WO2003076507A3 - High fracture toughness hydrosilyation cured silicone resin - Google Patents

High fracture toughness hydrosilyation cured silicone resin Download PDF

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Publication number
WO2003076507A3
WO2003076507A3 PCT/US2003/005357 US0305357W WO03076507A3 WO 2003076507 A3 WO2003076507 A3 WO 2003076507A3 US 0305357 W US0305357 W US 0305357W WO 03076507 A3 WO03076507 A3 WO 03076507A3
Authority
WO
WIPO (PCT)
Prior art keywords
fracture toughness
hydrosilyation
high fracture
silicone resin
cured silicone
Prior art date
Application number
PCT/US2003/005357
Other languages
French (fr)
Other versions
WO2003076507A2 (en
Inventor
Zhongtao Li
Frederick J Mcgarry
John R Keryk
Bizhong Zhu
Dimitris E Katsoulis
Original Assignee
Massachusetts Inst Technology
Dow Corning
Zhongtao Li
Frederick J Mcgarry
John R Keryk
Bizhong Zhu
Dimitris E Katsoulis
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Massachusetts Inst Technology, Dow Corning, Zhongtao Li, Frederick J Mcgarry, John R Keryk, Bizhong Zhu, Dimitris E Katsoulis filed Critical Massachusetts Inst Technology
Priority to AT03709253T priority Critical patent/ATE441687T1/en
Priority to DE60329112T priority patent/DE60329112D1/en
Priority to EP03709253A priority patent/EP1543064B1/en
Priority to CA2477970A priority patent/CA2477970C/en
Priority to AU2003213207A priority patent/AU2003213207A1/en
Priority to JP2003574719A priority patent/JP4557553B2/en
Priority to KR1020047013744A priority patent/KR100961638B1/en
Publication of WO2003076507A2 publication Critical patent/WO2003076507A2/en
Publication of WO2003076507A3 publication Critical patent/WO2003076507A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • C08L83/12—Block- or graft-copolymers containing polysiloxane sequences containing polyether sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/5403—Silicon-containing compounds containing no other elements than carbon or hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Materials Applied To Surfaces To Minimize Adherence Of Mist Or Water (AREA)

Abstract

A hydrosilylation reaction curable composition that includes a silsesquioxane polymer, a mixture of silanes or siloxanes as a cross-linking compound and a hydrosilylation reaction catalyst. The curable composition is cured to form a cured resin having high fracture toughness and strength without the loss of elastic modulus.
PCT/US2003/005357 2002-03-05 2003-02-20 High fracture toughness hydrosilyation cured silicone resin WO2003076507A2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
AT03709253T ATE441687T1 (en) 2002-03-05 2003-02-20 SILICONE RESIN HARDENED BY HYDROSILYLATION WITH HIGH Fracture Strength
DE60329112T DE60329112D1 (en) 2002-03-05 2003-02-20 SILICONE RESIN HARDENED BY HYDROSILYLATION WITH HIGH TOUGHNESS
EP03709253A EP1543064B1 (en) 2002-03-05 2003-02-20 High fracture toughness hydrosilyation cured silicone resin
CA2477970A CA2477970C (en) 2002-03-05 2003-02-20 High fracture toughness hydrosilyation cured silicone resin
AU2003213207A AU2003213207A1 (en) 2002-03-05 2003-02-20 High fracture toughness hydrosilyation cured silicone resin
JP2003574719A JP4557553B2 (en) 2002-03-05 2003-02-20 Hydrosilylation reaction curable silicone resin with high fracture toughness
KR1020047013744A KR100961638B1 (en) 2002-03-05 2003-02-20 High Fracture Toughness Hydrosilylation Cured Silicone Resin

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/092,055 US6689859B2 (en) 2002-03-05 2002-03-05 High fracture toughness hydrosilyation cured silicone resin
US10/092,055 2002-03-05

Publications (2)

Publication Number Publication Date
WO2003076507A2 WO2003076507A2 (en) 2003-09-18
WO2003076507A3 true WO2003076507A3 (en) 2005-03-24

Family

ID=27804152

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/005357 WO2003076507A2 (en) 2002-03-05 2003-02-20 High fracture toughness hydrosilyation cured silicone resin

