DE69807793D1 - Mit einem Cyanatester modifizierte härtbare Harzzusammensetzung und daraus hergestellter Lack, Prepreg, mit Metall bedeckte Schichtplatte, Film, gedruckte Leiterplatte und Mehrschichtleiterplatte - Google Patents

Mit einem Cyanatester modifizierte härtbare Harzzusammensetzung und daraus hergestellter Lack, Prepreg, mit Metall bedeckte Schichtplatte, Film, gedruckte Leiterplatte und Mehrschichtleiterplatte

Info

Publication number
DE69807793D1
DE69807793D1 DE69807793T DE69807793T DE69807793D1 DE 69807793 D1 DE69807793 D1 DE 69807793D1 DE 69807793 T DE69807793 T DE 69807793T DE 69807793 T DE69807793 T DE 69807793T DE 69807793 D1 DE69807793 D1 DE 69807793D1
Authority
DE
Germany
Prior art keywords
circuit board
prepreg
film
resin composition
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69807793T
Other languages
English (en)
Other versions
DE69807793T2 (de
Inventor
Shigeo Sase
Yasuyuki Mizuno
Takeshi Sugimura
Harumi Negishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP17957297A external-priority patent/JP3261076B2/ja
Priority claimed from JP18114497A external-priority patent/JP3261078B2/ja
Priority claimed from JP29057697A external-priority patent/JP3315630B2/ja
Priority claimed from JP29057997A external-priority patent/JP3315631B2/ja
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Application granted granted Critical
Publication of DE69807793D1 publication Critical patent/DE69807793D1/de
Publication of DE69807793T2 publication Critical patent/DE69807793T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0066—Flame-proofing or flame-retarding additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34924—Triazines containing cyanurate groups; Tautomers thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/123—Polyphenylene oxides not modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
DE69807793T 1997-07-04 1998-06-30 Mit einem Cyanatester modifizierte härtbare Harzzusammensetzung und daraus hergestellter Lack, Prepreg, mit Metall bedeckte Schichtplatte, Film, gedruckte Leiterplatte und Mehrschichtleiterplatte Expired - Lifetime DE69807793T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP17957297A JP3261076B2 (ja) 1997-07-04 1997-07-04 積層板用変性シアネートエステル系硬化性樹脂組成物並びにこれを用いたプリプレグ及び積層板
JP18114497A JP3261078B2 (ja) 1997-07-07 1997-07-07 積層板用変性シアネートエステル系硬化性樹脂組成物及びこれを用いたプリプレグ，積層板
JP29057697A JP3315630B2 (ja) 1997-10-23 1997-10-23 難燃性変性シアネートエステル系樹脂フィルム及びその製造方法
JP29057997A JP3315631B2 (ja) 1997-10-23 1997-10-23 難燃性変性シアネートエステル系樹脂フィルム及びその製造方法

Publications (2)

Publication Number Publication Date
DE69807793D1 true DE69807793D1 (de) 2002-10-17
DE69807793T2 DE69807793T2 (de) 2003-08-14

Family

ID=27474891

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69807793T Expired - Lifetime DE69807793T2 (de) 1997-07-04 1998-06-30 Mit einem Cyanatester modifizierte härtbare Harzzusammensetzung und daraus hergestellter Lack, Prepreg, mit Metall bedeckte Schichtplatte, Film, gedruckte Leiterplatte und Mehrschichtleiterplatte

Country Status (3)

Country Link
US (2) US6156831A (de)
EP (1) EP0889096B1 (de)
DE (1) DE69807793T2 (de)

