SG11201401958TA - Resin composition, prepreg, and laminate - Google Patents
Resin composition, prepreg, and laminateInfo
- Publication number
- SG11201401958TA SG11201401958TA SG11201401958TA SG11201401958TA SG11201401958TA SG 11201401958T A SG11201401958T A SG 11201401958TA SG 11201401958T A SG11201401958T A SG 11201401958TA SG 11201401958T A SG11201401958T A SG 11201401958TA SG 11201401958T A SG11201401958T A SG 11201401958TA
- Authority
- SG
- Singapore
- Prior art keywords
- prepreg
- laminate
- resin composition
- resin
- composition
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/243—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using carbon fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/315—Compounds containing carbon-to-nitrogen triple bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
- C08L65/02—Polyphenylenes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31529—Next to metal
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011241172 | 2011-11-02 | ||
| PCT/JP2012/078062 WO2013065694A1 (en) | 2011-11-02 | 2012-10-30 | Resin composition, prepreg, and laminated sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201401958TA true SG11201401958TA (en) | 2014-09-26 |
Family
ID=48192040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201401958TA SG11201401958TA (en) | 2011-11-02 | 2012-10-30 | Resin composition, prepreg, and laminate |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9527979B2 (en) |
| EP (1) | EP2774938B1 (en) |
| JP (1) | JP5988176B2 (en) |
| KR (1) | KR101958046B1 (en) |
| CN (1) | CN103917571B (en) |
| SG (1) | SG11201401958TA (en) |
| TW (1) | TWI565752B (en) |
| WO (1) | WO2013065694A1 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016072224A1 (en) * | 2014-11-04 | 2016-05-12 | 太陽ホールディングス株式会社 | Wiring board material and wiring board using same |
| US20180009935A1 (en) | 2015-03-18 | 2018-01-11 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board |
| EP3287479B1 (en) * | 2015-04-21 | 2019-11-27 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board |
| CN107531882A (en) * | 2015-04-28 | 2018-01-02 | 三菱瓦斯化学株式会社 | Resin combination, prepreg, clad with metal foil plywood, resin sheet and printed circuit board (PCB) |
| CN109071745B (en) | 2016-03-31 | 2021-11-05 | 三菱瓦斯化学株式会社 | Cyanate ester compound, method for producing same, resin composition, cured product, and product thereof |
| TWI609382B (en) * | 2016-07-26 | 2017-12-21 | 台灣太陽油墨股份有限公司 | Dielectric material composition, insulated film and circuit board containing the same |
| CN109071772A (en) | 2016-09-12 | 2018-12-21 | 三菱瓦斯化学株式会社 | Resin combination, prepreg, clad with metal foil plywood, resin sheet and printed circuit board |
| KR102099545B1 (en) | 2017-01-26 | 2020-04-09 | 미츠비시 가스 가가쿠 가부시키가이샤 | Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board |
| KR102090439B1 (en) | 2017-08-31 | 2020-03-17 | 미츠비시 가스 가가쿠 가부시키가이샤 | Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board |
| CN112204108B (en) | 2018-06-01 | 2022-12-27 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1248667B (en) | 1963-02-16 | 1967-08-31 | Farbenfabriken Bayer Aktiengesellschaft Leverkusen | |
| JP3319061B2 (en) | 1993-08-20 | 2002-08-26 | 住友化学工業株式会社 | Method for producing cyanate compound |
| JP3166442B2 (en) | 1993-10-01 | 2001-05-14 | 株式会社日立製作所 | Multilayer wiring board and method of manufacturing the same |
| JP2991054B2 (en) | 1994-09-20 | 1999-12-20 | 住友化学工業株式会社 | Method for producing cyanate compound |
| US5756592A (en) | 1995-11-27 | 1998-05-26 | Alliedsignal, Inc. | Process for the production of cyanate ester resins having unique composition |
| WO1998023584A1 (en) | 1996-11-29 | 1998-06-04 | Lonza Ag | Method for producing arylcyanates |
| JPH11124433A (en) | 1997-10-22 | 1999-05-11 | Mitsubishi Gas Chem Co Inc | Phenol novolak-based cyanic acid ester prepolymer |
| JP2000191776A (en) | 1998-12-24 | 2000-07-11 | Mitsubishi Gas Chem Co Inc | Cyanate ester-coprepolymer |
| JP4407823B2 (en) * | 2004-02-18 | 2010-02-03 | 三菱瓦斯化学株式会社 | Novel cyanate ester compound, flame retardant resin composition, and cured product thereof |
