TW200641529A - Photosensitive resin composition, printed wiring board, and semiconductor package substrate - Google Patents

Photosensitive resin composition, printed wiring board, and semiconductor package substrate

Info

Publication number
TW200641529A
TW200641529A TW095112984A TW95112984A TW200641529A TW 200641529 A TW200641529 A TW 200641529A TW 095112984 A TW095112984 A TW 095112984A TW 95112984 A TW95112984 A TW 95112984A TW 200641529 A TW200641529 A TW 200641529A
Authority
TW
Taiwan
Prior art keywords
compounds
formula
resin composition
photosensitive resin
wiring board
Prior art date
Application number
TW095112984A
Other languages
Chinese (zh)
Other versions
TWI392965B (en
Inventor
Tatsuya Kiyota
Yukihiro Kiuchi
Masatoshi Iji
Original Assignee
Tamura Kaken Corp
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamura Kaken Corp, Nec Corp filed Critical Tamura Kaken Corp
Publication of TW200641529A publication Critical patent/TW200641529A/en
Application granted granted Critical
Publication of TWI392965B publication Critical patent/TWI392965B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1494—Polycondensates modified by chemical after-treatment followed by a further chemical treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4292—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with monocarboxylic acids
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

A photosensitive resin composition which comprises: (A) a resin which is, e.g., one obtained by reacting a product of the reaction of an unsaturated monocarboxylic acid with an epoxy resin selected from the group consisting of compounds of the formula (1) and compounds of the formula (2) with a compound selected from the group consisting of polybasic acids and polybasic acid anhydrides; (a) a resin which is, e.g., one obtained by reacting a product of the reaction of an unsaturated monocarboxylic acid with an epoxy resin other than the compounds of the formula (1) and the compounds of the formula (2) with a compound selected from the group consisting of polybasic acids and polybasic acid anhydrides; (B) a photopolymerization initiator; (C) a reactive diluent; (D) an epoxy resin selected from the group consisting of compounds of the formula (1) and compounds of the formula (2); (d) an epoxy resin other than the compounds of the formula (1) and the compounds of the formula (2); and (E) a molybdenum compound.
TW95112984A 2005-04-13 2006-04-12 A photosensitive resin composition, a printed wiring board, and a semiconductor package substrate TWI392965B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005115279 2005-04-13
JP2005284203 2005-09-29

Publications (2)

Publication Number Publication Date
TW200641529A true TW200641529A (en) 2006-12-01
TWI392965B TWI392965B (en) 2013-04-11

Family

ID=37087146

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95112984A TWI392965B (en) 2005-04-13 2006-04-12 A photosensitive resin composition, a printed wiring board, and a semiconductor package substrate

Country Status (4)

Country Link
JP (1) JP4878597B2 (en)
CN (1) CN101142528B (en)
TW (1) TWI392965B (en)
WO (1) WO2006109890A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI558736B (en) * 2012-05-15 2016-11-21 日本化藥股份有限公司 Reactive polyester compound and active energy ray-curable resin composition

