SG11201402889YA - Resin composition, prepreg, and laminate - Google Patents
Resin composition, prepreg, and laminateInfo
- Publication number
- SG11201402889YA SG11201402889YA SG11201402889YA SG11201402889YA SG11201402889YA SG 11201402889Y A SG11201402889Y A SG 11201402889YA SG 11201402889Y A SG11201402889Y A SG 11201402889YA SG 11201402889Y A SG11201402889Y A SG 11201402889YA SG 11201402889Y A SG11201402889Y A SG 11201402889YA
- Authority
- SG
- Singapore
- Prior art keywords
- prepreg
- laminate
- resin composition
- resin
- composition
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
- B32B2260/023—Two or more layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/07—Parts immersed or impregnated in a matrix
- B32B2305/076—Prepregs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31522—Next to metal
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011267935 | 2011-12-07 | ||
PCT/JP2012/081100 WO2013084819A1 (en) | 2011-12-07 | 2012-11-30 | Resin composition, prepreg, and laminate |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201402889YA true SG11201402889YA (en) | 2014-11-27 |
Family
ID=48574186
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201402889YA SG11201402889YA (en) | 2011-12-07 | 2012-11-30 | Resin composition, prepreg, and laminate |
Country Status (8)
Country | Link |
---|---|
US (1) | US9706651B2 (en) |
EP (1) | EP2789637A4 (en) |
JP (2) | JPWO2013084819A1 (en) |
KR (1) | KR101969191B1 (en) |
CN (1) | CN103987753B (en) |
SG (1) | SG11201402889YA (en) |
TW (1) | TWI555766B (en) |
WO (1) | WO2013084819A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2743283B1 (en) | 2011-08-09 | 2016-05-25 | Mitsubishi Gas Chemical Company, Inc. | Novel cyanic acid ester compound, method for producing same, curable resin composition containing novel cyanic acid ester compound, and cured product of curable resin composition |
CN103987753B (en) * | 2011-12-07 | 2016-06-08 | 三菱瓦斯化学株式会社 | Resin combination, prepreg and plywood |
KR102157499B1 (en) * | 2013-06-18 | 2020-09-18 | 미츠비시 가스 가가쿠 가부시키가이샤 | Resin composition, prepreg, resin sheet and metal foil-clad laminate |
US10160824B2 (en) | 2013-06-18 | 2018-12-25 | Mitsubishi Gas Chemical Company, Inc. | Cyanate ester compound, curable resin composition containing said compound, and cured product of said composition |
EP3252101B1 (en) * | 2015-01-30 | 2019-04-17 | Mitsubishi Gas Chemical Company, Inc. | Resin composition for printed wiring board, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board |
SG11201708157RA (en) * | 2015-04-07 | 2017-11-29 | Mitsubishi Gas Chemical Co | Material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography and pattern forming method |
WO2018216647A1 (en) * | 2017-05-26 | 2018-11-29 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, resin sheet, metal foil-clad laminate, printed wiring board, and production method for resin composition |
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DE1720663C3 (en) * | 1967-06-01 | 1975-09-18 | Bayer Ag, 5090 Leverkusen | Process for the production of plastics |
JPS52154857A (en) | 1976-06-18 | 1977-12-22 | Mitsubishi Gas Chem Co Inc | Composition containing cyanic ester resin |
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US4978727A (en) | 1986-01-23 | 1990-12-18 | Allied-Signal | Cyanato group containing phenolic resins, phenolic triazines derived therefrom |
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EP0324908A3 (en) | 1987-12-28 | 1990-11-07 | AlliedSignal Inc. | Improved friction resistant composition |
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JPH02214763A (en) | 1989-02-16 | 1990-08-27 | Mitsubishi Gas Chem Co Inc | Thermosetting molding material |
JPH02286723A (en) | 1989-04-28 | 1990-11-26 | Matsushita Electric Works Ltd | Laminating resin composition and laminate |
JPH0424370A (en) | 1990-05-18 | 1992-01-28 | Chubu Rekisei:Kk | Inner fitting work for prefabricated bath room |
JP3240662B2 (en) | 1992-02-13 | 2001-12-17 | 三菱瓦斯化学株式会社 | Heat resistant resin dust |
JP3435496B2 (en) | 1992-07-29 | 2003-08-11 | 鐘淵化学工業株式会社 | Curable flame-retardant resin composition, prepreg produced therefrom and laminate for flame-retardant electricity |
EP0581268B1 (en) | 1992-07-29 | 1997-12-29 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Flame-retarded thermosetting resin composition, prepregs and electrical laminates made therefrom |
JPH0649238A (en) | 1992-07-29 | 1994-02-22 | Kanegafuchi Chem Ind Co Ltd | Prepreg and laminate for electricity |
JPH06228308A (en) | 1992-12-29 | 1994-08-16 | Internatl Business Mach Corp <Ibm> | Triazine polymer and its use |
JP3319061B2 (en) | 1993-08-20 | 2002-08-26 | 住友化学工業株式会社 | Method for producing cyanate compound |
JPH07207022A (en) | 1994-01-24 | 1995-08-08 | Sumitomo Bakelite Co Ltd | Low-permittivity thermosetting resin composition |
