DE60133791D1 - Kontaktsonde und deren Herstellungsverfahren - Google Patents

Kontaktsonde und deren Herstellungsverfahren

Info

Publication number
DE60133791D1
DE60133791D1 DE60133791T DE60133791T DE60133791D1 DE 60133791 D1 DE60133791 D1 DE 60133791D1 DE 60133791 T DE60133791 T DE 60133791T DE 60133791 T DE60133791 T DE 60133791T DE 60133791 D1 DE60133791 D1 DE 60133791D1
Authority
DE
Germany
Prior art keywords
manufacturing process
contact probe
probe
contact
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60133791T
Other languages
English (en)
Other versions
DE60133791T2 (de
Inventor
Tsuyoshi Haga
Katsuya Okumura
Nobuo Hayasaka
Hideki Shibata
Noriaki Matsunaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Publication of DE60133791D1 publication Critical patent/DE60133791D1/de
Application granted granted Critical
Publication of DE60133791T2 publication Critical patent/DE60133791T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
DE60133791T 2000-06-01 2001-05-31 Kontaktsonde und deren Herstellungsverfahren Expired - Fee Related DE60133791T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000164407A JP3773396B2 (ja) 2000-06-01 2000-06-01 コンタクトプローブおよびその製造方法
JP2000164407 2000-06-01

Publications (2)

Publication Number Publication Date
DE60133791D1 true DE60133791D1 (de) 2008-06-12
DE60133791T2 DE60133791T2 (de) 2009-06-25

Family

ID=18668029

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60133791T Expired - Fee Related DE60133791T2 (de) 2000-06-01 2001-05-31 Kontaktsonde und deren Herstellungsverfahren

Country Status (7)

Country Link
US (2) US20020000821A1 (de)
EP (1) EP1160576B1 (de)
JP (1) JP3773396B2 (de)
KR (1) KR100808325B1 (de)
DE (1) DE60133791T2 (de)
HK (1) HK1040431A1 (de)
TW (1) TW548410B (de)

