DE69416200T2 - Sondenkonstruktion - Google Patents

Sondenkonstruktion

Info

Publication number
DE69416200T2
DE69416200T2 DE69416200T DE69416200T DE69416200T2 DE 69416200 T2 DE69416200 T2 DE 69416200T2 DE 69416200 T DE69416200 T DE 69416200T DE 69416200 T DE69416200 T DE 69416200T DE 69416200 T2 DE69416200 T2 DE 69416200T2
Authority
DE
Germany
Prior art keywords
probe construction
probe
construction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69416200T
Other languages
English (en)
Other versions
DE69416200D1 (de
Inventor
Kazuhide Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP5205390A external-priority patent/JPH0763786A/ja
Priority claimed from JP5205393A external-priority patent/JPH0763787A/ja
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Application granted granted Critical
Publication of DE69416200D1 publication Critical patent/DE69416200D1/de
Publication of DE69416200T2 publication Critical patent/DE69416200T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
DE69416200T 1993-06-16 1994-06-13 Sondenkonstruktion Expired - Fee Related DE69416200T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP14495993 1993-06-16
JP14496493 1993-06-16
JP5205390A JPH0763786A (ja) 1993-06-16 1993-08-19 プローブ構造
JP5205393A JPH0763787A (ja) 1993-06-16 1993-08-19 プローブ構造

Publications (2)

Publication Number Publication Date
DE69416200D1 DE69416200D1 (de) 1999-03-11
DE69416200T2 true DE69416200T2 (de) 1999-06-02

Family

ID=27472605

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69416200T Expired - Fee Related DE69416200T2 (de) 1993-06-16 1994-06-13 Sondenkonstruktion

Country Status (4)

Country Link
US (1) US5576630A (de)
EP (1) EP0629867B1 (de)
KR (1) KR100306098B1 (de)
DE (1) DE69416200T2 (de)

