DE60016217D1 - Polyimidharzzusammensetzung mit verbesserter feuchtigkeitsbeständigkeit, leimlösung, mehrlagiger klebefilm und verfahren zu deren herstellung - Google Patents
Polyimidharzzusammensetzung mit verbesserter feuchtigkeitsbeständigkeit, leimlösung, mehrlagiger klebefilm und verfahren zu deren herstellungInfo
- Publication number
- DE60016217D1 DE60016217D1 DE60016217T DE60016217T DE60016217D1 DE 60016217 D1 DE60016217 D1 DE 60016217D1 DE 60016217 T DE60016217 T DE 60016217T DE 60016217 T DE60016217 T DE 60016217T DE 60016217 D1 DE60016217 D1 DE 60016217D1
- Authority
- DE
- Germany
- Prior art keywords
- production
- resin composition
- adhesive film
- polyimide resin
- moisture resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
- C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/1028—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous
- C08G73/1032—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous characterised by the solvent(s) used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
- C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/14—Polyamide-imides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
Applications Claiming Priority (15)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10206699 | 1999-04-09 | ||
JP10206699 | 1999-04-09 | ||
JP11379699 | 1999-04-21 | ||
JP11422499 | 1999-04-21 | ||
JP11419199 | 1999-04-21 | ||
JP11422499 | 1999-04-21 | ||
JP11379699 | 1999-04-21 | ||
JP11419199 | 1999-04-21 | ||
JP31603499 | 1999-11-05 | ||
JP31603599 | 1999-11-05 | ||
JP31603599 | 1999-11-05 | ||
JP31603499 | 1999-11-05 | ||
JP2000045542 | 2000-02-23 | ||
JP2000045542 | 2000-02-23 | ||
PCT/JP2000/002181 WO2000061658A1 (fr) | 1999-04-09 | 2000-04-04 | Resine polyimide, composition de resine a resistance amelioree a l'humidite la comprenant, solution adhesive, colle en film adhesif en couches et leurs procedes de production |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60016217D1 true DE60016217D1 (de) | 2004-12-30 |
DE60016217T2 DE60016217T2 (de) | 2005-04-07 |
Family
ID=27565662
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2000616217 Expired - Lifetime DE60016217T2 (de) | 1999-04-09 | 2000-04-04 | Polyimidharzzusammensetzung mit verbesserter feuchtigkeitsbeständigkeit, leimlösung, mehrlagiger klebefilm und verfahren zu deren herstellung |
Country Status (5)
Country | Link |
---|---|
US (1) | US6693162B2 (de) |
EP (1) | EP1193280B1 (de) |
JP (1) | JP4743732B2 (de) |
DE (1) | DE60016217T2 (de) |
WO (1) | WO2000061658A1 (de) |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001057112A1 (fr) * | 2000-02-01 | 2001-08-09 | Nippon Steel Chemical Co., Ltd. | Resine polyimide adhesive et stratifie adhesif |
JP4473486B2 (ja) * | 2000-04-12 | 2010-06-02 | 株式会社カネカ | 積層体およびこれを用いた多層配線板 |
US6822170B2 (en) * | 2000-12-26 | 2004-11-23 | Ngk Spark Plug Co., Ltd. | Embedding resin and wiring substrate using the same |
JP2002309218A (ja) * | 2001-04-11 | 2002-10-23 | Kanegafuchi Chem Ind Co Ltd | 加速器ビームチューブ被覆用接着性積層フィルム |
JP2003027034A (ja) * | 2001-07-17 | 2003-01-29 | Kanegafuchi Chem Ind Co Ltd | 接着性カバーフィルム |
KR100638623B1 (ko) | 2001-09-04 | 2006-10-26 | 미쓰이 가가쿠 가부시키가이샤 | 신규한 방향족 디아민 및 그의 폴리이미드 |
JP2003082301A (ja) * | 2001-09-10 | 2003-03-19 | Japan Gore Tex Inc | 接着テープ及び半導体装置 |
CN1309786C (zh) * | 2002-03-08 | 2007-04-11 | 钟渊化学工业株式会社 | 热固性树脂组合物,用该组合物构成的叠层制品及电路基板 |
JP2004079826A (ja) * | 2002-08-20 | 2004-03-11 | Nippon Steel Chem Co Ltd | 配線基板用積層体 |
EP1590416A1 (de) * | 2003-01-29 | 2005-11-02 | Tesa AG | Verfahren zur verklebung von fpcb's |
JP2004259789A (ja) * | 2003-02-25 | 2004-09-16 | Mitsui Chemicals Inc | リードフレーム固定用接着基材 |
US7488532B2 (en) * | 2003-05-14 | 2009-02-10 | Mitsui Chemicals, Inc. | Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same |
US7220490B2 (en) * | 2003-12-30 | 2007-05-22 | E. I. Du Pont De Nemours And Company | Polyimide based adhesive compositions useful in flexible circuit applications, and compositions and methods relating thereto |
WO2005080466A1 (ja) * | 2004-02-25 | 2005-09-01 | Kaneka Corporation | 熱硬化性樹脂組成物およびその利用 |
KR101186395B1 (ko) * | 2004-04-19 | 2012-09-27 | 가부시키가이샤 가네카 | 열경화성 수지 조성물, 이것을 사용하여 이루어지는 적층체및 회로 기판 |
KR20070049169A (ko) * | 2004-08-25 | 2007-05-10 | 마츠시타 덴끼 산교 가부시키가이샤 | 땜납 조성물, 납땜 접합 방법, 및 납땜 접합 구조 |
US7816487B2 (en) * | 2004-09-30 | 2010-10-19 | Intel Corporation | Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same |
JP5054516B2 (ja) * | 2005-04-28 | 2012-10-24 | 株式会社野田スクリーン | 熱硬化性樹脂組成物 |
JP2007091799A (ja) * | 2005-09-27 | 2007-04-12 | Kaneka Corp | 熱硬化性樹脂組成物、及びその利用 |
WO2007094561A1 (en) * | 2006-02-17 | 2007-08-23 | Cheil Industries Inc. | High molocular electrolyte membrane for fuel cell, and membrane-electrode assembly thereby, fuel cell |
JP5244303B2 (ja) * | 2006-05-23 | 2013-07-24 | 旭化成イーマテリアルズ株式会社 | ポリエステルイミドおよびその製造方法 |
US20070290379A1 (en) * | 2006-06-15 | 2007-12-20 | Dueber Thomas E | Hydrophobic compositions for electronic applications |
US8491997B2 (en) * | 2006-06-22 | 2013-07-23 | Sabic Innovative Plastics Ip B.V. | Conductive wire comprising a polysiloxane/polyimide copolymer blend |
US8071693B2 (en) * | 2006-06-22 | 2011-12-06 | Sabic Innovative Plastics Ip B.V. | Polysiloxane/polyimide copolymers and blends thereof |
US8168726B2 (en) * | 2006-06-22 | 2012-05-01 | Sabic Innovative Plastics Ip B.V. | Process for making polysiloxane/polymide copolymer blends |
US8159825B1 (en) | 2006-08-25 | 2012-04-17 | Hypres Inc. | Method for fabrication of electrical contacts to superconducting circuits |
JP5380805B2 (ja) * | 2006-08-31 | 2014-01-08 | Jnc株式会社 | インクジェット用インク |
JP2008169318A (ja) * | 2007-01-12 | 2008-07-24 | Nitto Denko Corp | 高屈折率透明酸化チタン/樹脂組成物とそのような組成物を製造するためのコーティング組成物の製造方法 |
US20080236864A1 (en) * | 2007-03-28 | 2008-10-02 | General Electric Company | Cross linked polysiloxane/polyimide copolymers, methods of making, blends thereof, and articles derived therefrom |
JP2008255141A (ja) * | 2007-03-31 | 2008-10-23 | Ube Ind Ltd | ポリイミドフィルムの製造方法およびポリイミドフィルム |
JP5009670B2 (ja) * | 2007-04-05 | 2012-08-22 | 旭化成イーマテリアルズ株式会社 | ポリエステルイミド前駆体及びポリエステルイミド |
JP2008266416A (ja) * | 2007-04-18 | 2008-11-06 | Ube Ind Ltd | ポリイミドフィルムの製造方法およびポリイミドフィルム |
JP2009013422A (ja) * | 2008-09-03 | 2009-01-22 | Kaneka Corp | コーティング材 |
