DE69933512D1 - Verfahren zur Herstellung einer elekronischen Anordnung unter Verwendung von aufarbeitbaren Unterfüllungs-Einkapselungen - Google Patents
Verfahren zur Herstellung einer elekronischen Anordnung unter Verwendung von aufarbeitbaren Unterfüllungs-EinkapselungenInfo
- Publication number
- DE69933512D1 DE69933512D1 DE69933512T DE69933512T DE69933512D1 DE 69933512 D1 DE69933512 D1 DE 69933512D1 DE 69933512 T DE69933512 T DE 69933512T DE 69933512 T DE69933512 T DE 69933512T DE 69933512 D1 DE69933512 D1 DE 69933512D1
- Authority
- DE
- Germany
- Prior art keywords
- electronic assembly
- workable
- making
- maleimide
- compounds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/2805—Compounds having only one group containing active hydrogen
- C08G18/285—Nitrogen containing compounds
- C08G18/2875—Monohydroxy compounds containing tertiary amino groups
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/006—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers provided for in C08G18/00
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/12—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/14—Polymers provided for in subclass C08G
- C08F290/147—Polyurethanes; Polyureas
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/14—Polymers provided for in subclass C08G
- C08F290/148—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/98—Methods for disconnecting semiconductor or solid-state bodies
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01012—Magnesium [Mg]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01077—Iridium [Ir]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31692—Next to addition polymer from unsaturated monomers
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US110080 | 1998-07-02 | ||
US09/110,080 US6057381A (en) | 1998-07-02 | 1998-07-02 | Method of making an electronic component using reworkable underfill encapsulants |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69933512D1 true DE69933512D1 (de) | 2006-11-23 |
DE69933512T2 DE69933512T2 (de) | 2007-08-16 |
Family
ID=22331125
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1999633512 Expired - Lifetime DE69933512T2 (de) | 1998-07-02 | 1999-07-01 | Verfahren zur Herstellung einer elekronischen Anordnung unter Verwendung von aufarbeitbaren Unterfüllungs-Einkapselungen |
Country Status (10)
Country | Link |
---|---|
US (2) | US6057381A (de) |
EP (1) | EP0969064B1 (de) |
JP (1) | JP2000031350A (de) |
KR (1) | KR100517454B1 (de) |
CN (1) | CN1225956C (de) |
AT (1) | ATE342317T1 (de) |
DE (1) | DE69933512T2 (de) |
HK (1) | HK1026810A1 (de) |
MY (1) | MY127943A (de) |
SG (1) | SG82000A1 (de) |
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US6404043B1 (en) | 2000-06-21 | 2002-06-11 | Dense-Pac Microsystems, Inc. | Panel stacking of BGA devices to form three-dimensional modules |
CN1109086C (zh) * | 2000-07-19 | 2003-05-21 | 湖北省化学研究所 | 一种柔性印刷电路用的反应型阻燃胶粘剂及制备 |
US7122908B2 (en) * | 2001-02-01 | 2006-10-17 | Micron Technology, Inc. | Electronic device package |
US20030002267A1 (en) * | 2001-06-15 | 2003-01-02 | Mantz Frank E. | I/O interface structure |
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US6573461B2 (en) | 2001-09-20 | 2003-06-03 | Dpac Technologies Corp | Retaining ring interconnect used for 3-D stacking |
US6573460B2 (en) * | 2001-09-20 | 2003-06-03 | Dpac Technologies Corp | Post in ring interconnect using for 3-D stacking |
US6833629B2 (en) | 2001-12-14 | 2004-12-21 | National Starch And Chemical Investment Holding Corporation | Dual cure B-stageable underfill for wafer level |