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4514049B2 (en) * 2005-08-01 2010-07-28 日本化薬株式会社 Photosensitive resin composition and cured product thereof
JP4986024B2 (en) * 2006-10-24 2012-07-25 日立化成工業株式会社 Photosensitive resin composition and photosensitive element
KR100997603B1 (en) 2006-10-24 2010-11-30 히다치 가세고교 가부시끼가이샤 Photosensitive resin composition and photosensitive element using the same
DE102007001862A1 (en) * 2007-01-12 2008-07-17 Clariant International Ltd. Flame retardant resin formulation and its use
JP2008180992A (en) * 2007-01-25 2008-08-07 Hitachi Chem Co Ltd Photosensitive resin composition, photosensitive film for permanent resist, resist pattern forming method, printed wiring board and semiconductor package
JP5096814B2 (en) * 2007-07-04 2012-12-12 東京応化工業株式会社 Colored photosensitive composition
JP2009014990A (en) * 2007-07-04 2009-01-22 Hitachi Chem Co Ltd Photosensitive resin composition and photosensitive element using the same
KR101456516B1 (en) * 2007-08-28 2014-11-03 니폰 가야꾸 가부시끼가이샤 Reactive carboxylate compound, curable resin composition using the same, and use of the same
JP5377020B2 (en) * 2009-03-23 2013-12-25 太陽ホールディングス株式会社 Photo-curable thermosetting resin composition, dry film and cured product thereof, and printed wiring board using them
TWI491982B (en) * 2009-10-28 2015-07-11 Sumitomo Chemical Co Coloring the photosensitive resin composition
JP2011099919A (en) * 2009-11-04 2011-05-19 Mitsubishi Chemicals Corp Colored resin composition, color filter, liquid crystal display device, and organic el display
JP6181907B2 (en) * 2011-11-15 2017-08-16 互応化学工業株式会社 Resin composition for carboxyl group-containing resin and solder resist
JP5688116B2 (en) * 2013-05-13 2015-03-25 太陽ホールディングス株式会社 Photo-curable thermosetting resin composition, dry film and cured product thereof, and printed wiring board using them
CN106249545B (en) * 2016-08-25 2019-06-25 杭州福斯特应用材料股份有限公司 It is a kind of can selfreparing photosensitive dry film solder mask
JP6542285B2 (en) * 2017-03-30 2019-07-10 株式会社タムラ製作所 Photosensitive resin composition and printed wiring board
JP6708242B2 (en) * 2018-11-14 2020-06-10 日立化成株式会社 Resin composition for mold underfill and electronic component device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0695380A (en) * 1992-09-11 1994-04-08 Daicel Chem Ind Ltd Photosetting resin composition
AU674017B2 (en) * 1992-09-14 1996-12-05 Yoshino Kogyosho Co., Ltd. Printed thermoplastic resin products and method for printing such products
TW290583B (en) * 1993-10-14 1996-11-11 Alpha Metals Ltd
JPH0876379A (en) * 1994-08-31 1996-03-22 Taiyo Ink Mfg Ltd Photosetting and thermosetting resin composition
JPH0987346A (en) * 1995-09-19 1997-03-31 Dainippon Ink & Chem Inc Energy ray curing epoxyacrylate resin composition
JP4439614B2 (en) * 1999-05-19 2010-03-24 太陽インキ製造株式会社 Alkali-developable photocurable / thermosetting composition
JP2002148799A (en) * 2000-11-14 2002-05-22 Mitsubishi Gas Chem Co Inc Resist composition with excellent flame resistance
JP2002356538A (en) * 2001-03-30 2002-12-13 Toray Ind Inc Epoxy resin composition for sealing semiconductor and semiconductor device using the same
JP4265187B2 (en) * 2002-09-20 2009-05-20 日立化成工業株式会社 Electronic component apparatus provided with epoxy resin molding material and element for sealing
JP2004286818A (en) * 2003-03-19 2004-10-14 Mitsubishi Gas Chem Co Inc Flame retardant resist composition having excellent heat resistance
JP2006091243A (en) * 2004-09-22 2006-04-06 Mitsubishi Gas Chem Co Inc Resin composition for resist
JP2006208853A (en) * 2005-01-28 2006-08-10 Hitachi Chem Co Ltd Photosensitive resin composition and photosensitive element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI558736B (en) * 2012-05-15 2016-11-21 日本化藥股份有限公司 Reactive polyester compound and active energy ray-curable resin composition

Also Published As

Publication number Publication date
CN101142528B (en) 2011-12-28
TWI392965B (en) 2013-04-11
WO2006109890A1 (en) 2006-10-19
JPWO2006109890A1 (en) 2008-11-20
JP4878597B2 (en) 2012-02-15
CN101142528A (en) 2008-03-12

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