DE69423710D1 - Verfahren zur Herstellung einer Leiterplatte unter Verwendung einer ultraviolett-härtbaren Zusammensetzung - Google Patents

Verfahren zur Herstellung einer Leiterplatte unter Verwendung einer ultraviolett-härtbaren Zusammensetzung

Info

Publication number
DE69423710D1
DE69423710D1 DE69423710T DE69423710T DE69423710D1 DE 69423710 D1 DE69423710 D1 DE 69423710D1 DE 69423710 T DE69423710 T DE 69423710T DE 69423710 T DE69423710 T DE 69423710T DE 69423710 D1 DE69423710 D1 DE 69423710D1
Authority
DE
Germany
Prior art keywords
manufacturing
circuit board
curable composition
ultraviolet curable
ultraviolet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69423710T
Other languages
English (en)
Other versions
DE69423710T2 (de
Inventor
Hiromichi Noguchi
Hiroshi Sugitani
Yutaka Koizumi
Tadayoshi Inamoto
Kiyomi Aono
Yoshie Nakata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of DE69423710D1 publication Critical patent/DE69423710D1/de
Application granted granted Critical
Publication of DE69423710T2 publication Critical patent/DE69423710T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Polymerisation Methods In General (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
DE1994623710 1993-12-14 1994-12-13 Verfahren zur Herstellung einer Leiterplatte unter Verwendung einer ultraviolett-härtbaren Zusammensetzung Expired - Lifetime DE69423710T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31362093A JPH07170054A (ja) 1993-12-14 1993-12-14 紫外線硬化性組成物、これを用いたパターン形成方法及び配線基板の製造方法

Publications (2)

Publication Number Publication Date
DE69423710D1 true DE69423710D1 (de) 2000-05-04
DE69423710T2 DE69423710T2 (de) 2000-08-31

Family

ID=18043514

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1994623710 Expired - Lifetime DE69423710T2 (de) 1993-12-14 1994-12-13 Verfahren zur Herstellung einer Leiterplatte unter Verwendung einer ultraviolett-härtbaren Zusammensetzung

Country Status (5)

Country Link
US (1) US5738916A (de)
EP (1) EP0659039B1 (de)
JP (1) JPH07170054A (de)
AT (1) ATE191312T1 (de)
DE (1) DE69423710T2 (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
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JP3799069B2 (ja) * 1993-12-14 2006-07-19 キヤノン株式会社 エッチングレジスト性組成物、これを用いたパターン形成方法及び配線基板の製造方法
US6207346B1 (en) * 1997-04-09 2001-03-27 Advanced Coatings International Waterborne photoresists made from urethane acrylates
US6608119B2 (en) * 2000-02-01 2003-08-19 Seiko Epson Corporation Water-base ink, method of manufacturing the ink, and method of printing using the ink
JP5098124B2 (ja) * 2000-06-19 2012-12-12 Ｄｉｃ株式会社 活性エネルギー線硬化型インクジェット記録用水性インク組成物
JP2002012801A (ja) * 2000-06-30 2002-01-15 Toppan Forms Co Ltd 電子線硬化型インクジェット記録用インク
US6454405B1 (en) 2000-07-12 2002-09-24 Fusion Uv Systems, Inc. Apparatus and method for curing UV curable ink, coating or adhesive applied with an ink-jet applicator
US6558753B1 (en) 2000-11-09 2003-05-06 3M Innovative Properties Company Inks and other compositions incorporating limited quantities of solvent advantageously used in ink jetting applications
US7423072B2 (en) 2000-11-09 2008-09-09 3M Innovative Properties Company Weather resistant, ink jettable, radiation curable, fluid compositions particularly suitable for outdoor applications
WO2002046323A2 (en) * 2000-12-06 2002-06-13 Printar Ltd. Uv curable ink-jet legend ink for printing on printed circuit boards
US6467897B1 (en) 2001-01-08 2002-10-22 3M Innovative Properties Company Energy curable inks and other compositions incorporating surface modified, nanometer-sized particles
US6872320B2 (en) * 2001-04-19 2005-03-29 Xerox Corporation Method for printing etch masks using phase-change materials
AU2002353536A1 (en) * 2001-12-03 2003-06-17 Showa Denko K. K. Photosensitive composition and production processes for photosensitive film and printed wiring board
AU2003240751A1 (en) * 2002-03-28 2003-10-13 Huntsman Advanced Materials (Switzerland) Gmbh Polymerisable composition
US6872321B2 (en) * 2002-09-25 2005-03-29 Lsi Logic Corporation Direct positive image photo-resist transfer of substrate design
TWI288142B (en) * 2003-05-09 2007-10-11 Taiyo Ink Mfg Co Ltd Photocuring/thermosetting ink jet composition and printed wiring board using same
ATE412714T1 (de) * 2003-05-30 2008-11-15 Fujifilm Imaging Colorants Ltd Verfahren zum ätzen einer metall- oder metalllegierung oberfläche
JP2005118769A (ja) * 2003-10-15 2005-05-12 Rohm & Haas Electronic Materials Llc パターン形成
JP4744131B2 (ja) * 2004-12-09 2011-08-10 セーレン株式会社 紫外線硬化型インクジェットインク
PT1993849E (pt) * 2006-01-19 2010-11-25 Ikonics Corp Métodos de texturização digital de moldes
US8138262B2 (en) * 2006-11-21 2012-03-20 Ppg Industries Ohio, Inc. Waterborne, radiation-curable coating compositions and related methods
JP5267854B2 (ja) * 2007-08-08 2013-08-21 セイコーエプソン株式会社 光硬化型インク組成物、インクジェット記録方法及び記録物
US20100212821A1 (en) * 2007-09-24 2010-08-26 Scodix, Ltd. System and method for cold foil relief production
EP2209648A4 (de) * 2007-10-09 2011-12-28 Scodix Ltd Überdrucksystem und -verfahren
JP5255307B2 (ja) * 2008-03-27 2013-08-07 日新製鋼株式会社 エッチングレジスト用インクジェットインキ組成物
JP5114454B2 (ja) * 2009-06-04 2013-01-09 株式会社ミマキエンジニアリング インクおよびインクジェットプリンタ並びにプリント方法
JP5924430B2 (ja) * 2010-01-27 2016-05-25 セイコーエプソン株式会社 インクジェット記録システムおよび記録方法
JP5740209B2 (ja) * 2011-05-31 2015-06-24 大日精化工業株式会社 エッチングレジスト用水性インクジェットインク組成物
JP6057695B2 (ja) * 2012-12-19 2017-01-11 東洋アルミニウム株式会社 エッチングレジスト用インクジェットインキ組成物
JP5765460B2 (ja) * 2014-04-07 2015-08-19 大日本印刷株式会社 金属箔シートの製造方法
JP2016065213A (ja) * 2014-09-25 2016-04-28 株式会社ミマキエンジニアリング インク組成物、インクジェット記録装置、インクジェット記録方法および記録媒体の再利用方法
JP6339925B2 (ja) * 2014-11-27 2018-06-06 互応化学工業株式会社 インクジェットエッチングレジスト用紫外線硬化性組成物