US20030129438A1 (en) * | 2001-12-14 | 2003-07-10 | Becker Kevin Harris | Dual cure B-stageable adhesive for die attach |
US6803406B2 (en) | 2002-03-29 | 2004-10-12 | National Starch And Chemical Investmnet Holding Corporation | Electron donors, electron acceptors and adhesion promoters containing disulfide |
JP2005527113A (ja) * | 2002-05-23 | 2005-09-08 | スリーエム イノベイティブ プロパティズ カンパニー | ナノ粒子充填アンダーフィル |
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JP4793565B2 (ja) * | 2005-03-24 | 2011-10-12 | 信越化学工業株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
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US20070051774A1 (en) * | 2005-09-06 | 2007-03-08 | Stipp John N | Method of controlling solder deposition on heat spreader used for semiconductor package |
US20070290378A1 (en) * | 2006-06-20 | 2007-12-20 | International Business Machines Corporation | Novel reworkable underfills for ceramic mcm c4 protection |
JP5464314B2 (ja) * | 2007-10-01 | 2014-04-09 | 山栄化学株式会社 | 無機フィラー及び有機フィラー含有硬化性樹脂組成物、並びにレジスト膜被覆プリント配線板及びその製造方法 |
JP2013083958A (ja) * | 2011-09-26 | 2013-05-09 | Nippon Steel & Sumikin Chemical Co Ltd | 感光性樹脂組成物、それを用いた硬化物及び半導体素子 |
US9431274B2 (en) * | 2012-12-20 | 2016-08-30 | Intel Corporation | Method for reducing underfill filler settling in integrated circuit packages |
EP2976380B1 (de) | 2013-03-22 | 2018-10-10 | Henkel IP & Holding GmbH | Dien-/dienophilpaare und wärmehärtbare harzzusammensetzungen mit wiederbearbeitbarkeit |
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WO2017027525A1 (en) * | 2015-08-11 | 2017-02-16 | The Arizona Board Of Regents On Behalf Of The University Of Arizona | Method of forming of a robust network of epoxy material through diels-alder reaction |
US10723921B2 (en) | 2016-01-29 | 2020-07-28 | Arizona Board Of Regents On Behalf Of The University Of Arizona | Coumarin-modified epoxy adhesives |
TWI738735B (zh) * | 2016-05-27 | 2021-09-11 | 德商漢高智慧財產控股公司 | 藉由毛細流動以於電子封裝中進行間隙塗覆及/或於其中或其間充填的組合物及其使用方法 |
KR20220051836A (ko) * | 2019-08-20 | 2022-04-26 | 도오꾜오까고오교 가부시끼가이샤 | 절연막 형성용 경화성 조성물, 절연막의 형성 방법, 및 말단 말레이미드 변성 폴리페닐렌에테르 수지 |
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-
1998
- 1998-07-02 US US09/110,080 patent/US6057381A/en not_active Expired - Lifetime
-
1999
- 1999-06-16 MY MYPI99002474A patent/MY127943A/en unknown
- 1999-06-18 SG SG9902956A patent/SG82000A1/en unknown
- 1999-06-30 CN CNB991109325A patent/CN1225956C/zh not_active Expired - Fee Related
- 1999-07-01 EP EP99112733A patent/EP0969064B1/de not_active Expired - Lifetime
- 1999-07-01 DE DE1999633512 patent/DE69933512T2/de not_active Expired - Lifetime
- 1999-07-01 KR KR10-1999-0026328A patent/KR100517454B1/ko not_active IP Right Cessation
- 1999-07-01 AT AT99112733T patent/ATE342317T1/de not_active IP Right Cessation
- 1999-07-02 JP JP18932699A patent/JP2000031350A/ja active Pending
- 1999-12-22 US US09/469,479 patent/US6180187B1/en not_active Expired - Lifetime
-
2000
- 2000-09-20 HK HK00105953A patent/HK1026810A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US6180187B1 (en) | 2001-01-30 |
US6057381A (en) | 2000-05-02 |
EP0969064B1 (de) | 2006-10-11 |
MY127943A (en) | 2007-01-31 |
CN1248145A (zh) | 2000-03-22 |
EP0969064A2 (de) | 2000-01-05 |
KR20000011413A (ko) | 2000-02-25 |
ATE342317T1 (de) | 2006-11-15 |
HK1026810A1 (en) | 2000-12-22 |
JP2000031350A (ja) | 2000-01-28 |
DE69933512T2 (de) | 2007-08-16 |
KR100517454B1 (ko) | 2005-09-28 |
SG82000A1 (en) | 2001-07-24 |
EP0969064A3 (de) | 2000-02-23 |
CN1225956C (zh) | 2005-11-02 |
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