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* Cited by examiner, † Cited by third party
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US6245841B1 (en) 1998-03-23 2001-06-12 General Electric Company Cyanate ester based thermoset compositions
US6194495B1 (en) 1998-03-23 2001-02-27 General Electric Company Cyanate ester based thermoset compositions
US6162876A (en) * 1998-03-23 2000-12-19 General Electric Company Cyanate ester based thermoset compositions
TWI279419B (en) * 2000-03-21 2007-04-21 Hitachi Chemical Co Ltd Resin composition having excellent dielectric characteristics, varnish manufactured thereby, manufacturing method of varnish, prepreg, and metal- clad laminated sheet
KR20020087287A (ko) 2001-05-15 2002-11-22 삼성전기주식회사 시아네이트 에스테르-함유 절연조성물, 이로부터 제조된 절연필름 및 절연필름을 갖는 다층인쇄회로기판
EP1755161A3 (de) * 2001-08-24 2007-05-02 3M Innovative Properties Company Verdrahtungsmodul mit reduzierter Versorgungsverteilungsimpedanz
US6847527B2 (en) * 2001-08-24 2005-01-25 3M Innovative Properties Company Interconnect module with reduced power distribution impedance
JP4639806B2 (ja) 2002-09-30 2011-02-23 日立化成工業株式会社 印刷配線板用樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板
CN101492527B (zh) * 2002-09-30 2011-11-09 日立化成工业株式会社 印刷电路板用树脂组合物以及使用它的清漆、预浸物及镀金属膜层叠板
KR100561070B1 (ko) * 2003-09-05 2006-03-15 주식회사 엘지화학 고속전송 회로기판용 열경화성 수지 조성물
US20070004902A1 (en) * 2005-05-25 2007-01-04 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Triazine Containing Polymers
TWI441866B (zh) 2006-02-17 2014-06-21 Hitachi Chemical Co Ltd A thermosetting resin composition of a semi-IPN type composite and a varnish, a prepreg and a metal laminate
EP1854827B1 (de) * 2006-05-11 2015-04-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Flammfeste, niedrigtemperaturhärtende, cyanatbasierte Harze mit verbesserten Eigenschaften
DE102006022372A1 (de) 2006-05-12 2007-11-15 Airbus Deutschland Gmbh Flammfeste, niedrigtemperaturhärtende, cyanatbasierte Prepregharze für Honeycomb-Sandwichbauteile mit exzellenten Oberflächen
US20080076885A1 (en) * 2006-09-21 2008-03-27 Gary William Yeager Poly(arylene ether) composition and method
US20080076884A1 (en) * 2006-09-21 2008-03-27 Gary William Yeager Poly(arylene ether) composition and method
US20080085989A1 (en) * 2006-10-05 2008-04-10 Gary William Yeager Poly(arylene ether) copolymer
US20090004488A1 (en) * 2007-06-26 2009-01-01 Doosan Corporation Resine Composition For Printed Circuit Board and Composite Substrate And Copper Laminates Using The Same
JP5024205B2 (ja) * 2007-07-12 2012-09-12 三菱瓦斯化学株式会社 プリプレグ及び積層板
US10155835B2 (en) * 2011-08-09 2018-12-18 Mitsubishi Gas Chemical Company, Inc. Cyanate ester compound and method for producing the same, and curable resin composition comprising the compound, and cured product thereof composition
CN103509329B (zh) * 2012-06-28 2016-01-20 中山台光电子材料有限公司 低介电树脂组成物及应用其的铜箔基板及印刷电路板

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US4389516A (en) * 1980-03-24 1983-06-21 Mitsubishi Gas Chemical Company, Inc. Curable polyphenylene ether resin composition
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JPH066727B2 (ja) * 1986-07-24 1994-01-26 住友特殊金属株式会社 永久磁石材料用原料粉末の製造方法
US4904760A (en) * 1987-04-27 1990-02-27 Mitsubishi Gas Chemical Co., Inc. Thermosetting resin composition from cyanate ester and non-branched aromatic compound
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Also Published As

Publication number Publication date
DE69807793T2 (de) 2003-08-14
EP0889096A3 (de) 1999-12-29
EP0889096A2 (de) 1999-01-07
US6465083B1 (en) 2002-10-15
US6156831A (en) 2000-12-05
EP0889096B1 (de) 2002-09-11

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