NO864722D0 - Tokomponents herdbart preparat. - Google Patents

Tokomponents herdbart preparat.

Info

Publication number
NO864722D0
NO864722D0 NO864722A NO864722A NO864722D0 NO 864722 D0 NO864722 D0 NO 864722D0 NO 864722 A NO864722 A NO 864722A NO 864722 A NO864722 A NO 864722A NO 864722 D0 NO864722 D0 NO 864722D0
Authority
NO
Norway
Prior art keywords
components
hardenable
preparation
hardenable preparation
components hardenable
Prior art date
Application number
NO864722A
Other languages
English (en)
Other versions
NO167751C (no
NO167751B (no
Inventor
Larry A Nativi
Philip L Kropp
Original Assignee
Loctite Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Loctite Corp filed Critical Loctite Corp
Publication of NO864722D0 publication Critical patent/NO864722D0/no
Publication of NO167751B publication Critical patent/NO167751B/no
Publication of NO167751C publication Critical patent/NO167751C/no

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/56Amines together with other curing agents
    • C08G59/58Amines together with other curing agents with polycarboxylic acids or with anhydrides, halides, or low-molecular-weight esters thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/285Permanent coating compositions
    • H05K3/287Photosensitive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Dental Preparations (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
NO864722A 1985-11-26 1986-11-25 Tokomponents herdbart preparat, samt anvendelse av det. NO167751C (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US80198485A 1985-11-26 1985-11-26

Publications (3)

Publication Number Publication Date
NO864722D0 true NO864722D0 (no) 1986-11-25
NO167751B NO167751B (no) 1991-08-26
NO167751C NO167751C (no) 1991-12-04

Family

ID=25182532

Family Applications (1)

Application Number Title Priority Date Filing Date
NO864722A NO167751C (no) 1985-11-26 1986-11-25 Tokomponents herdbart preparat, samt anvendelse av det.

Country Status (5)

Country Link
EP (1) EP0245559B1 (no)
JP (1) JPS62215624A (no)
KR (1) KR870005044A (no)
DE (1) DE3682398D1 (no)
NO (1) NO167751C (no)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4800222A (en) * 1987-08-24 1989-01-24 Texaco Inc. Accelerator for curing epoxy resins comprising piperazine, triethanolamine and tris(dimethylaminomethyl)phenol
JPH03188102A (ja) * 1989-12-15 1991-08-16 Nippon Kasei Kk 重合硬化性組成物
CN1033982C (zh) * 1990-05-28 1997-02-05 无锡市化工研究设计院 环氧双组分透明软性封装胶的制备
GB2245892A (en) * 1990-06-27 1992-01-15 Secr Defence Improved hydrolytic stability in adhesive joints
FR2706903B1 (no) * 1993-06-24 1995-11-17 Cray Valley Sa
ES2087815B1 (es) * 1993-10-13 1997-02-16 Mecanismos Aux Ind Mejoras introducidas en la patente de invencion n- 9200325 por perfeccionamientos en los procesos de fabricacion de cajas de servicios y de sus partes.
IT1277088B1 (it) * 1995-12-14 1997-11-04 Roofing Italiana S R L Procedimento per la sformatura rapida di manufatti in materia plastica ottenuti per stampaggio
NL1003251C2 (nl) * 1996-06-03 1997-12-10 Dsm Nv Slagvaste, transparante polymeersamenstelling en werkwijze voor de bereiding hiervan.
US6245827B1 (en) * 1999-10-12 2001-06-12 Elementis Specialties, Inc. Ultraviolet curable resin compositions having enhanced shadow cure properties
DE10326147A1 (de) 2003-06-06 2005-03-03 Byk-Chemie Gmbh Epoxid-Addukte und deren Salze als Dispergiermittel
CN101903999A (zh) * 2007-12-18 2010-12-01 3M创新有限公司 涂覆细线材的方法及用于涂覆的可固化组合物
DE102008019196B4 (de) * 2008-04-17 2018-06-14 Vacuumschmelze Gmbh & Co. Kg Verwendung eines Zweikomponentenstrukturklebstoffes für das Verkleben von Seltenerddauermagneten
DE102018121067A1 (de) 2018-08-29 2020-03-05 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Härtbare Zweikomponentenmasse
JP2023514315A (ja) * 2020-02-18 2023-04-05 ローワン・ユニバーシティ 逐次硬化相互侵入ポリマーによる付加製造高ガラス転移温度材料の網目構造強靭化

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1484797A (en) * 1976-02-24 1977-09-08 Secr Defence Epoxide materials
AU529874B2 (en) * 1981-07-08 1983-06-23 Ppg Industries, Inc. Coating compositions containing catalyst
EP0077096A3 (en) * 1981-10-14 1984-01-11 Shell Internationale Researchmaatschappij B.V. Curable compositions and process for preparing a cured composition
US4410680A (en) * 1982-11-04 1983-10-18 Shell Oil Company Two-phase, heat-curable polyepoxide-unsaturated monomer compositions

Also Published As

Publication number Publication date
NO167751C (no) 1991-12-04
NO167751B (no) 1991-08-26
EP0245559A2 (en) 1987-11-19
EP0245559A3 (en) 1987-12-02
JPS62215624A (ja) 1987-09-22
KR870005044A (ko) 1987-06-04
EP0245559B1 (en) 1991-11-06
DE3682398D1 (de) 1991-12-12

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