Country Status (10)

Country Link
US (1) US6689859B2 (en)
EP (1) EP1543064B1 (en)
JP (1) JP4557553B2 (en)
KR (1) KR100961638B1 (en)
CN (1) CN1312195C (en)
AT (1) ATE441687T1 (en)
AU (1) AU2003213207A1 (en)
CA (1) CA2477970C (en)
DE (1) DE60329112D1 (en)
WO (1) WO2003076507A2 (en)

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US6310146B1 (en) * 1999-07-01 2001-10-30 Dow Corning Corporation Silsesquioxane resin with high strength and fracture toughness and method for the preparation thereof
US20020130444A1 (en) * 2001-03-15 2002-09-19 Gareth Hougham Post cure hardening of siloxane stamps for microcontact printing
US6646039B2 (en) * 2002-03-05 2003-11-11 Dow Corning Corporation Hydrosilyation cured silicone resin containing colloidal silica and a process for producing the same
US7037592B2 (en) 2003-02-25 2006-05-02 Dow Coming Corporation Hybrid composite of silicone and organic resins
CN101044209B (en) 2004-11-19 2011-01-19 陶氏康宁公司 Silicone composition and cured silicone resin
KR101216576B1 (en) * 2004-11-19 2012-12-31 다우 코닝 코포레이션 organohydrogenpolysiloxane resin and silicone composition
WO2006088645A1 (en) * 2005-02-16 2006-08-24 Dow Corning Corporation Reinforced silicone resin film and method of preparing same
US8092910B2 (en) * 2005-02-16 2012-01-10 Dow Corning Toray Co., Ltd. Reinforced silicone resin film and method of preparing same
EP1910471B1 (en) * 2005-08-04 2012-06-06 Dow Corning Corporation Reinforced silicone resin film and method of preparing same
JP2007063394A (en) * 2005-08-31 2007-03-15 Asahi Kasei Corp Cage silsesquioxane polymer
CN101356237B (en) 2005-12-21 2011-06-29 陶氏康宁公司 Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition
CN101346417B (en) * 2006-01-19 2012-01-25 陶氏康宁公司 Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition
WO2007097835A2 (en) * 2006-02-20 2007-08-30 Dow Corning Corporation Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition
CN101449206A (en) * 2006-04-11 2009-06-03 陶氏康宁公司 Low thermal distortion silicone composite molds
CN101522838B (en) * 2006-10-05 2012-07-04 陶氏康宁公司 Silicone resin film and method of preparing same
JP2010518226A (en) * 2007-02-06 2010-05-27 ダウ・コーニング・コーポレイション Silicone resin, silicone composition, coated substrate, and reinforced silicone resin film
JP5426402B2 (en) * 2007-02-22 2014-02-26 ダウ コーニング コーポレーション Reinforced silicone resin film
EP2117835A1 (en) * 2007-02-22 2009-11-18 Dow Corning Corporation Reinforced silicone resin films
EP2118203B1 (en) * 2007-02-22 2012-05-23 Dow Corning Corporation Reinforced silicone resin film and method of preparing same
KR20100014391A (en) * 2007-02-22 2010-02-10 다우 코닝 코포레이션 Reinforced silicone resin film and method of preparing same
KR20100017500A (en) * 2007-05-01 2010-02-16 다우 코닝 코포레이션 Nanomaterial-filled silicone composition and reinforced silicone resin film
EP2142589A2 (en) * 2007-05-01 2010-01-13 Dow Corning Corporation Reinforced silicone resin film
EP2201063B1 (en) * 2007-10-12 2011-07-06 Dow Corning Corporation Reinforced silicone resin film and nanofiber-filled silicone composition
JP5485896B2 (en) * 2007-10-12 2014-05-07 ダウ コーニング コーポレーション Aluminum oxide dispersion and method for preparing the same
US20090171055A1 (en) * 2007-12-31 2009-07-02 John Kilgour Low temperature hydrosilylation catalyst and silicone release coatings
US20090171010A1 (en) * 2007-12-31 2009-07-02 John Kilgour Low temperature cure silicone release coatings containing branched silylhydrides
CN101544763B (en) * 2008-03-24 2011-08-31 中国科学院化学研究所 Modified silicone resin and preparation method thereof
US7919225B2 (en) * 2008-05-23 2011-04-05 International Business Machines Corporation Photopatternable dielectric materials for BEOL applications and methods for use
CN102272231B (en) * 2008-11-19 2013-10-30 陶氏康宁公司 Silicone composition and method for preparing same
JP5793824B2 (en) * 2009-06-02 2015-10-14 Jnc株式会社 Organosilicon compound, thermosetting composition containing the organosilicon compound, and sealing material for optical semiconductor
WO2011145638A1 (en) * 2010-05-18 2011-11-24 Jnc株式会社 Novel organosilicon compound and thermosetting resin composition, cured resin, and semiconductor sealing material containing said organosilicon compound
JP2012097225A (en) * 2010-11-04 2012-05-24 Daicel Corp Curable resin composition and cured article
WO2015194159A1 (en) * 2014-06-20 2015-12-23 東レ・ダウコーニング株式会社 Organopolysiloxane and method for producing same
KR102561851B1 (en) * 2015-03-20 2023-08-02 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 Organopolysiloxane, method for producing same, and curable silicone composition
US12110393B2 (en) 2018-08-17 2024-10-08 Wacker Chemie Ag Crosslinkable organopolysiloxane compositions

