TW200801817A - Photosensitive thermosetting resin composition, flattened and resist film coated printed wiring board and method of preparing the same - Google Patents

Photosensitive thermosetting resin composition, flattened and resist film coated printed wiring board and method of preparing the same

Info

Publication number
TW200801817A
TW200801817A TW096109202A TW96109202A TW200801817A TW 200801817 A TW200801817 A TW 200801817A TW 096109202 A TW096109202 A TW 096109202A TW 96109202 A TW96109202 A TW 96109202A TW 200801817 A TW200801817 A TW 200801817A
Authority
TW
Taiwan
Prior art keywords
component
thermosetting resin
resin composition
pts
photosensitive thermosetting
Prior art date
Application number
TW096109202A
Other languages
Chinese (zh)
Other versions
TWI366072B (en
Inventor
Toshimitsu Kunou
Yasuhiro Kuroyanagi
Yukihiro Usui
Original Assignee
San Ei Kagaku Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by San Ei Kagaku Kabushiki Kaisha filed Critical San Ei Kagaku Kabushiki Kaisha
Publication of TW200801817A publication Critical patent/TW200801817A/en
Application granted granted Critical
Publication of TWI366072B publication Critical patent/TWI366072B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
    • H01L21/02288—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating printing, e.g. ink-jet printing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

To provide a photosensitive thermosetting resin composition capable of giving a solder resist film for a printed wiring board of LED. The photosensitive thermosetting resin composition contains [I] an alkoxy group-containing silane modified epoxy resin obtained by bringing an epoxy resin represented by formula (I/E) and a hydrolyzable alkoxysilane into a dealcoholization reaction, [II] an unsaturated group-containing polycarboxylic acid resin, [III] a diluent, [IV] a photopolymerization initiator and [V] a curing adhesion imparting agent. The composition has a weight ratio between the component [I] and the component [II] being 2/100 to 50/100, and contains the component [III] in an amount of 5-500 pts.wt., the component [IV] in an amount of 0.1-30 pts.wt., and the component [V] in an amount of 0.1-20 pts.wt., based on 100 pts.wt., in total, of the component [I] and the component [II].
TW096109202A 2006-03-17 2007-03-16 Photosensitive thermosetting resin composition, flattened and resist film coated printed wiring board and method of preparing the same TWI366072B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006112677A JP4711208B2 (en) 2006-03-17 2006-03-17 Photosensitive thermosetting resin composition, resist film-coated smoothed printed wiring board, and method for producing the same.

Publications (2)

Publication Number Publication Date
TW200801817A true TW200801817A (en) 2008-01-01
TWI366072B TWI366072B (en) 2012-06-11

Family

ID=38375044

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096109202A TWI366072B (en) 2006-03-17 2007-03-16 Photosensitive thermosetting resin composition, flattened and resist film coated printed wiring board and method of preparing the same

Country Status (5)

Country Link
JP (1) JP4711208B2 (en)
KR (1) KR100894609B1 (en)
CN (1) CN101037529B (en)
DE (1) DE102006043357B4 (en)
TW (1) TWI366072B (en)

Cited By (4)

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TWI505415B (en) * 2008-09-30 2015-10-21 Hitachi Chemical Co Ltd A coating agent, a substrate for mounting an optical semiconductor device, and an optical semiconductor device
TWI601455B (en) * 2011-11-25 2017-10-01 住友電木股份有限公司 Prepreg, laminate, multilayered printed circuit board and semiconductor device
US9814129B2 (en) 2011-12-23 2017-11-07 Lg Innotek Co., Ltd. Printed circuit board and method of fabricating the same
TWI768111B (en) * 2017-08-28 2022-06-21 日商住友電木股份有限公司 Negative photosensitive resin composition, semiconductor device and electronic device

