KR950000794A - 필름제 액정셀 봉지(封止)용 수지조성물 - Google Patents

필름제 액정셀 봉지(封止)용 수지조성물 Download PDF

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KR950000794A
KR950000794A KR1019940013921A KR19940013921A KR950000794A KR 950000794 A KR950000794 A KR 950000794A KR 1019940013921 A KR1019940013921 A KR 1019940013921A KR 19940013921 A KR19940013921 A KR 19940013921A KR 950000794 A KR950000794 A KR 950000794A
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resin composition
liquid crystal
crystal cell
epoxy resin
skeleton
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슈우지 다하라
코오이치 마치다
세이지 이타미
마사유키 호리우치
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사또오 아키오
미쓰이도오아쓰 가가쿠 가부시키가이샤
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Abstract

풀리술피드 변성 에폭시 수지를 함유하는 에폭시 수지, 히드라지드 화합물 및 충전제를 주성분으로 하는 필름제 액정셀 봉지(封止)용 수지조성물.
그 에폭시 수지는 일반식(1)
(식중, R1및 R2는 비스페놀 골격, 지방족옥시에테르 골격 및 지방족 티오에테르 골격으로 이루어진 군으로부터 선택된 적어도 하나의 유기기(有機基)이며, R2는 -(C2H4O CH2O C2H4Sm)n-으로 표시되는 폴리술피드 골격이다. 여기서, m은 1 또는 2로서 폴리술피드 골격 중의 유황 함유량이고, n은 1-50으로서 폴리술피드 골격의 평균함유량이다)로 표시되는 폴리술피드 변성 에폭시 수지를 전체 에폭시 수지 중에 20-100중량% 함유하고, 또한 전체 에폭시 수지의 평균 분자량이 300-3000이다.
그 수지 조성물을 이용하여 제작한 필름제 액정 페널은 접착력, 내절성 및 전기특성이 우수하고, 높은 신뢰성을 갖는다.

Description

필름제 액정셀 봉지(封止)용 수지조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (14)

  1. 풀리술피드 변성 에폭시 수지를 함유하는 에폭시 수지, 히드라지드 화합물 및 충전제를 주성분으로 하는 필름제 액정셀 봉지(封止)용 수지조성물.
  2. 제1항에 있어서, 풀리술피드 변성 에폭시 수지는 전체 에폭시 수지중에 20-100중량% 함유하는 것을 특징으로 하는 필름제 액정셀 봉지용 수지조성물.
  3. 제1항에 있어서, 풀리술피드 변성 에폭시 수지는 하기 일반식(1)로 표시되는 풀리술피드 변성 에폭시 수지인 필름제 액정셀 봉지용 수지조성물;
    상기 식(1)에서, R1및 R3는 비스페놀 골격, 지방족 옥시에테르 골격 또는 지방족 티오에테르 골격으로 이루어진 군으로부터 선택된 적어도 하나의 유기기(有機基)이고, R2는 -(C2H4O CH2O C2H4Sm)n-로 표시되는 폴리술피드 골격이고, 여기서, m은 1 또는 2로서 폴리술피드 골격 중에서의 유황의 함유량이고, n은 1-50으로서 폴리술피드 골격의 평균 함유량이다.
  4. 제2항에 있어서, 풀리술피드 변성 에폭시 수지는 하기 일반식(1)로 표시되는 풀리술피드 변성 에폭시 수지인 것을 특징으로 하는 필름제 액정셀 봉지용 수지조성물;
    상기 식(1)에서, R1및 R3는 비스페놀 골격, 지방족 옥시에테르 골격 또는 지방족 티오에테르 골격으로 이루어진 군으로부터 선택된 적어도 하나의 유기기이며, R2는 -(C2H4O CH2O C2H4Sm)n-로 표시되는 폴리술피드 골격이고, 여기서, m은 1 또는 2로서 폴리술피드 골격 중에서의 유황의 함유량이고, n은 1-50으로서 폴리술피드 골격의평균 함유량이다.
  5. 제1항에 있어서, 전체 에폭시 수지의 평균 분자량은 300-3000인 것을 특징으로 하는 필름제 액정셀 봉지용 수지조성물.
  6. 제4항에 있어서, 전체 에폭시 수지의 평균 분자량은 300-3000인 것을 특징으로 하는 필름제 액정셀 봉지용 수지조성물.
  7. 제1항에 있어서, 에폭시수지는 에폭시 수지와의 그라프트 중합체인 고무를 함유하는 것을 특징으로 하는 필름제 액정셀 봉지용 수지조성물.
  8. 제7항에 있어서, 고무는 아크릴에스테르계, 실리콘계 및 공역디엔계 중의 어느 하나 또는 그들의 혼합계로 구성되며, 에폭시 수지중에 0.01~5㎛의 입경으로 분산되어 있는 것을 특징으로 하는 필름제 액정셀 봉지용 수지조성물.
  9. 제7항에 있어서, 에폭시 수지는 그 수지중에 고무를 2~30중량% 함유하는 것을 특징으로 하는 필름제 액정셀 봉지용 수지조성물.
  10. 제8항에 있어서, 에폭시 수지는 그 수지 중에 고무를 2~30중량% 함유하는 것을 특징으로 하는 필름제 액정셀 봉지용 수지조성물.
  11. 제1항에 있어서, 요소계 화합물인 경화촉진제를 함유하는 것을 특징으로 하는 필름제 액정셀 봉지용 수지조성물.
  12. 제11항에 있어서, 경화촉진제는 하기 일반식(3)으로 표시되는 요소계 화합물인 것을 특징으로 하는 필름제 액정셀 봉지용 수지조성물;
    상기 식(3)에서, X는 수소원자 또는 염소원자이다.
  13. 제11항에 있어서, 하기 일반식(3)으로 표시되는 요소계 화합물은 수지조성물 중에 0.2-5중량% 함유하는 것을 특징으로 하는 필름제 액정셀 봉지용 수지조성물;
    상기 식(3)에서, X는 수소원자 또는 염소원자이다.
  14. 제1항 내지 제13항중 어느 한 항에 따른 수지조성물을 필름제 셀기재 위에 도포하고, 예비경화한 후, 셀용 피착재(披着材)를 붙여 가열 경화함으로써 제조되는 필름제 액정셀.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940013921A 1993-06-29 1994-06-20 필름제 액정셀 봉지용 수지조성물 KR0163981B1 (ko)

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DE69409439T2 (de) 1998-11-05
US5635259A (en) 1997-06-03
US5665797A (en) 1997-09-09
HK1007382A1 (en) 1999-04-09
CN1103103A (zh) 1995-05-31
DE69409439D1 (de) 1998-05-14
CN1061360C (zh) 2001-01-31
EP0632080B1 (en) 1998-04-08
EP0632080A1 (en) 1995-01-04
KR0163981B1 (ko) 1999-01-15

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