223A (zh) * | 2003-05-22 | 2006-06-28 | 苏普雷斯塔有限责任公司 | 用于环氧树脂的聚膦酸酯阻燃固化剂 |
US7910665B2 (en) * | 2004-05-19 | 2011-03-22 | Icl-Ip America Inc. | Composition of epoxy resin and epoxy-reactive polyphosphonate |
TW200916561A (en) * | 2007-05-07 | 2009-04-16 | Martinswerk Gmbh | Flame retarded thermosets |
US9348991B2 (en) * | 2008-05-20 | 2016-05-24 | International Business Machines Corporation | User management of authentication tokens |
TWI423741B (zh) * | 2009-02-13 | 2014-01-11 | Iteq Corp | An epoxy resin composition and a film and a substrate made of the epoxy resin composition |
HUE048499T2 (hu) * | 2010-03-05 | 2020-07-28 | Huntsman Advanced Mat Americas Llc | Alacsony dielektromos veszteségû hõre keményedõ gyantarendszer nagyfrekvencián elektromos alkatrészekben történõ alkalmazásra |
US20120095132A1 (en) * | 2010-10-19 | 2012-04-19 | Chung-Hao Chang | Halogen- and phosphorus-free thermosetting resin composition |
WO2012088435A2 (en) | 2010-12-22 | 2012-06-28 | Frx Polymers, Inc. | Hyperbranched oligomeric phosphonates and compositions including the same |
CN102408419B (zh) * | 2011-08-10 | 2014-11-05 | 哈尔滨理工大学 | 苯并噁嗪树脂的方法 |
KR20150108921A (ko) * | 2013-01-22 | 2015-09-30 | 에프알엑스 폴리머스, 인코포레이티드 | 인 함유 에폭시 화합물 및 이로부터의 조성물 |
JP2015040289A (ja) * | 2013-08-23 | 2015-03-02 | 三菱化学株式会社 | エポキシ樹脂、エポキシ樹脂組成物、硬化物及び電気・電子回路用積層板 |
CN105802127B (zh) * | 2014-12-29 | 2018-05-04 | 广东生益科技股份有限公司 | 一种无卤热固性树脂组合物及使用它的预浸料以及印制电路用层压板 |
CN105801814B (zh) * | 2014-12-29 | 2018-05-04 | 广东生益科技股份有限公司 | 一种无卤热固性树脂组合物及使用它的预浸料和印制电路用层压板 |
CN105802128B (zh) * | 2014-12-29 | 2018-05-04 | 广东生益科技股份有限公司 | 一种无卤热固性树脂组合物及使用它的预浸料和印制电路用层压板 |
CN107151308B (zh) * | 2016-03-04 | 2019-06-14 | 广东生益科技股份有限公司 | 一种无卤热固性树脂组合物及使用它的预浸料、印制电路用层压板 |
CN108117632B (zh) * | 2016-11-30 | 2019-08-23 | 广东生益科技股份有限公司 | 一种热固性树脂组合物 |
CN108117634B (zh) * | 2016-11-30 | 2019-08-27 | 广东生益科技股份有限公司 | 一种热固性树脂组合物 |
CN108164684B (zh) * | 2016-12-07 | 2019-08-27 | 广东生益科技股份有限公司 | 一种热固性树脂组合物 |
RU2749320C1 (ru) | 2017-09-13 | 2021-06-08 | Хексион Инк. | Системы эпоксидных смол |
KR102346010B1 (ko) * | 2019-09-19 | 2021-12-31 | 코오롱인더스트리 주식회사 | 말단이 불포화기로 캡핑된 인 함유 수지, 이의 제조방법 및 상기 말단이 불포화기로 캡핑된 인 함유 수지를 포함하는 수지 조성물 |
CN114539313B (zh) * | 2022-02-23 | 2024-04-26 | 长春市兆兴新材料技术有限责任公司 | 一种双反应型膦酸酯交联阻燃剂及其制备方法 |
Family Cites Families (34)
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US2716101A (en) * | 1952-09-10 | 1955-08-23 | Eastman Kodak Co | Polymeric organo-phosphonates containing phosphato groups |
US2682522A (en) * | 1952-09-10 | 1954-06-29 | Eastman Kodak Co | Process for preparing polymeric organo-phosphonates |
FR1438381A (fr) * | 1964-03-28 | 1966-05-13 | Gelsenberg Benzin Ag | Procédé de préparation de phosphonates contenant des groupes hydroxyle |
GB1308521A (en) * | 1970-03-23 | 1973-02-21 | Exxon Research Engineering Co | Phenolic stabilizers and compositions containing them |