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JP3309661B2 (en) * | 1995-08-14 | 2002-07-29 | 信越化学工業株式会社 | Epoxy resin composition and semiconductor device |
US5756592A (en) | 1995-11-27 | 1998-05-26 | Alliedsignal, Inc. | Process for the production of cyanate ester resins having unique composition |
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JPH11124433A (en) | 1997-10-22 | 1999-05-11 | Mitsubishi Gas Chem Co Inc | Phenol novolak-based cyanic acid ester prepolymer |
JP2000095938A (en) | 1998-09-24 | 2000-04-04 | Hitachi Chem Co Ltd | Production of flame-retardant resin composition for printed wiring board and such composition obtained thereby |
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JP2000191776A (en) | 1998-12-24 | 2000-07-11 | Mitsubishi Gas Chem Co Inc | Cyanate ester-coprepolymer |
KR20050055042A (en) | 2000-03-21 | 2005-06-10 | 히다치 가세고교 가부시끼가이샤 | Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepreg made with these, and metal-clad laminate |
JP4872160B2 (en) | 2000-03-21 | 2012-02-08 | 日立化成工業株式会社 | Resin composition having excellent dielectric properties, varnish produced using the same, varnish production method, prepreg and metal-clad laminate |
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JP2003128784A (en) | 2001-10-19 | 2003-05-08 | Hitachi Chem Co Ltd | Flame-retardant thermosetting resin composition, prepreg, electrical insulation film, laminated board, resin-coated metallic foil and multilayer wiring board, and method for producing them |
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KR20100094586A (en) | 2002-09-30 | 2010-08-26 | 히다치 가세고교 가부시끼가이샤 | Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same |
JP2004175925A (en) * | 2002-11-27 | 2004-06-24 | Mitsubishi Gas Chem Co Inc | Prepreg and laminate |
JP2004182850A (en) * | 2002-12-03 | 2004-07-02 | Mitsubishi Gas Chem Co Inc | Prepreg having excellent balance of characteristics and laminated sheet |
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JP4407823B2 (en) | 2004-02-18 | 2010-02-03 | 三菱瓦斯化学株式会社 | Novel cyanate ester compound, flame retardant resin composition, and cured product thereof |
KR101229854B1 (en) | 2005-02-25 | 2013-02-05 | 니폰 가야꾸 가부시끼가이샤 | Epoxy resin, hardenable resin composition containing the same and use thereof |
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KR101466181B1 (en) | 2007-10-29 | 2014-11-27 | 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 | Resin composition, prepreg and laminate using the same |
CN101735108A (en) | 2009-12-02 | 2010-06-16 | 华东理工大学 | Novel o-methyl binary cyanate resin and preparation method thereof |
JP2010174242A (en) | 2009-12-28 | 2010-08-12 | Sumitomo Bakelite Co Ltd | Biphenyl aralkyl type cyanate ester resin, resin composition containing biphenyl aralkyl type cyanate ester resin, and prepreg, laminated plate, resin sheet, multilayer printed wiring board, and semiconductor device obtained using the resin composition |
TW201204548A (en) * | 2010-02-05 | 2012-02-01 | Sumitomo Bakelite Co | Prepreg, laminate, printed wiring board, and semiconductor device |
CN101948408A (en) | 2010-09-09 | 2011-01-19 | 华东理工大学 | Novel preparation method of paraxylene-base binary cyanate resin |
EP2634205A4 (en) | 2010-10-29 | 2016-12-28 | Mitsubishi Gas Chemical Co | Cyanate ester compound, curable resin composition containing cyanate ester compound, and cured product thereof |
EP2743283B1 (en) * | 2011-08-09 | 2016-05-25 | Mitsubishi Gas Chemical Company, Inc. | Novel cyanic acid ester compound, method for producing same, curable resin composition containing novel cyanic acid ester compound, and cured product of curable resin composition |
CN103987753B (en) * | 2011-12-07 | 2016-06-08 | 三菱瓦斯化学株式会社 | Resin combination, prepreg and plywood |
-
2012
- 2012-11-30 CN CN201280060750.7A patent/CN103987753B/en active Active
- 2012-11-30 US US14/362,200 patent/US9706651B2/en active Active
- 2012-11-30 JP JP2013548212A patent/JPWO2013084819A1/en active Pending
- 2012-11-30 EP EP12855539.8A patent/EP2789637A4/en not_active Withdrawn
- 2012-11-30 SG SG11201402889YA patent/SG11201402889YA/en unknown
- 2012-11-30 KR KR1020147015242A patent/KR101969191B1/en active IP Right Grant
- 2012-11-30 WO PCT/JP2012/081100 patent/WO2013084819A1/en active Application Filing
- 2012-12-04 TW TW101145471A patent/TWI555766B/en active
-
2016
- 2016-11-29 JP JP2016231008A patent/JP6278218B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR20140109376A (en) | 2014-09-15 |
CN103987753B (en) | 2016-06-08 |
JPWO2013084819A1 (en) | 2015-04-27 |
KR101969191B1 (en) | 2019-04-15 |
US9706651B2 (en) | 2017-07-11 |
TWI555766B (en) | 2016-11-01 |
JP6278218B2 (en) | 2018-02-14 |
TW201329120A (en) | 2013-07-16 |
WO2013084819A1 (en) | 2013-06-13 |
CN103987753A (en) | 2014-08-13 |
EP2789637A1 (en) | 2014-10-15 |
JP2017048399A (en) | 2017-03-09 |
EP2789637A4 (en) | 2015-07-22 |
US20140329066A1 (en) | 2014-11-06 |
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