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JP4538484B2 (en) * 2006-10-24 2010-09-08 太陽インキ製造株式会社 Photocurable thermosetting resin composition and printed wiring board using the same
TWI357536B (en) * 2006-10-24 2012-02-01 Taiyo Ink Mfg Co Ltd Photosetting and thermosetting solder resist ink c
JP5464314B2 (en) * 2007-10-01 2014-04-09 山栄化学株式会社 Inorganic filler and organic filler-containing curable resin composition, resist film-coated printed wiring board, and method for producing the same
US20090141505A1 (en) * 2007-11-30 2009-06-04 Taiyo Ink Mfg., Co,. Ltd. White heat-hardening resin composition, hardened material, printed-wiring board and reflection board for light emitting device
US8042976B2 (en) * 2007-11-30 2011-10-25 Taiyo Holdings Co., Ltd. White hardening resin composition, hardened material, printed-wiring board and reflection board for light emitting device
KR101895831B1 (en) * 2008-01-09 2018-09-07 히타치가세이가부시끼가이샤 Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
US8637593B2 (en) 2008-01-09 2014-01-28 Hitachi Chemical Company, Ltd. Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
JP4392464B2 (en) * 2008-01-15 2010-01-06 積水化学工業株式会社 Resist material and laminate
JP2009194222A (en) * 2008-02-15 2009-08-27 Denki Kagaku Kogyo Kk White alkali-developable photocurable and thermosetting solder resist composition, and metal-base circuit substrate using the same
JP5089426B2 (en) * 2008-02-15 2012-12-05 電気化学工業株式会社 Alkali-developable photocurable / thermosetting solder resist composition and metal base circuit board using the same
JP5201397B2 (en) * 2008-04-25 2013-06-05 日立化成株式会社 Photosensitive resin composition and photosensitive permanent resist, photosensitive film, and resist pattern forming method using the same
TWI455954B (en) * 2008-05-07 2014-10-11 Taiyo Holdings Co Ltd a thermosetting resin composition for hole filling, a combination unit of the composition and a photocurable thermosetting resin composition for forming a solder resist layer, and a printed circuit board
JP5112944B2 (en) * 2008-05-07 2013-01-09 太陽ホールディングス株式会社 Combination unit and printed wiring board of thermosetting resin composition for hole filling and photocurable / thermosetting resin composition for solder mask formation
JP5485599B2 (en) * 2008-08-26 2014-05-07 株式会社タムラ製作所 Photosensitive resin composition, solder resist composition for printed wiring board, and printed wiring board
TW201016777A (en) * 2008-10-17 2010-05-01 Taiyo Ink Mfg Co Ltd Curable resin composition and reflective sheet
TWI408150B (en) * 2008-10-17 2013-09-11 Taiyo Ink Mfg Co Ltd A solder resist composition and a printed circuit board using the same
JP4657358B2 (en) * 2008-12-12 2011-03-23 積水化学工業株式会社 Photosensitive composition and solder resist composition
JP2010235799A (en) * 2009-03-31 2010-10-21 Taiyo Ink Mfg Ltd Curable resin composition and printed wiring board and reflector using the same
WO2011018907A1 (en) * 2009-08-10 2011-02-17 積水化学工業株式会社 Photosensitive composition and solder resist composition
CN102011952A (en) * 2009-09-04 2011-04-13 佛山市国星光电股份有限公司 Method for making LED (Light Emitting Diode) light resource module and product made by the method
JP4897922B2 (en) * 2009-09-10 2012-03-14 積水化学工業株式会社 Solder resist composition and printed wiring board
JP4855507B2 (en) * 2009-09-18 2012-01-18 株式会社タムラ製作所 Method for manufacturing printed wiring board having reflector function
JP5613172B2 (en) * 2009-11-17 2014-10-22 株式会社タムラ製作所 Flame retardant solder resist composition and flexible wiring board obtained using the same
JP5316901B2 (en) * 2009-12-07 2013-10-16 山栄化学株式会社 Printed wiring board and manufacturing method thereof
JP2011227308A (en) * 2010-04-20 2011-11-10 Taiyo Holdings Co Ltd Solder resist composition and print circuit board
JP2011215384A (en) * 2010-03-31 2011-10-27 Taiyo Holdings Co Ltd Solder resist composition and printed-circuit board
KR20120137391A (en) * 2010-03-31 2012-12-20 다이요 홀딩스 가부시키가이샤 Solder resist composition and printed circuit board
JP5392724B2 (en) * 2010-03-31 2014-01-22 京セラＳｌｃテクノロジー株式会社 Wiring board manufacturing method
KR101427445B1 (en) * 2010-09-30 2014-08-11 코오롱인더스트리 주식회사 Photosensitive resin composition for organic insulator
CN102101935B (en) * 2010-12-23 2012-06-27 广东生益科技股份有限公司 Halogen-free epoxy resin composition and flexible copper clad plate prepared from same
CN102621811B (en) * 2011-01-31 2017-03-01 新应材股份有限公司 A kind of developed photosensitive resin composition being applied to panel construction
JP5640864B2 (en) * 2011-03-31 2014-12-17 日本ゼオン株式会社 Negative photosensitive resin composition and electronic component
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JP5663506B2 (en) * 2012-02-06 2015-02-04 太陽ホールディングス株式会社 Solder resist composition
JP5481536B2 (en) * 2012-08-13 2014-04-23 太陽ホールディングス株式会社 Thermosetting solder resist composition, solder resist layer comprising the cured product, and printed wiring board
KR102192598B1 (en) * 2013-04-23 2020-12-17 다이요 홀딩스 가부시키가이샤 Printed-circuit-board material and printed circuit board using same
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TWI505415B (en) * 2008-09-30 2015-10-21 Hitachi Chemical Co Ltd A coating agent, a substrate for mounting an optical semiconductor device, and an optical semiconductor device
TWI601455B (en) * 2011-11-25 2017-10-01 住友電木股份有限公司 Prepreg, laminate, multilayered printed circuit board and semiconductor device
US9814129B2 (en) 2011-12-23 2017-11-07 Lg Innotek Co., Ltd. Printed circuit board and method of fabricating the same
TWI612865B (en) * 2011-12-23 2018-01-21 Ｌｇ伊諾特股份有限公司 Printed circuit board and method of fabricating the same
TWI768111B (en) * 2017-08-28 2022-06-21 日商住友電木股份有限公司 Negative photosensitive resin composition, semiconductor device and electronic device

Also Published As

Publication number Publication date
CN101037529A (en) 2007-09-19
DE102006043357B4 (en) 2011-04-21
KR100894609B1 (en) 2009-04-24
DE102006043357A1 (en) 2007-09-20
JP2007249148A (en) 2007-09-27
JP4711208B2 (en) 2011-06-29
CN101037529B (en) 2011-05-25
TWI366072B (en) 2012-06-11
KR20070094456A (en) 2007-09-20

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