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4100047A (en) * 1976-10-12 1978-07-11 Mobil Oil Corporation Ultraviolet curable aqueous coatings
US4303924A (en) * 1978-12-26 1981-12-01 The Mead Corporation Jet drop printing process utilizing a radiation curable ink
GB2108986B (en) * 1981-11-03 1985-06-26 Sericol Group Ltd Photopolymerisable composition for producing screen printing stencils
DE3203096A1 (de) * 1982-01-30 1983-08-04 Merck Patent Gmbh, 6100 Darmstadt Verwendung von hydroxyalkylphenonen als initiatoren fuer die strahlungshaertung waessriger prepolymerdispersionen
JPH0686504B2 (ja) * 1986-03-10 1994-11-02 キヤノン株式会社 活性エネルギ−線硬化型樹脂組成物
JPH0686505B2 (ja) * 1986-03-10 1994-11-02 キヤノン株式会社 活性エネルギ−線硬化型樹脂組成物
JPS63235382A (ja) * 1987-03-25 1988-09-30 Seiko Epson Corp インク組成物
US5068258A (en) * 1987-09-16 1991-11-26 Canon Kabushiki Kaisha Resin composition curable with an active energy ray containing half-esterificated epoxy resin as a constituent
DE3881134T2 (de) * 1987-09-16 1993-09-16 Canon Kk Strahlenhaertbare harzzusammensetzung, enthaltend ein epoxyharz und ein monomer mit einer ungesaettigten bindung.
DE3881312T2 (de) * 1987-09-16 1993-09-16 Canon Kk Strahlenhaertbare harzzusammensetzung mit einem photopolymerisierbaren polyurethan.
US5068260A (en) * 1987-09-16 1991-11-26 Canon Kabushiki Kaisha Resin composition curable with an active energy ray containing epoxy resin containing at least a compound having one or more of epoxy group in the molecule
ES2040794T3 (es) * 1987-09-16 1993-11-01 Canon Kabushiki Kaisha Compuesto de resina curable mediante radiaciones de energia activa, que contiene una resina epoxi semi-esterificada y monomero que tiene un enlace etilenicamente insaturado.
US5068263A (en) * 1987-09-16 1991-11-26 Canon Kabushiki Kaisha Resin composition curable with an active energy ray containing graft copolymerized polymer with trunk chain containing dicyclopentenyl group
DE3740149A1 (de) * 1987-11-26 1989-06-08 Herbert Dr Strohwald Verfahren zum herstellen eines leitermusters auf einem substrat
US4978969A (en) * 1989-07-05 1990-12-18 Hewlett-Packard Company Method for printing using ultra-violet curable ink
JPH0564667A (ja) * 1991-09-09 1993-03-19 Olympus Optical Co Ltd 温熱治療用アプリケータ
JP3204407B2 (ja) * 1992-01-10 2001-09-04 セイコーエプソン株式会社 インクジェットプリンタ用インクおよびその印字機構
US5270368A (en) * 1992-07-15 1993-12-14 Videojet Systems International, Inc. Etch-resistant jet ink and process

Also Published As

Publication number Publication date
EP0659039A2 (de) 1995-06-21
US5738916A (en) 1998-04-14
EP0659039A3 (de) 1996-07-17
DE69423710T2 (de) 2000-08-31
ATE191312T1 (de) 2000-04-15
JPH07170054A (ja) 1995-07-04
EP0659039B1 (de) 2000-03-29

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