IT1019221B (it) † | 1973-09-11 | 1977-11-10 | Sumitomo Bakelite Co | Composizione di resina termoindu rente inifiammabile e procedi mento per produrla |
DE2715589A1 (de) * | 1976-04-14 | 1977-10-27 | Ciba Geigy Ag | Neue phenol-stabilisatoren |
US4268633A (en) * | 1978-04-20 | 1981-05-19 | Stauffer Chemical Company | Polyurethanes containing a poly (oxyorganophosphate/phosphonate) flame retardant |
DE2925207A1 (de) * | 1979-06-22 | 1981-01-29 | Bayer Ag | Thermoplastische, verzweigte, aromatische polyphosphonate, ihre verwendung und ein verfahren zu ihrer herstellung |
DE3139958A1 (de) * | 1981-10-08 | 1983-04-28 | Basf Ag, 6700 Ludwigshafen | Selbstverloeschende thermoplastische formmassen |
DE3520296A1 (de) * | 1985-06-07 | 1986-12-11 | Bayer Ag, 5090 Leverkusen | Verfahren zur herstellung von copolyphosphonaten mit hoher zaehigkeit |
DE3800672A1 (de) * | 1988-01-13 | 1989-07-27 | Bayer Ag | Flammgeschuetzte polyethylenterephthalatformmassen |
DE3833694A1 (de) * | 1988-10-04 | 1990-04-05 | Bayer Ag | Flammgeschuetzte, gut kristallisierende polyethylenterephthalatformmassen |
US4952646A (en) † | 1989-07-20 | 1990-08-28 | Akzo America Inc. | Epoxy resin compositions containing a polyphosphoric/polyphosphonic anhydride curing agent |
FR2660302B1 (fr) * | 1990-03-30 | 1992-08-07 | Selas Sa | Installation pour le chauffage, le formage et la trempe de feuilles de verre. |
GB9007515D0 (en) * | 1990-04-03 | 1990-05-30 | Ciba Geigy Ag | Products |
US6005064A (en) * | 1993-12-27 | 1999-12-21 | Hitachi Chemical Company, Ltd. | Thermosetting compounds, cured product thereof and method of preparing the thermosetting compound |
JPH08183835A (ja) | 1994-12-28 | 1996-07-16 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物、接着剤シート及び接着剤付き 金属はく |
US6214455B1 (en) * | 1995-09-29 | 2001-04-10 | Toshiba Chemical Corporation | Bisphenol A and novolak epoxy resins with nitrogen-containing phenolic resin |
JP3487083B2 (ja) * | 1996-02-09 | 2004-01-13 | 日立化成工業株式会社 | 熱硬化性樹脂組成物及びその硬化物 |
GB9713526D0 (en) * | 1997-06-26 | 1997-09-03 | Dow Deutschland Inc | Flame retardant laminating formulations |
US6353080B1 (en) † | 1997-06-26 | 2002-03-05 | The Dow Chemical Company | Flame retardant epoxy resin composition |
JPH1180178A (ja) * | 1997-09-12 | 1999-03-26 | Hitachi Chem Co Ltd | リン含有フェノール末端オリゴマー及びその製造法 |
JP2000226499A (ja) * | 1998-12-03 | 2000-08-15 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂成形材料及び電子部品装置 |
JP2000256633A (ja) | 1999-03-09 | 2000-09-19 | Hitachi Chem Co Ltd | 接着剤組成物 |
JP4353589B2 (ja) * | 1999-07-09 | 2009-10-28 | 株式会社Adeka | 難燃性エポキシ樹脂組成物 |
JP2001098273A (ja) * | 1999-09-30 | 2001-04-10 | Nippon Chem Ind Co Ltd | 難燃剤組成物および難燃性樹脂組成物 |
JP2001122948A (ja) * | 1999-10-28 | 2001-05-08 | Hitachi Chem Co Ltd | 難燃性樹脂組成物、プリプレグ及びプリント配線板用積層板 |
TW587094B (en) | 2000-01-17 | 2004-05-11 | Sumitomo Bakelite Co | Flame-retardant resin composition comprising no halogen-containing flame retardant, and prepregs and laminates using such composition |
