KR870005044A - 포트라이프가 긴 2성분 경화 조성물 - Google Patents

포트라이프가 긴 2성분 경화 조성물 Download PDF

Info

Publication number
KR870005044A
KR870005044A KR860009932A KR860009932A KR870005044A KR 870005044 A KR870005044 A KR 870005044A KR 860009932 A KR860009932 A KR 860009932A KR 860009932 A KR860009932 A KR 860009932A KR 870005044 A KR870005044 A KR 870005044A
Authority
KR
South Korea
Prior art keywords
composition
component
substrate
resin mixture
weight
Prior art date
Application number
KR860009932A
Other languages
English (en)
Inventor
에이. 나티비 래리
엘. 크로프 필립
Original Assignee
유진 에프. 밀러
록타이트 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 유진 에프. 밀러, 록타이트 코포레이션 filed Critical 유진 에프. 밀러
Publication of KR870005044A publication Critical patent/KR870005044A/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C08G59/58—Amines together with other curing agents with polycarboxylic acids or with anhydrides, halides, or low-molecular-weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Dental Preparations (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

내용 없음

Description

포트라이프가 긴 2성분 경화 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (14)

  1. 제1성분은 (a) 에폭시 관응 그룹을 갖는 화합물 60 내지 95%와 아크릴레이트 또는 메타크릴레이트 에스테르 그룹을 갖는 화합물 5 내지 40%로 이루어진 수지혼합물 및 (b) 수지혼합물 중량에 대하여 0.5 내지 5%의 자유 라디칼 광개시제를 포함하며, 제2성분은 폴리옥시알킬렌, 폴리아민, 3급아민 및 그의 혼합물 중에서 선택된 아민 성분을 포함하는 2성분 경화 조성물.
  2. 제1항에 있어서, 아민 성분이 폴리옥시알킬렌디아민 75 내지 100% 및 3급 아민 0 내지 25%를 포함하는 조성물.
  3. 제2항에 있어서, 폴리옥시알킬렌폴리아민이 평균 분자량 약 200 내지 6500을 갖는 폴리옥시프로필렌폴리아민중에서 선택된 조성물.
  4. 제2항에 있어서, 3급 아민성분이 2,4,6-트리-(디메틸아미노메틸)페놀인 3급 아민 성분을 갖는 조성물.
  5. 제1항 내지 제4항중 어느 하나에 있어서, (메트)-아크릴레이트에스테르 성분이 다가 알콜의 (메트)-아크릴레이트에스테르를 포함하는 조성물.
  6. 제1항 내지 제5항중 어느 하나에 있어서, 메타크릴레이트에스테르 성분이 수지혼합물중에 15 내지 30중량% 범위로 존재하는 조성물.
  7. 제1항 내지 제6항중 어느 하나에 있어서, 광개시제 성분이 수지 혼합물중에 1 내지 3중량% 범위로 존재하는 조성물.
  8. 제1항 내지 제7항중 어느 하나에 있어서, 에폭시 관능성 화합물이 수지 혼합물중에 70 내지 85중량% 범위로 존재하는 조성물.
  9. 제1항 내지 제8항중 어느 하나에 있어서,에폭시 화합물이 다가페놀의 글리시딜폴리에테르인 조성물.
  10. 제9항에 있어서, 에폭시 화합물이 비스페놀A의 글리시딜 폴리에테르인 조성물.
  11. 제1항 내지 10항중 어느 하나의 조성물을 음영부분을 포함하는 기질에 피복하고 기질상의 조성물을 자외선으로 조성물을 부동화시키는데 충분한 시간동안 조사한 다음 상기 조성물을 주위 조건하에 완전히 경화시킴을 포함하는 자외선에 민감하지 않은 음영부분을 갖는 기질상에 경화 피복 또는 포팅재료를 피막하는 방법.
  12. 제11항에 있어서, 기질이 전자회로판 또는 성분을 포함하는 방법.
  13. 제1항 내지 10항중 어느 하나의 경화조성물로 적어도 부분적으로 피복된 피복기질.
  14. 제13항에 있어서, 전자회로판 또는 성분을 포함하는 피복기질.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR860009932A 1985-11-26 1986-11-25 포트라이프가 긴 2성분 경화 조성물 KR870005044A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US80198485A 1985-11-26 1985-11-26
US801.984 1985-11-26

Publications (1)

Publication Number Publication Date
KR870005044A true KR870005044A (ko) 1987-06-04

Family

ID=25182532

Family Applications (1)

Application Number Title Priority Date Filing Date
KR860009932A KR870005044A (ko) 1985-11-26 1986-11-25 포트라이프가 긴 2성분 경화 조성물

Country Status (5)

