CN1225956C - 用可再加工封装密封剂制造密封电子元件的方法 - Google Patents
用可再加工封装密封剂制造密封电子元件的方法 Download PDFInfo
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- CN1225956C CN1225956C CNB991109325A CN99110932A CN1225956C CN 1225956 C CN1225956 C CN 1225956C CN B991109325 A CNB991109325 A CN B991109325A CN 99110932 A CN99110932 A CN 99110932A CN 1225956 C CN1225956 C CN 1225956C
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- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
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- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
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- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
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- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/14—Polymers provided for in subclass C08G
- C08F290/148—Polysiloxanes
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- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L24/98—Methods for disconnecting semiconductor or solid-state bodies
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
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- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31692—Next to addition polymer from unsaturated monomers
Abstract
Description
组成 | 样品11-A | 样品11-B | 样品11-C | 样品11-D |
马来酰亚胺 | N-4-丁基-苯基-马来酰亚胺22.9g51.9wt% | N-4-乙基-苯基-马来酰亚胺20.1g48.7wt% | 二聚二胺双马来酰亚胺1.0g82.0wt% | *双马来酰亚胺1.0g82.0wt% |
苯甲酸乙烯基叔丁酯 | 20.4g46.2wt% | 20.4g49.4wt% | 0.2g16.4wt% | 0.2g16.4wt% |
过氧化二枯基 | 0.45g1.0wt% | 0.40g1.0wt% | 0.01g0.8wt% | 0.01g0.8wt% |
thacyloxytrimethoxy-silane | 0.40g0.9wt% | 0.40g1.0wt% | 0.01g0.8wt% | 0.01g0.8wt% |
Tg | 140℃ | 145℃ | 42℃ | 37℃ |
CTE | 16ppm/℃ | 15ppm/℃ | 16ppm/℃ | 15ppm/℃ |
Claims (5)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/110080 | 1998-07-02 | ||
US09/110,080 | 1998-07-02 | ||
US09/110,080 US6057381A (en) | 1998-07-02 | 1998-07-02 | Method of making an electronic component using reworkable underfill encapsulants |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1248145A CN1248145A (zh) | 2000-03-22 |
CN1225956C true CN1225956C (zh) | 2005-11-02 |
Family
ID=22331125
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB991109325A Expired - Fee Related CN1225956C (zh) | 1998-07-02 | 1999-06-30 | 用可再加工封装密封剂制造密封电子元件的方法 |
Country Status (10)
Country | Link |
---|---|
US (2) | US6057381A (zh) |
EP (1) | EP0969064B1 (zh) |
JP (1) | JP2000031350A (zh) |
KR (1) | KR100517454B1 (zh) |
CN (1) | CN1225956C (zh) |
AT (1) | ATE342317T1 (zh) |
DE (1) | DE69933512T2 (zh) |
HK (1) | HK1026810A1 (zh) |
MY (1) | MY127943A (zh) |
SG (1) | SG82000A1 (zh) |
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JP5464314B2 (ja) * | 2007-10-01 | 2014-04-09 | 山栄化学株式会社 | 無機フィラー及び有機フィラー含有硬化性樹脂組成物、並びにレジスト膜被覆プリント配線板及びその製造方法 |
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-
1998
- 1998-07-02 US US09/110,080 patent/US6057381A/en not_active Expired - Lifetime
-
1999
- 1999-06-16 MY MYPI99002474A patent/MY127943A/en unknown
- 1999-06-18 SG SG9902956A patent/SG82000A1/en unknown
- 1999-06-30 CN CNB991109325A patent/CN1225956C/zh not_active Expired - Fee Related
- 1999-07-01 EP EP99112733A patent/EP0969064B1/en not_active Expired - Lifetime
- 1999-07-01 KR KR10-1999-0026328A patent/KR100517454B1/ko not_active IP Right Cessation
- 1999-07-01 DE DE1999633512 patent/DE69933512T2/de not_active Expired - Lifetime
- 1999-07-01 AT AT99112733T patent/ATE342317T1/de not_active IP Right Cessation
- 1999-07-02 JP JP18932699A patent/JP2000031350A/ja active Pending
- 1999-12-22 US US09/469,479 patent/US6180187B1/en not_active Expired - Lifetime
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2000
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Also Published As
Publication number | Publication date |
---|---|
EP0969064A3 (en) | 2000-02-23 |
CN1248145A (zh) | 2000-03-22 |
US6057381A (en) | 2000-05-02 |
EP0969064A2 (en) | 2000-01-05 |
KR20000011413A (ko) | 2000-02-25 |
JP2000031350A (ja) | 2000-01-28 |
EP0969064B1 (en) | 2006-10-11 |
KR100517454B1 (ko) | 2005-09-28 |
US6180187B1 (en) | 2001-01-30 |
ATE342317T1 (de) | 2006-11-15 |
MY127943A (en) | 2007-01-31 |
DE69933512D1 (de) | 2006-11-23 |
HK1026810A1 (en) | 2000-12-22 |
DE69933512T2 (de) | 2007-08-16 |
SG82000A1 (en) | 2001-07-24 |
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