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US5914614A (en) * 1996-03-12 1999-06-22 International Business Machines Corporation High density cantilevered probe for electronic devices
US5786701A (en) * 1993-07-02 1998-07-28 Mitel Semiconductor Limited Bare die testing
US6741085B1 (en) * 1993-11-16 2004-05-25 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
US6482013B2 (en) 1993-11-16 2002-11-19 Formfactor, Inc. Microelectronic spring contact element and electronic component having a plurality of spring contact elements
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US7064566B2 (en) * 1993-11-16 2006-06-20 Formfactor, Inc. Probe card assembly and kit
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US20100065963A1 (en) 1995-05-26 2010-03-18 Formfactor, Inc. Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out
US5641974A (en) 1995-06-06 1997-06-24 Ois Optical Imaging Systems, Inc. LCD with bus lines overlapped by pixel electrodes and photo-imageable insulating layer therebetween
US5600257A (en) * 1995-08-09 1997-02-04 International Business Machines Corporation Semiconductor wafer test and burn-in
US6118286A (en) * 1995-10-10 2000-09-12 Xilinx, Inc. Semiconductor device tester-to-handler Interface board with large test area
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
JPH09260533A (ja) * 1996-03-19 1997-10-03 Hitachi Ltd 半導体装置及びその実装構造
US5896038A (en) * 1996-11-08 1999-04-20 W. L. Gore & Associates, Inc. Method of wafer level burn-in
US6690185B1 (en) * 1997-01-15 2004-02-10 Formfactor, Inc. Large contactor with multiple, aligned contactor units
JP3193659B2 (ja) * 1997-02-25 2001-07-30 インターナショナル・ビジネス・マシーンズ・コーポレ−ション プロービング方法
JPH10260223A (ja) * 1997-03-19 1998-09-29 Fujitsu Ltd 半導体検査装置及びこれを用いた検査方法
US6250880B1 (en) * 1997-09-05 2001-06-26 Ventrassist Pty. Ltd Rotary pump with exclusively hydrodynamically suspended impeller
US6156484A (en) * 1997-11-07 2000-12-05 International Business Machines Corporation Gray scale etching for thin flexible interposer
KR20060095785A (ko) 1998-02-26 2006-09-01 이비덴 가부시키가이샤 필드 바이어 구조를 갖는 다층프린트 배선판
US6369444B1 (en) * 1998-05-19 2002-04-09 Agere Systems Guardian Corp. Packaging silicon on silicon multichip modules
JP3169907B2 (ja) * 1998-09-25 2001-05-28 日本電気株式会社 多層配線構造およびその製造方法
US6373269B1 (en) * 1998-10-13 2002-04-16 Frederick J. Holmes Circuit board particularly adapted for use with high density test point in-circuit testers
US7215131B1 (en) 1999-06-07 2007-05-08 Formfactor, Inc. Segmented contactor
US6780001B2 (en) * 1999-07-30 2004-08-24 Formfactor, Inc. Forming tool for forming a contoured microelectronic spring mold
US6939474B2 (en) * 1999-07-30 2005-09-06 Formfactor, Inc. Method for forming microelectronic spring structures on a substrate
US6888362B2 (en) * 2000-11-09 2005-05-03 Formfactor, Inc. Test head assembly for electronic components with plurality of contoured microelectronic spring contacts
US7189077B1 (en) 1999-07-30 2007-03-13 Formfactor, Inc. Lithographic type microelectronic spring structures with improved contours
JP2001056346A (ja) * 1999-08-19 2001-02-27 Fujitsu Ltd プローブカード及び複数の半導体装置が形成されたウエハの試験方法
US6420093B1 (en) * 2000-02-02 2002-07-16 The Dow Chemical Company Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards
US7262611B2 (en) 2000-03-17 2007-08-28 Formfactor, Inc. Apparatuses and methods for planarizing a semiconductor contactor
US6653852B1 (en) * 2000-03-31 2003-11-25 Lam Research Corporation Wafer integrated plasma probe assembly array
JP3773396B2 (ja) * 2000-06-01 2006-05-10 住友電気工業株式会社 コンタクトプローブおよびその製造方法
US6603323B1 (en) * 2000-07-10 2003-08-05 Formfactor, Inc. Closed-grid bus architecture for wafer interconnect structure
KR100379152B1 (ko) * 2000-07-20 2003-04-08 장석윤 콘크리트 충전강관을 이용한 복합프리스트레스 합성빔의 제조방법 및 그 제조방법에 따라 제조된 합성빔
WO2002009169A1 (fr) * 2000-07-25 2002-01-31 Ibiden Co., Ltd. Dispositif d'inspection et carte sonde
CN100339715C (zh) * 2001-04-13 2007-09-26 住友电气工业株式会社 接触探针
WO2003007003A1 (en) * 2001-07-11 2003-01-23 Formfactor, Inc. Method of manufacturing a probe card