CN104350121A (zh) * | 2012-05-29 | 2015-02-11 | 日东电工株式会社 | 粘合剂和使用所述粘合剂的透明基板 |
JP6343989B2 (ja) * | 2013-03-21 | 2018-06-20 | 東洋紡株式会社 | 透明ポリエステルイミド樹脂フィルム、並びにこれに用いる樹脂および樹脂組成物 |
JP6349823B2 (ja) * | 2013-03-21 | 2018-07-04 | 東洋紡株式会社 | ポリエステルイミド樹脂フィルム、並びにこれに用いる樹脂および樹脂組成物 |
CN105579492B (zh) * | 2013-09-26 | 2017-10-27 | 普立万公司 | 适用于3d打印工艺的芳族聚酰亚胺 |
CN109644555B (zh) * | 2016-08-12 | 2022-03-01 | 昭和电工材料株式会社 | 层间绝缘膜及其制造方法 |
JP7269095B2 (ja) * | 2019-05-29 | 2023-05-08 | 古河電気工業株式会社 | ガラス加工用テープ |
WO2021117686A1 (ja) * | 2019-12-10 | 2021-06-17 | ユニチカ株式会社 | イミド基含有化合物、イミド基含有硬化剤ならびにエポキシ樹脂硬化物およびそれを用いた電気絶縁性材料 |
KR102324559B1 (ko) * | 2020-02-28 | 2021-11-10 | (주)이녹스첨단소재 | 접착 필름, 이를 포함하는 접착 필름 부착 적층체 및 이를 포함하는 금속박 적층체 |
JP7478008B2 (ja) | 2020-03-27 | 2024-05-02 | 積水化学工業株式会社 | 樹脂材料及び多層プリント配線板 |
JP2022156876A (ja) * | 2021-03-31 | 2022-10-14 | Tdk株式会社 | 樹脂複合積層体、樹脂複合積層体の製造方法および伸縮性デバイス |
CN115536816B (zh) * | 2022-10-28 | 2024-02-20 | 中国科学院兰州化学物理研究所 | 一种热固性环氧树脂形状记忆聚合物及其制备方法 |
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US4681928A (en) | 1984-06-01 | 1987-07-21 | M&T Chemicals Inc. | Poly(amide-amide acid), polyamide acid, poly(esteramide acid), poly(amide-imide), polyimide, poly(esterimide) from poly arylene diamine |
JPH0696685B2 (ja) | 1986-10-31 | 1994-11-30 | 日立化成工業株式会社 | 導電性ペ−スト組成物 |
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JPH0751545B2 (ja) | 1988-06-28 | 1995-06-05 | 日立化成工業株式会社 | 新規ジアミン |
JPH0751544B2 (ja) | 1988-06-28 | 1995-06-05 | 日立化成工業株式会社 | 新規ジアミンの製造法 |
JPH07119281B2 (ja) * | 1988-06-28 | 1995-12-20 | 日立化成工業株式会社 | 新規なポリエステルイミドの製造法 |
JPH02245070A (ja) | 1989-03-17 | 1990-09-28 | Hitachi Chem Co Ltd | 導電性ペースト組成物 |
JPH02245071A (ja) | 1989-03-17 | 1990-09-28 | Hitachi Chem Co Ltd | 導電性ペースト組成物 |
JPH03195732A (ja) | 1989-12-25 | 1991-08-27 | Hitachi Chem Co Ltd | 新規なポリエステルイミド |
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JPH0770539A (ja) | 1993-09-03 | 1995-03-14 | Kanegafuchi Chem Ind Co Ltd | カバーレイ用接着剤及びカバーレイフィルム |
JPH0770318A (ja) | 1993-09-06 | 1995-03-14 | Kanegafuchi Chem Ind Co Ltd | 耐熱性接着剤 |
JP3395158B2 (ja) | 1993-11-18 | 2003-04-07 | 鐘淵化学工業株式会社 | フレキシブル金属箔張り積層板の製造方法 |
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US6350844B1 (en) * | 1998-11-05 | 2002-02-26 | Kaneka Corporation | Polyimide film and electric/electronic equipment bases with the use thereof |
-
2000
- 2000-04-04 DE DE2000616217 patent/DE60016217T2/de not_active Expired - Lifetime
- 2000-04-04 WO PCT/JP2000/002181 patent/WO2000061658A1/ja active IP Right Grant
- 2000-04-04 US US09/958,612 patent/US6693162B2/en not_active Expired - Lifetime
- 2000-04-04 EP EP20000913104 patent/EP1193280B1/de not_active Expired - Lifetime
- 2000-04-04 JP JP2000611595A patent/JP4743732B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP4743732B2 (ja) | 2011-08-10 |
US20030045669A1 (en) | 2003-03-06 |
DE60016217T2 (de) | 2005-04-07 |
EP1193280B1 (de) | 2004-11-24 |
WO2000061658A1 (fr) | 2000-10-19 |
EP1193280A1 (de) | 2002-04-03 |
US6693162B2 (en) | 2004-02-17 |
EP1193280A4 (de) | 2002-07-31 |
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