Country Link
EP (1) EP0245559B1 (ko)
JP (1) JPS62215624A (ko)
KR (1) KR870005044A (ko)
DE (1) DE3682398D1 (ko)
NO (1) NO167751C (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4800222A (en) * 1987-08-24 1989-01-24 Texaco Inc. Accelerator for curing epoxy resins comprising piperazine, triethanolamine and tris(dimethylaminomethyl)phenol
JPH03188102A (ja) * 1989-12-15 1991-08-16 Nippon Kasei Kk 重合硬化性組成物
CN1033982C (zh) * 1990-05-28 1997-02-05 无锡市化工研究设计院 环氧双组分透明软性封装胶的制备
GB2245892A (en) * 1990-06-27 1992-01-15 Secr Defence Improved hydrolytic stability in adhesive joints
FR2706903B1 (ko) * 1993-06-24 1995-11-17 Cray Valley Sa
ES2087815B1 (es) * 1993-10-13 1997-02-16 Mecanismos Aux Ind Mejoras introducidas en la patente de invencion n- 9200325 por perfeccionamientos en los procesos de fabricacion de cajas de servicios y de sus partes.
IT1277088B1 (it) * 1995-12-14 1997-11-04 Roofing Italiana S R L Procedimento per la sformatura rapida di manufatti in materia plastica ottenuti per stampaggio
NL1003251C2 (nl) * 1996-06-03 1997-12-10 Dsm Nv Slagvaste, transparante polymeersamenstelling en werkwijze voor de bereiding hiervan.
US6245827B1 (en) * 1999-10-12 2001-06-12 Elementis Specialties, Inc. Ultraviolet curable resin compositions having enhanced shadow cure properties
DE10326147A1 (de) 2003-06-06 2005-03-03 Byk-Chemie Gmbh Epoxid-Addukte und deren Salze als Dispergiermittel
WO2009079122A1 (en) * 2007-12-18 2009-06-25 3M Innovative Properties Company Method of coating fine wires and curable composition therefor
DE102008019196B4 (de) * 2008-04-17 2018-06-14 Vacuumschmelze Gmbh & Co. Kg Verwendung eines Zweikomponentenstrukturklebstoffes für das Verkleben von Seltenerddauermagneten
DE102018121067A1 (de) 2018-08-29 2020-03-05 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Härtbare Zweikomponentenmasse
EP4107197A4 (en) * 2020-02-18 2024-07-03 Univ Rowan ARRAY TEMPERING OF HIGH GLASS TRANSITION TEMPERATURE MATERIALS ADDITIVELY MANUFACTURED USING SEQUENTIALLY CROSS-LINKED INTERPENETRATING POLYMERS

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1484797A (en) * 1976-02-24 1977-09-08 Secr Defence Epoxide materials
AU529874B2 (en) * 1981-07-08 1983-06-23 Ppg Industries, Inc. Coating compositions containing catalyst
EP0077096A3 (en) * 1981-10-14 1984-01-11 Shell Internationale Researchmaatschappij B.V. Curable compositions and process for preparing a cured composition
US4410680A (en) * 1982-11-04 1983-10-18 Shell Oil Company Two-phase, heat-curable polyepoxide-unsaturated monomer compositions

Also Published As

Publication number Publication date
EP0245559A3 (en) 1987-12-02
EP0245559A2 (en) 1987-11-19
NO167751C (no) 1991-12-04
NO864722D0 (no) 1986-11-25
EP0245559B1 (en) 1991-11-06
NO167751B (no) 1991-08-26
DE3682398D1 (de) 1991-12-12
JPS62215624A (ja) 1987-09-22

Similar Documents

Publication Publication Date Title
KR870005044A (ko) 포트라이프가 긴 2성분 경화 조성물
KR880007683A (ko) 경화성 조성물 및 접착성 결합을 만드는 방법
KR860001167A (ko) 무용제 폴리이미드-변태 에폭시 조성물
ATE163021T1 (de) Verfahren zur beschichtung von leiterplatten
KR910018502A (ko) 열경화성 수지 조성물
ES8301149A1 (es) Un procedimiento para la produccion de un articulo recubierto por imprimacion.
DE69423710D1 (de) Verfahren zur Herstellung einer Leiterplatte unter Verwendung einer ultraviolett-härtbaren Zusammensetzung
KR880012493A (ko) 유리용기의 역학적 강도 향상방법
EP0152179A3 (en) Uv curable silicone rubber compositions
KR950000794A (ko) 필름제 액정셀 봉지(封止)용 수지조성물
DE3473462D1 (en) Compositions curable at ambient or slightly elevated temperatures comprising a polyhxdroxy compound together with a specified epoxide/carboxylic anhydride crosslinking system
ATE494329T1 (de) Vernetzungsverfahren für eine epoxidharzzusammensetzung enthaltend reaktives phosphonat
KR870010148A (ko) 프로파일 래핑(Profile Lapping) 접착방법 및 그 방법에 의한 접착조성물 제조 방법
EP0389927A3 (en) Epoxysiloxane cure promoters and accelerators for cationic uv cure systems
ES2124369T3 (es) Composicion multiple curable y su utilizacion.
DE69413823D1 (de) Verfahren zur härtung einer durch uv-strahlen härtbaren blockcopolymerzusammensetzung
DE50008195D1 (de) Verfahren zur Haftungsverbesserung von Acrylatharzen
EP0311288A3 (en) Improvements in or relating to resin compositions curable with ultraviolet light
KR900007957A (ko) 물에 의한 환원성 피복 조성물
EP0667361A3 (en) Liquid resin-forming composition and two-package system for providing the composition
JPS5496541A (en) Photosensitive resin composition
DE69213902D1 (de) Epoxydharzzusammensetzung
KR900004845A (ko) 표면파 요소용 댐핑 화합물
KR900018283A (ko) 열경화성 수지 조성물
KR900007987A (ko) 에폭시 접착제 조성물

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application