US6729019B2 (en) 2001-07-11 2004-05-04 Formfactor, Inc. Method of manufacturing a probe card
US6956385B1 (en) * 2001-07-26 2005-10-18 Advanced Micro Devices, Inc. Integrated circuit defect analysis using liquid crystal
JP4045084B2 (ja) * 2001-08-17 2008-02-13 株式会社神戸製鋼所 電気的接続検査装置
US6809337B2 (en) 2002-04-22 2004-10-26 Intel Corporation Liquid crystal display devices having fill holes and electrical contacts on the back side of the die
US20030234660A1 (en) * 2002-06-24 2003-12-25 Jain Sunil K. Direct landing technology for wafer probe
JP4445189B2 (ja) 2002-08-29 2010-04-07 株式会社ルネサステクノロジ 半導体装置およびその製造方法
US7474113B2 (en) * 2002-10-25 2009-01-06 Intel Corporation Flexible head probe for sort interface units
JP2004356362A (ja) * 2003-05-29 2004-12-16 Dainippon Screen Mfg Co Ltd プローブカード製造用基板、検査装置、３次元造形装置および３次元造形方法
US6991948B2 (en) * 2003-11-05 2006-01-31 Solid State Measurements, Inc. Method of electrical characterization of a silicon-on-insulator (SOI) wafer
JP4434809B2 (ja) * 2004-03-29 2010-03-17 三洋電機株式会社 半導体装置の製造方法
JP4727948B2 (ja) 2004-05-24 2011-07-20 東京エレクトロン株式会社 プローブカードに用いられる積層基板
JP2008502897A (ja) * 2004-06-14 2008-01-31 オックスフォード バイオセンサーズ リミテッド マイクロバンド電極の製造方法
TWI254798B (en) * 2004-10-28 2006-05-11 Advanced Semiconductor Eng Substrate testing apparatus with full contact configuration
US7307437B1 (en) * 2005-03-24 2007-12-11 Hewlett-Packard Development Company, L.P. Arrangement with conductive pad embedment
JP4247719B2 (ja) * 2005-05-20 2009-04-02 セイコーエプソン株式会社 半導体装置の検査プローブ及び半導体装置の検査プローブの製造方法
US7327155B2 (en) * 2005-11-17 2008-02-05 Solid State Measurements, Inc. Elastic metal gate MOS transistor for surface mobility measurement in semiconductor materials
US7956633B2 (en) * 2006-03-06 2011-06-07 Formfactor, Inc. Stacked guard structures
JP5412029B2 (ja) * 2006-12-28 2014-02-12 株式会社日本マイクロニクス プローブユニット基板
JP2008275409A (ja) * 2007-04-27 2008-11-13 Alps Electric Co Ltd プローブカード
JP2009064909A (ja) * 2007-09-05 2009-03-26 Alps Electric Co Ltd 多層セラミック配線板およびその製造方法
US7576551B2 (en) * 2007-09-20 2009-08-18 Visera Technologies Company Limited Test socket and test board for wafer level semiconductor testing
JP2011095028A (ja) * 2009-10-28 2011-05-12 Optnics Precision Co Ltd プローブシート
JP2011221006A (ja) * 2010-03-23 2011-11-04 Tokyo Electron Ltd ウェハ型温度検知センサおよびその製造方法
US9619990B2 (en) * 2013-09-06 2017-04-11 Junior Dunn Smart output protector
US9341668B1 (en) * 2014-04-01 2016-05-17 Xilnix, Inc. Integrated circuit package testing
CN106356355B (zh) * 2015-07-15 2020-06-26 恒劲科技股份有限公司 基板结构及其制作方法
TWI598606B (zh) * 2016-05-24 2017-09-11 中華精測科技股份有限公司 球閘陣列測試裝置
US10267847B2 (en) * 2016-06-15 2019-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Probe head structure of probe card and testing method
US10396003B2 (en) 2017-10-18 2019-08-27 Micron Technology, Inc. Stress tuned stiffeners for micro electronics package warpage control
CN110047772A (zh) * 2019-04-23 2019-07-23 云谷（固安）科技有限公司 一种探针卡、制备方法和芯片测试方法

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US4189825A (en) * 1975-06-04 1980-02-26 Raytheon Company Integrated test and assembly device
US4567432A (en) * 1983-06-09 1986-01-28 Texas Instruments Incorporated Apparatus for testing integrated circuits
EP0230348A2 (de) * 1986-01-07 1987-07-29 Hewlett-Packard Company Testsonde
US4912399A (en) * 1987-06-09 1990-03-27 Tektronix, Inc. Multiple lead probe for integrated circuits in wafer form
US5103557A (en) * 1988-05-16 1992-04-14 Leedy Glenn J Making and testing an integrated circuit using high density probe points
US5027063A (en) * 1990-04-24 1991-06-25 John Fluke Mfg. Co., Inc. Vacuum-actuated test fixture for testing electronic components

Also Published As

Publication number Publication date
EP0629867A1 (de) 1994-12-21
KR100306098B1 (ko) 2001-11-30
EP0629867B1 (de) 1999-01-27
KR950001975A (ko) 1995-01-04
US5576630A (en) 1996-11-19
DE69416200D1 (de) 1999-03-11

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Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee