HK1007382A1 - Resin composition for sealing film-made liquid crystal cells - Google Patents

Resin composition for sealing film-made liquid crystal cells

Info

Publication number
HK1007382A1
HK1007382A1 HK98106568A HK98106568A HK1007382A1 HK 1007382 A1 HK1007382 A1 HK 1007382A1 HK 98106568 A HK98106568 A HK 98106568A HK 98106568 A HK98106568 A HK 98106568A HK 1007382 A1 HK1007382 A1 HK 1007382A1
Authority
HK
Hong Kong
Prior art keywords
liquid crystal
resin composition
sealing film
crystal cells
made liquid
Prior art date
Application number
HK98106568A
Other languages
English (en)
Inventor
Seiji Itami
Syuji Tahara
Koichi Machida
Masayuki Horiuchi
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Publication of HK1007382A1 publication Critical patent/HK1007382A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/302—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4035—Hydrazines; Hydrazides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/08—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C09K2323/05—Bonding or intermediate layer characterised by chemical composition, e.g. sealant or spacer
    • C09K2323/055—Epoxy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31525—Next to glass or quartz

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Nonlinear Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
  • Liquid Crystal (AREA)
HK98106568A 1993-06-29 1998-06-25 Resin composition for sealing film-made liquid crystal cells HK1007382A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15928893 1993-06-29

Publications (1)

Publication Number Publication Date
HK1007382A1 true HK1007382A1 (en) 1999-04-09

Family

ID=15690527

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98106568A HK1007382A1 (en) 1993-06-29 1998-06-25 Resin composition for sealing film-made liquid crystal cells

Country Status (7)

Country Link
US (2) US5635259A (xx)
EP (1) EP0632080B1 (xx)
KR (1) KR0163981B1 (xx)
CN (1) CN1061360C (xx)
DE (1) DE69409439T2 (xx)
HK (1) HK1007382A1 (xx)
SG (1) SG48269A1 (xx)

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EP0703485B1 (en) * 1994-09-26 2002-06-05 Matsushita Electric Industrial Co., Ltd. Liquid crystal display panel and method and device for manufacturing the same
US5981629A (en) * 1995-03-31 1999-11-09 Cork; Michael S. Epoxy system for bonding to unsanded polymer-coated fiberglass surfaces
JP3663861B2 (ja) * 1997-12-03 2005-06-22 三菱瓦斯化学株式会社 新規な樹脂用組成物
CN1175043C (zh) 1999-04-01 2004-11-10 三井化学株式会社 液晶密封剂组合物
US6812065B1 (en) * 1999-04-01 2004-11-02 Mitsui Chemicals, Inc. Anisotropic conductive paste
KR100611878B1 (ko) * 1999-06-30 2006-08-11 다이요 유덴 가부시키가이샤 전자재료 조성물, 전자 용품 및 전자재료 조성물의 사용방법
WO2001044342A1 (en) * 1999-12-14 2001-06-21 Mitsui Chemicals, Inc. Sealing agent for liquid-crystal display cell, composition for sealing agent for liquid-crystal display cell, and liquid-crystal display element
TWI298412B (xx) * 2000-06-21 2008-07-01 Mitsui Chemicals Inc
TW200303439A (en) * 2002-02-04 2003-09-01 Mitsui Chemicals Inc Method for producing liquid crystal display cell and sealing agent for liquid crystal display cell
KR100741897B1 (ko) * 2002-03-22 2007-07-24 엘지.필립스 엘시디 주식회사 가스 온도 조절 기능을 갖는 합착 장치
US7693914B2 (en) * 2002-05-09 2010-04-06 Shachar Oren Systems and methods for the production, management, syndication and distribution of digital assets through a network
AU2003277551A1 (en) * 2002-11-06 2004-06-07 Nippon Kayaku Kabushiki Kaisha Sealing material for liquid crystal and liquid crystal display cell using same
WO2004090621A1 (ja) 2003-04-08 2004-10-21 Nippon Kayaku Kabushiki Kaisha 液晶シール剤およびそれを用いた液晶表示セル
US7239693B2 (en) * 2003-06-30 2007-07-03 Bellsouth Intellectual Property Corporation Network-based timed ring suppression
WO2005012991A1 (en) * 2003-08-04 2005-02-10 Koninklijke Philips Electronics N.V. Display device and method for manufacturing a display device
CN100404579C (zh) * 2003-11-26 2008-07-23 三井化学株式会社 单液型光热并用固化性树脂组合物及其用途
JP2005272712A (ja) * 2004-03-25 2005-10-06 Cemedine Henkel Co Ltd 硬化性組成物
JP4844559B2 (ja) * 2006-03-16 2011-12-28 東レ株式会社 ポリフェニレンスルフィド樹脂組成物、その製造方法および成形品
US20130128435A1 (en) * 2010-07-29 2013-05-23 Yasushi Mizuta Composition, composition being for end-face sealing display devices and consisting of the composition, display devices, and process for producing same
TWI491638B (zh) * 2010-11-16 2015-07-11 Ind Tech Res Inst 熱硬化型組成物
AT12695U1 (de) 2011-04-08 2012-10-15 Plansee Se Rohrtarget mit schutzvorrichtung
US9334432B2 (en) * 2013-11-20 2016-05-10 Ppg Industries Ohio, Inc. Curable compositions that include hydrazide functional materials
CN106773362B (zh) * 2017-03-09 2020-02-11 京东方科技集团股份有限公司 显示面板及其制造方法、显示装置
US11437162B2 (en) 2019-12-31 2022-09-06 Industrial Technology Research Institute Conductive material composition and conductive material prepared therefrom
CN114106742B (zh) * 2021-11-01 2023-03-14 苏州润邦半导体材料科技有限公司 一种高粘度液晶封框胶

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Also Published As

Publication number Publication date
DE69409439D1 (de) 1998-05-14
DE69409439T2 (de) 1998-11-05
EP0632080A1 (en) 1995-01-04
US5635259A (en) 1997-06-03
EP0632080B1 (en) 1998-04-08
CN1103103A (zh) 1995-05-31
KR0163981B1 (ko) 1999-01-15
KR950000794A (ko) 1995-01-03
US5665797A (en) 1997-09-09
SG48269A1 (en) 1998-04-17
CN1061360C (zh) 2001-01-31

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)