ATE390450T1 - Harzzusammensetzung für leiterplatte und lack, prepreg und metallplattiertes laminat unter verwendung davon - Google Patents

Harzzusammensetzung für leiterplatte und lack, prepreg und metallplattiertes laminat unter verwendung davon

Info

Publication number
ATE390450T1
ATE390450T1 AT03798536T AT03798536T ATE390450T1 AT E390450 T1 ATE390450 T1 AT E390450T1 AT 03798536 T AT03798536 T AT 03798536T AT 03798536 T AT03798536 T AT 03798536T AT E390450 T1 ATE390450 T1 AT E390450T1
Authority
AT
Austria
Prior art keywords
prepreg
resin composition
paint
circuit board
metal plated
Prior art date
Application number
AT03798536T
Other languages
English (en)
Inventor
Yasuyuki Mizuno
Daisuke Fujimoto
Hiroshi Shimizu
Kazuhito Kobayashi
Takayuki Sueyoshi
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Application granted granted Critical
Publication of ATE390450T1 publication Critical patent/ATE390450T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0638—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
    • C08G73/065—Preparatory processes
    • C08G73/0655—Preparatory processes from polycyanurates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2363/00—Epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
AT03798536T 2002-09-30 2003-09-29 Harzzusammensetzung für leiterplatte und lack, prepreg und metallplattiertes laminat unter verwendung davon ATE390450T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002286878 2002-09-30
JP2002287071 2002-09-30

Publications (1)

Publication Number Publication Date
ATE390450T1 true ATE390450T1 (de) 2008-04-15

Family

ID=32044657

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03798536T ATE390450T1 (de) 2002-09-30 2003-09-29 Harzzusammensetzung für leiterplatte und lack, prepreg und metallplattiertes laminat unter verwendung davon

Country Status (10)

Country Link
US (1) US7816430B2 (de)
EP (1) EP1550678B1 (de)
JP (5) JP4639806B2 (de)
KR (2) KR20100094586A (de)
CN (1) CN100528927C (de)
AT (1) ATE390450T1 (de)
AU (1) AU2003266671A1 (de)
DE (1) DE60320004T2 (de)
TW (1) TWI235020B (de)
WO (1) WO2004029127A1 (de)

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JP6631834B2 (ja) * 2016-01-26 2020-01-15 パナソニックＩｐマネジメント株式会社 金属張積層板、樹脂付き金属部材、及び配線板
CN107325277B (zh) * 2016-04-28 2020-01-03 江苏和成新材料有限公司 聚苯醚树脂及其应用
CN106700475B (zh) * 2016-12-28 2019-03-19 广东生益科技股份有限公司 一种阻燃的聚苯醚树脂组合物
TWI656158B (zh) * 2017-12-25 2019-04-11 聯茂電子股份有限公司 樹脂組合物、膠片、與銅箔基板
CN110628310A (zh) * 2018-06-22 2019-12-31 联茂电子股份有限公司 多层结构与基板
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Also Published As

Publication number Publication date
JP4639806B2 (ja) 2011-02-23
CN1684995A (zh) 2005-10-19
EP1550678A4 (de) 2006-10-11
JP2010189646A (ja) 2010-09-02
JP2010212689A (ja) 2010-09-24
KR100990316B1 (ko) 2010-10-26
TWI235020B (en) 2005-06-21
KR20050055734A (ko) 2005-06-13
DE60320004D1 (de) 2008-05-08
WO2004029127A1 (ja) 2004-04-08
KR20100094586A (ko) 2010-08-26
EP1550678B1 (de) 2008-03-26
CN100528927C (zh) 2009-08-19
JPWO2004029127A1 (ja) 2006-01-26
JP2010196059A (ja) 2010-09-09
EP1550678A1 (de) 2005-07-06
DE60320004T2 (de) 2009-04-16
TW200415964A (en) 2004-08-16
AU2003266671A1 (en) 2004-04-19
JP2011006685A (ja) 2011-01-13
US7816430B2 (en) 2010-10-19
US20060167189A1 (en) 2006-07-27
JP5605035B2 (ja) 2014-10-15

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