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US4529789A (en) * 1984-03-23 1985-07-16 Dow Corning Corporation Liquid curable polyorganosiloxane compositions
US5623030A (en) * 1994-12-01 1997-04-22 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Curable composition and process for producing molded articles using the same
US5939500A (en) * 1997-02-24 1999-08-17 Dow Corning Asia, Ltd Hydrogen-functional silylated polymethylsilsesquioxane
US6310146B1 (en) * 1999-07-01 2001-10-30 Dow Corning Corporation Silsesquioxane resin with high strength and fracture toughness and method for the preparation thereof
US20020143132A1 (en) * 2001-03-27 2002-10-03 National Institute Of Advanced Industrial Science And Technology Silsesquioxane polymer molding and method of preparing same
US6509423B1 (en) * 2001-08-21 2003-01-21 Dow Corning Corporation Silicone composition and cured silicone product

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US6646039B2 (en) * 2002-03-05 2003-11-11 Dow Corning Corporation Hydrosilyation cured silicone resin containing colloidal silica and a process for producing the same

Patent Citations (6)

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Publication number Priority date Publication date Assignee Title
US4529789A (en) * 1984-03-23 1985-07-16 Dow Corning Corporation Liquid curable polyorganosiloxane compositions
US5623030A (en) * 1994-12-01 1997-04-22 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Curable composition and process for producing molded articles using the same
US5939500A (en) * 1997-02-24 1999-08-17 Dow Corning Asia, Ltd Hydrogen-functional silylated polymethylsilsesquioxane
US6310146B1 (en) * 1999-07-01 2001-10-30 Dow Corning Corporation Silsesquioxane resin with high strength and fracture toughness and method for the preparation thereof
US20020143132A1 (en) * 2001-03-27 2002-10-03 National Institute Of Advanced Industrial Science And Technology Silsesquioxane polymer molding and method of preparing same
US6509423B1 (en) * 2001-08-21 2003-01-21 Dow Corning Corporation Silicone composition and cured silicone product

Also Published As

Publication number Publication date
CA2477970A1 (en) 2003-09-18
AU2003213207A1 (en) 2003-09-22
CN1312195C (en) 2007-04-25
EP1543064A2 (en) 2005-06-22
US20030171486A1 (en) 2003-09-11
ATE441687T1 (en) 2009-09-15
US6689859B2 (en) 2004-02-10
AU2003213207A8 (en) 2003-09-22
EP1543064B1 (en) 2009-09-02
DE60329112D1 (en) 2009-10-15
WO2003076507A2 (en) 2003-09-18
CN1656150A (en) 2005-08-17
CA2477970C (en) 2011-06-07
JP2005529986A (en) 2005-10-06
KR100961638B1 (en) 2010-06-09
EP1543064A4 (en) 2005-07-20
KR20050002838A (en) 2005-01-10
JP4557553B2 (en) 2010-10-06

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