HK1040431A1 - Contact probe and fabrication method thereof - Google Patents

Contact probe and fabrication method thereof

Info

Publication number
HK1040431A1
HK1040431A1 HK02100269A HK02100269A HK1040431A1 HK 1040431 A1 HK1040431 A1 HK 1040431A1 HK 02100269 A HK02100269 A HK 02100269A HK 02100269 A HK02100269 A HK 02100269A HK 1040431 A1 HK1040431 A1 HK 1040431A1
Authority
HK
Hong Kong
Prior art keywords
fabrication method
contact probe
probe
contact
fabrication
Prior art date
Application number
HK02100269A
Other languages
English (en)
Inventor
Haga Tsuyoshi
Okumura Katsuya
Hayasaka Nobuo
Shibata Hideki
Matsunaga Noriaki
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Publication of HK1040431A1 publication Critical patent/HK1040431A1/xx

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
HK02100269A 2000-06-01 2002-01-15 Contact probe and fabrication method thereof HK1040431A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000164407A JP3773396B2 (ja) 2000-06-01 2000-06-01 コンタクトプローブおよびその製造方法

Publications (1)

Publication Number Publication Date
HK1040431A1 true HK1040431A1 (en) 2002-06-07

Family

ID=18668029

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02100269A HK1040431A1 (en) 2000-06-01 2002-01-15 Contact probe and fabrication method thereof

Country Status (7)

Country Link
US (2) US20020000821A1 (xx)
EP (1) EP1160576B1 (xx)
JP (1) JP3773396B2 (xx)
KR (1) KR100808325B1 (xx)
DE (1) DE60133791T2 (xx)
HK (1) HK1040431A1 (xx)
TW (1) TW548410B (xx)

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JP1558740S (xx) * 2015-11-12 2016-09-12
JP1558200S (xx) * 2015-11-12 2016-09-12
JP1558199S (xx) * 2015-11-12 2016-09-12
KR101813006B1 (ko) * 2016-01-04 2017-12-28 주식회사 아이에스시 반도체 테스트용 콘택터
KR20170119469A (ko) * 2016-04-19 2017-10-27 장용일 전기 단자 테스트용 메쉬형 컨택 핀
JP2018197714A (ja) * 2017-05-24 2018-12-13 山一電機株式会社 Ｍｅｍｓ型プローブ、及び、これを使用した電気検査用装置
KR102080592B1 (ko) * 2018-12-19 2020-04-20 주식회사 오킨스전자 Ｓ-타입 탄성편을 이용하여 3개의 플런저 상호 간의 콘택 특성이 개선되는 데스트 핀
KR102519285B1 (ko) * 2021-02-22 2023-04-17 (주)포인트엔지니어링 전기 전도성 접촉핀 및 이의 제조방법
KR102538834B1 (ko) * 2021-04-15 2023-06-02 (주)위드멤스 프로브 핀
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Also Published As

Publication number Publication date
DE60133791T2 (de) 2009-06-25
US6784680B2 (en) 2004-08-31
KR20010110168A (ko) 2001-12-12
US20030210063A1 (en) 2003-11-13
TW548410B (en) 2003-08-21
EP1160576A2 (en) 2001-12-05
US20020000821A1 (en) 2002-01-03
EP1160576A3 (en) 2003-07-23
KR100808325B1 (ko) 2008-02-27
JP3773396B2 (ja) 2006-05-10
JP2001343397A (ja) 2001-12-14
DE60133791D1 (de) 2008-06-12
EP1160576B1 (en) 2008-04-30

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PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20120531