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US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
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US7180718B2 (en) * 2003-01-31 2007-02-20 X2Y Attenuators, Llc Shielded energy conditioner
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US7675729B2 (en) 2003-12-22 2010-03-09 X2Y Attenuators, Llc Internally shielded energy conditioner
US6855010B1 (en) * 2004-01-26 2005-02-15 Chuan Yi Precision Industry Co., Ltd. Terminal for electric connector for communication apparatus
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
JP2006064676A (ja) 2004-08-30 2006-03-09 Tokyo Electron Ltd プローブ針、プローブ針の製造方法および三次元立体構造の製造方法
US20060079102A1 (en) * 2004-10-13 2006-04-13 The Ludlow Company Lp Cable terminal with flexible contacts
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JP2006132982A (ja) * 2004-11-02 2006-05-25 Tokyo Electron Ltd プローブ
JP4700353B2 (ja) * 2005-01-13 2011-06-15 山一電機株式会社 プローブエレメントの製造方法
KR20070107746A (ko) * 2005-03-01 2007-11-07 엑스2와이 어테뉴에이터스, 엘.엘.씨 내부 중첩된 조절기
US7817397B2 (en) 2005-03-01 2010-10-19 X2Y Attenuators, Llc Energy conditioner with tied through electrodes
JP2006242685A (ja) * 2005-03-02 2006-09-14 Fuchigami Micro:Kk コンタクトプローブカード
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US20090144970A1 (en) * 2007-12-06 2009-06-11 Winmems Technologies Holdings Co., Ltd. Fabricating an array of mems parts on a substrate
US7811849B2 (en) * 2008-01-30 2010-10-12 Winmems Technologies Co., Ltd. Placing a MEMS part on an application platform using a guide mask
KR100984876B1 (ko) * 2008-05-08 2010-10-04 한국기계연구원 가변강성 기능을 가진 수직형 미세 접촉 프로브
US8089294B2 (en) * 2008-08-05 2012-01-03 WinMENS Technologies Co., Ltd. MEMS probe fabrication on a reusable substrate for probe card application
US7737714B2 (en) * 2008-11-05 2010-06-15 Winmems Technologies Holdings Co., Ltd. Probe assembly arrangement
US7928751B2 (en) * 2009-02-18 2011-04-19 Winmems Technologies Holdings Co., Ltd. MEMS interconnection pins fabrication on a reusable substrate for probe card application
JP2010243411A (ja) * 2009-04-08 2010-10-28 Japan Electronic Materials Corp 垂直型プローブ
JP2010276579A (ja) * 2009-06-01 2010-12-09 Koyo Technos:Kk 電気接触子およびそれを備える検査治具
WO2011115082A1 (ja) * 2010-03-15 2011-09-22 日本電産リード株式会社 接続端子及び接続治具
EP2555001A1 (de) * 2010-03-30 2013-02-06 Sumitomo Electric Industries, Ltd. Kontaktsonde, kontaktsondenverbindungselement und herstellungsverfahren dafür
TW201135239A (en) * 2010-04-02 2011-10-16 Pleader Yamaichi Co Ltd High-frequency vertical elastic probe structure
JP5036892B2 (ja) * 2010-05-10 2012-09-26 株式会社神戸製鋼所 コンタクトプローブ
KR101149758B1 (ko) * 2010-06-30 2012-07-11 리노공업주식회사 프로브
TW201231977A (en) * 2011-01-20 2012-08-01 Pleader Yamaichi Co Ltd Structure of high-frequency vertical spring plate probe card
US8829937B2 (en) * 2011-01-27 2014-09-09 Formfactor, Inc. Fine pitch guided vertical probe array having enclosed probe flexures
KR20130010311A (ko) * 2011-07-18 2013-01-28 주식회사 코리아 인스트루먼트 수직형 프로브 카드
JP2013072658A (ja) 2011-09-26 2013-04-22 Sumitomo Electric Ind Ltd コンタクトプローブの製造方法
JP5699899B2 (ja) * 2011-10-14 2015-04-15 オムロン株式会社 接触子
JP5687172B2 (ja) * 2011-11-01 2015-03-18 三菱電機株式会社 半導体テスト治具およびそれを用いた耐圧測定方法
TW201533449A (zh) * 2014-02-24 2015-09-01 Mpi Corp 具有彈簧套筒式探針之探針裝置
DE102015004151B4 (de) * 2015-03-31 2022-01-27 Feinmetall Gmbh Verfahren zur Herstellung einer Federkontaktstift-Anordnung mit mehreren Federkontaktstiften
WO2016156003A1 (en) * 2015-03-31 2016-10-06 Technoprobe S.P.A. Vertical contact probe and corresponding testing head with vertical contact probes, particularly for high frequency applications
JP1558200S (de) * 2015-11-12 2016-09-12
JP1558199S (de) * 2015-11-12 2016-09-12
JP1558740S (de) * 2015-11-12 2016-09-12
KR101813006B1 (ko) * 2016-01-04 2017-12-28 주식회사 아이에스시 반도체 테스트용 콘택터
KR20170119469A (ko) * 2016-04-19 2017-10-27 장용일 전기 단자 테스트용 메쉬형 컨택 핀
JP2018197714A (ja) * 2017-05-24 2018-12-13 山一電機株式会社 Ｍｅｍｓ型プローブ、及び、これを使用した電気検査用装置
KR102080592B1 (ko) * 2018-12-19 2020-04-20 주식회사 오킨스전자 Ｓ-타입 탄성편을 이용하여 3개의 플런저 상호 간의 콘택 특성이 개선되는 데스트 핀
KR102519285B1 (ko) * 2021-02-22 2023-04-17 (주)포인트엔지니어링 전기 전도성 접촉핀 및 이의 제조방법
KR102538834B1 (ko) * 2021-04-15 2023-06-02 (주)위드멤스 프로브 핀
KR102606892B1 (ko) * 2021-06-15 2023-11-29 (주)포인트엔지니어링 검사 소켓용 지지 플레이트, 검사 소켓용 소켓핀 및 이들을 구비하는 검사 소켓
TWI833186B (zh) * 2022-03-29 2024-02-21 大陸商迪科特測試科技(蘇州)有限公司 探針及其彈性結構

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Also Published As

Publication number Publication date
EP1160576A3 (de) 2003-07-23
US20020000821A1 (en) 2002-01-03
HK1040431A1 (en) 2002-06-07
JP3773396B2 (ja) 2006-05-10
JP2001343397A (ja) 2001-12-14
EP1160576A2 (de) 2001-12-05
DE60133791T2 (de) 2009-06-25
TW548410B (en) 2003-08-21
EP1160576B1 (de) 2008-04-30
KR20010110168A (ko) 2001-12-12
US20030210063A1 (en) 2003-11-13
US6784680B2 (en) 2004-08-31
KR100808325B1 (ko) 2008-02-27

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