| US20050182203A1 (en) * | 2004-02-18 | 2005-08-18 | Yuuichi Sugano | Novel cyanate ester compound, flame-retardant resin composition, and cured product thereof |
| US9169356B2 (en) | 2005-10-25 | 2015-10-27 | Mitsubishi Gas Chemical Company, Inc. | Cyanate ester polymer |
| JP5026727B2 (en) | 2006-04-03 | 2012-09-19 | 三菱瓦斯化学株式会社 | Method for producing high purity cyanate ester |
| JP5024205B2 (en) * | 2007-07-12 | 2012-09-12 | 三菱瓦斯化学株式会社 | Prepreg and laminate |
| JP2010174242A (en) | 2009-12-28 | 2010-08-12 | Sumitomo Bakelite Co Ltd | Biphenyl aralkyl type cyanate ester resin, resin composition containing biphenyl aralkyl type cyanate ester resin, and prepreg, laminated plate, resin sheet, multilayer printed wiring board, and semiconductor device obtained using the resin composition |
| TW201204548A (en) * | 2010-02-05 | 2012-02-01 | Sumitomo Bakelite Co | Prepreg, laminate, printed wiring board, and semiconductor device |
-
2012
- 2012-10-30 KR KR1020147011791A patent/KR101958046B1/en active IP Right Grant
- 2012-10-30 WO PCT/JP2012/078062 patent/WO2013065694A1/en active Application Filing
- 2012-10-30 JP JP2013541789A patent/JP5988176B2/en active Active
- 2012-10-30 EP EP12846152.2A patent/EP2774938B1/en active Active
- 2012-10-30 US US14/355,674 patent/US9527979B2/en active Active
- 2012-10-30 SG SG11201401958TA patent/SG11201401958TA/en unknown
- 2012-10-30 CN CN201280053929.XA patent/CN103917571B/en active Active
- 2012-11-01 TW TW101140595A patent/TWI565752B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| US20140377565A1 (en) | 2014-12-25 |
| JP5988176B2 (en) | 2016-09-07 |
| KR20140097146A (en) | 2014-08-06 |
| TW201326297A (en) | 2013-07-01 |
| EP2774938A1 (en) | 2014-09-10 |
| CN103917571B (en) | 2016-01-20 |
| CN103917571A (en) | 2014-07-09 |
| JPWO2013065694A1 (en) | 2015-04-02 |
| US9527979B2 (en) | 2016-12-27 |
| TWI565752B (en) | 2017-01-11 |
| KR101958046B1 (en) | 2019-03-13 |
| EP2774938B1 (en) | 2016-02-03 |
| WO2013065694A1 (en) | 2013-05-10 |
| EP2774938A4 (en) | 2015-07-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SG10201602081SA (en) | Resin composition, prepreg, and laminate | |
| EP2716676A4 (en) | Resin composition, prepreg and laminate | |
| SG11201401906SA (en) | Resin composition, and prepreg and laminate using the same | |
| SG11201406174PA (en) | Resin composition, prepreg, and laminate | |
| SG10201600443SA (en) | Resin composition, and prepreg as well as laminate using the same | |
| SG10201501469PA (en) | Resin composition, prepreg, and laminated sheet | |
| EP2612879A4 (en) | Polyimide resin composition and laminate including same | |
| EP2557121A4 (en) | Resin composition, prepreg and laminate | |
| EP2578631A4 (en) | Resin composition, and prepreg and laminated sheet using same | |
| PL2750886T3 (en) | Laminate composition, film and related methods | |
| EP2612885A4 (en) | Resin composition, prepreg, and laminate | |
| SG11201502925UA (en) | Resin composition, prepreg, laminate and printed-wiring board | |
| EP2572879A4 (en) | Synthetic resin laminate | |
| EP2690120A4 (en) | Resin composition, prepreg and resin sheet, and metal foil-clad laminate | |
| HK1212720A1 (en) | Resin composition, prepreg, and film | |
| SG11201401958TA (en) | Resin composition, prepreg, and laminate | |
| SG10201509881VA (en) | Resin composition, prepreg, and laminate | |
| SG11201404727XA (en) | Resin composition, prepreg, resin sheet, and metal foil-clad laminate | |
| EP2762507A4 (en) | Resin composition, prepreg, and metal foil-clad laminate | |
| SG11201405224QA (en) | Resin composition, prepreg, and metal foil-clad laminate | |
| EP2770000A4 (en) | Active-energy-ray-curable resin composition, adhesive, and laminate film | |
| SG10201600489PA (en) | Resin composition, prepreg, and metal foil-clad laminate | |
| EP2682425A4 (en) | Resin composition and laminated body | |
| EP2664454A4 (en) | Metal-rubber laminate material | |
| EP2735580A4 (en) | Polyimide resin, resin composition and laminated film that use same |