US6440567B1 (en) * | 2000-03-31 | 2002-08-27 | Isola Laminate Systems Corp. | Halogen free flame retardant adhesive resin coated composite |
JP2001302879A (ja) * | 2000-04-25 | 2001-10-31 | Shin Kobe Electric Mach Co Ltd | エポキシ樹脂組成物、ならびにそれを用いたプリプレグおよびプリント配線板 |
JP2002088138A (ja) * | 2000-09-14 | 2002-03-27 | Asahi Denka Kogyo Kk | エポキシ樹脂組成物 |
MY142518A (en) | 2001-01-10 | 2010-12-15 | Hitachi Chemical Co Ltd | Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resin |
MY138485A (en) | 2001-03-12 | 2009-06-30 | Hitachi Chemical Co Ltd | Process for producing benzoxazine resin |
WO2003029258A1 (en) * | 2001-10-04 | 2003-04-10 | Akzo Nobel N.V. | Oligomeric, hydroxy-terminated phosphonates |
-
2003
- 2003-11-07 ES ES06118096T patent/ES2359226T3/es not_active Expired - Lifetime
- 2003-11-07 US US10/534,137 patent/US7427652B2/en not_active Expired - Lifetime
- 2003-11-07 DE DE60335671T patent/DE60335671D1/de not_active Expired - Lifetime
- 2003-11-07 DE DE60308548T patent/DE60308548T2/de not_active Expired - Lifetime
- 2003-11-07 WO PCT/US2003/035519 patent/WO2004044054A1/en active IP Right Grant
- 2003-11-07 AU AU2003290646A patent/AU2003290646A1/en not_active Abandoned
- 2003-11-07 TW TW092131258A patent/TWI335926B/zh not_active IP Right Cessation
- 2003-11-07 EP EP03783227A patent/EP1570000B1/de not_active Expired - Lifetime
- 2003-11-07 ES ES03783227T patent/ES2273060T3/es not_active Expired - Lifetime
- 2003-11-07 CA CA002505396A patent/CA2505396A1/en not_active Abandoned
- 2003-11-07 CN CNB2003801053608A patent/CN100402605C/zh not_active Expired - Fee Related
- 2003-11-07 EP EP06118096.4A patent/EP1719802B2/de not_active Expired - Lifetime
- 2003-11-07 KR KR1020057008048A patent/KR101169658B1/ko active IP Right Grant
- 2003-11-07 JP JP2004551857A patent/JP2006505679A/ja active Pending
- 2003-11-07 AT AT03783227T patent/ATE340220T1/de not_active IP Right Cessation
- 2003-11-07 AT AT06118096T patent/ATE494329T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2004044054A1 (en) | 2004-05-27 |
ATE494329T1 (de) | 2011-01-15 |
US7427652B2 (en) | 2008-09-23 |
KR101169658B1 (ko) | 2012-08-03 |
TW200417575A (en) | 2004-09-16 |
JP2006505679A (ja) | 2006-02-16 |
US20060142427A1 (en) | 2006-06-29 |
CN100402605C (zh) | 2008-07-16 |
ES2359226T3 (es) | 2011-05-19 |
EP1719802B2 (de) | 2015-11-25 |
KR20050087793A (ko) | 2005-08-31 |
DE60308548T2 (de) | 2007-09-20 |
AU2003290646A1 (en) | 2004-06-03 |
ATE340220T1 (de) | 2006-10-15 |
EP1719802B1 (de) | 2011-01-05 |
ES2273060T3 (es) | 2007-05-01 |
EP1719802A1 (de) | 2006-11-08 |
CN1723243A (zh) | 2006-01-18 |
DE60308548D1 (de) | 2006-11-02 |
TWI335926B (en) | 2011-01-11 |
EP1570000A1 (de) | 2005-09-07 |
EP1570000B1 (de) | 2006-09-20 |
CA2505396A1 (en) | 2004-05-27 |
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