KR100306098B1 - 탐색기 - Google Patents
탐색기 Download PDFInfo
- Publication number
- KR100306098B1 KR100306098B1 KR1019940013858A KR19940013858A KR100306098B1 KR 100306098 B1 KR100306098 B1 KR 100306098B1 KR 1019940013858 A KR1019940013858 A KR 1019940013858A KR 19940013858 A KR19940013858 A KR 19940013858A KR 100306098 B1 KR100306098 B1 KR 100306098B1
- Authority
- KR
- South Korea
- Prior art keywords
- circuit board
- conductive
- conductive circuit
- searcher
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000012360 testing method Methods 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims abstract description 18
- 239000003990 capacitor Substances 0.000 claims description 11
- 238000009413 insulation Methods 0.000 abstract description 9
- 229910000679 solder Inorganic materials 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 40
- 239000000523 sample Substances 0.000 description 33
- 235000012431 wafers Nutrition 0.000 description 30
- 239000010410 layer Substances 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 15
- 239000002184 metal Substances 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 13
- 230000008859 change Effects 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 12
- 238000000576 coating method Methods 0.000 description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000005530 etching Methods 0.000 description 8
- 229920001721 polyimide Polymers 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 239000000956 alloy Substances 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 6
- 238000007772 electroless plating Methods 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 239000009719 polyimide resin Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 238000007740 vapor deposition Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 239000011368 organic material Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 239000011147 inorganic material Substances 0.000 description 3
- 229910052745 lead Inorganic materials 0.000 description 3
- 229920000620 organic polymer Polymers 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 239000004945 silicone rubber Substances 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229920002492 poly(sulfone) Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 235000011089 carbon dioxide Nutrition 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- -1 fluorocarbons Polymers 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
Claims (7)
- 시료(material to be tested)의 단자와 접촉되는 접촉부가 제1절연부 내에 제1절연부를 두께방향으로 관통하도록 배치되고 상기 접촉부가 상기 제1절연부와 제2절연부 사이에 형성된 제1도전성 배선(wiring)에 연결되는 구조를 갖는 제1도전성 회로기판과, 상기 시료의 전기적 특성을 시험하기 위한 전기적 시험기(tester)에 연결된 제2도전성 배선에 상기 제1도전성 배선이 연결되는 구조를 가지며 상기 시료의 열팽창계수와 동일하거나 유사한 열팽창계수를 갖는 제2도전성 회로기판을 포함하고, 상기 제1도전성 회로기판의 리드는 단일점접착(single point bonding), 일조접착(gang bonding) 등과 같은 열접착이나 솔더 리플로우(solder reflowing) 등에 의해 상기 제2도전성 회로기판에 전기적으로 연결되는 탐색기.
- 제1항에 있어서, 상기 제1도전성 회로기판과 상기 제2도전성 회로기판의 사이에는 탄성체가 배치되는 탐색기.
- 제1항에 있어서, 상기 제2도전성 배선은 신호선에 직렬로 연결된 하나 이상의 저항기를 구비하는 탐색기.
- 제3항에 있어서, 상기 저항기에 대해 병렬관계로 콘덴서가 연결되는 탐색기.
- 제1항에 있어서, 상기 제2도전성 배선에 대해 전력공급선(electric power supplying wires)이 서로 독립적으로 배선되는 탐색기.
- 제1항에 있어서, 상기 제2도전성 회로기판은 서로 접합되거나 하나의 인쇄기판에 부착되어 일체화되어 배선되는 다수의 도전성 회로기판을 포함하는 탐색기.
- 제1항에 있어서, 상기 시료는 다이싱(dicing: 입방체로 나누기) 전의 웨이퍼상에 형성된 집적회로인 탐색기.
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP93-144964 | 1993-06-16 | ||
JP14495993 | 1993-06-16 | ||
JP14496493 | 1993-06-16 | ||
JP93-144959 | 1993-06-16 | ||
JP5205390A JPH0763786A (ja) | 1993-06-16 | 1993-08-19 | プローブ構造 |
JP5205393A JPH0763787A (ja) | 1993-06-16 | 1993-08-19 | プローブ構造 |
JP93-205393 | 1993-08-19 | ||
JP93-205390 | 1993-08-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950001975A KR950001975A (ko) | 1995-01-04 |
KR100306098B1 true KR100306098B1 (ko) | 2001-11-30 |
Family
ID=27472605
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940013858A Expired - Fee Related KR100306098B1 (ko) | 1993-06-16 | 1994-06-16 | 탐색기 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5576630A (ko) |
EP (1) | EP0629867B1 (ko) |
KR (1) | KR100306098B1 (ko) |
DE (1) | DE69416200T2 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100516559B1 (ko) * | 2001-08-17 | 2005-09-22 | 가부시키가이샤 고베 세이코쇼 | 전기적 접속 검사 장치 |
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TWI598606B (zh) * | 2016-05-24 | 2017-09-11 | 中華精測科技股份有限公司 | 球閘陣列測試裝置 |
US10267847B2 (en) * | 2016-06-15 | 2019-04-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Probe head structure of probe card and testing method |
US10396003B2 (en) | 2017-10-18 | 2019-08-27 | Micron Technology, Inc. | Stress tuned stiffeners for micro electronics package warpage control |
CN110047772A (zh) * | 2019-04-23 | 2019-07-23 | 云谷(固安)科技有限公司 | 一种探针卡、制备方法和芯片测试方法 |
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US4189825A (en) * | 1975-06-04 | 1980-02-26 | Raytheon Company | Integrated test and assembly device |
US4567432A (en) * | 1983-06-09 | 1986-01-28 | Texas Instruments Incorporated | Apparatus for testing integrated circuits |
EP0230348A2 (en) * | 1986-01-07 | 1987-07-29 | Hewlett-Packard Company | Test probe |
US4912399A (en) * | 1987-06-09 | 1990-03-27 | Tektronix, Inc. | Multiple lead probe for integrated circuits in wafer form |
US5103557A (en) * | 1988-05-16 | 1992-04-14 | Leedy Glenn J | Making and testing an integrated circuit using high density probe points |
US5027063A (en) * | 1990-04-24 | 1991-06-25 | John Fluke Mfg. Co., Inc. | Vacuum-actuated test fixture for testing electronic components |
-
1994
- 1994-06-13 DE DE69416200T patent/DE69416200T2/de not_active Expired - Fee Related
- 1994-06-13 EP EP94109049A patent/EP0629867B1/en not_active Expired - Lifetime
- 1994-06-16 US US08/260,992 patent/US5576630A/en not_active Expired - Fee Related
- 1994-06-16 KR KR1019940013858A patent/KR100306098B1/ko not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100516559B1 (ko) * | 2001-08-17 | 2005-09-22 | 가부시키가이샤 고베 세이코쇼 | 전기적 접속 검사 장치 |
Also Published As
Publication number | Publication date |
---|---|
EP0629867A1 (en) | 1994-12-21 |
KR950001975A (ko) | 1995-01-04 |
DE69416200D1 (de) | 1999-03-11 |
EP0629867B1 (en) | 1999-01-27 |
US5576630A (en) | 1996-11-19 |
DE69416200T2 (de) | 1999-06-02 |
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