DE60031448D1 - Poröse klebefolie, halbleiterwafer mit poröser klebefolie sowie verfahren zu dessen herstellung - Google Patents
Poröse klebefolie, halbleiterwafer mit poröser klebefolie sowie verfahren zu dessen herstellungInfo
- Publication number
- DE60031448D1 DE60031448D1 DE60031448T DE60031448T DE60031448D1 DE 60031448 D1 DE60031448 D1 DE 60031448D1 DE 60031448 T DE60031448 T DE 60031448T DE 60031448 T DE60031448 T DE 60031448T DE 60031448 D1 DE60031448 D1 DE 60031448D1
- Authority
- DE
- Germany
- Prior art keywords
- adhesive foil
- porous adhesive
- waist
- semiconductor
- production
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 title 2
- 230000001070 adhesive effect Effects 0.000 title 2
- 239000011888 foil Substances 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C09J7/00—Adhesives in the form of films or foils
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- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
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- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249982—With component specified as adhesive or bonding agent
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249982—With component specified as adhesive or bonding agent
- Y10T428/249983—As outermost component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249982—With component specified as adhesive or bonding agent
- Y10T428/249984—Adhesive or bonding component contains voids
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000005084 | 2000-01-13 | ||
JP2000005084 | 2000-01-13 | ||
JP2000243398 | 2000-08-10 | ||
JP2000243398 | 2000-08-10 | ||
PCT/JP2000/005553 WO2001051580A1 (fr) | 2000-01-13 | 2000-08-18 | Feuille adhesive poreuse, plaquette a semi-conducteurs munie de la feuille adhesive poreuse, et procede de fabrication associe |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60031448D1 true DE60031448D1 (de) | 2006-11-30 |
DE60031448T2 DE60031448T2 (de) | 2007-02-01 |
Family
ID=26583469
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60031448T Expired - Lifetime DE60031448T2 (de) | 2000-01-13 | 2000-08-18 | Poröse klebefolie, halbleiterwafer mit poröser klebefolie sowie verfahren zu dessen herstellung |
Country Status (6)
Country | Link |
---|---|
US (3) | US6890617B1 (de) |
EP (1) | EP1270694B1 (de) |
JP (1) | JP4113710B2 (de) |
KR (1) | KR20020069015A (de) |
DE (1) | DE60031448T2 (de) |
WO (1) | WO2001051580A1 (de) |
Families Citing this family (20)
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JPH10275966A (ja) * | 1997-01-30 | 1998-10-13 | Ibiden Co Ltd | プリント配線板及びその製造方法 |
CN1290599C (zh) | 2002-07-25 | 2006-12-20 | 大日本印刷株式会社 | 用于氢气制造用过滤器的薄膜支持基板及氢气制造用过滤器制造方法 |
US7410184B2 (en) * | 2002-10-16 | 2008-08-12 | Cequent Trailer Products, Inc. | Trailer coupler assembly |
JP2004188475A (ja) * | 2002-12-13 | 2004-07-08 | Disco Abrasive Syst Ltd | レーザー加工方法 |
FR2857780B1 (fr) * | 2003-07-18 | 2005-09-09 | Commissariat Energie Atomique | Procede de fabrication de film conducteur anisotrope sur un substrat |
KR100796476B1 (ko) * | 2004-02-23 | 2008-01-21 | 토요 보세키 가부시기가이샤 | 다공질막, 이것의 제조 방법 및 그것을 이용하여 제조한리튬 이온 2차 전지 |
CN100564469C (zh) * | 2004-06-14 | 2009-12-02 | 琳得科株式会社 | 粘合片材 |
CN1973013B (zh) | 2004-06-22 | 2010-09-15 | 琳得科株式会社 | 粘合片材的制造方法 |
TWI302038B (en) * | 2004-07-07 | 2008-10-11 | Epistar Corp | Light emitting diode having an adhesive layer and heat paths |
JP2006054246A (ja) * | 2004-08-10 | 2006-02-23 | Disco Abrasive Syst Ltd | ウエーハの分離方法 |
TWI352437B (en) | 2007-08-27 | 2011-11-11 | Epistar Corp | Optoelectronic semiconductor device |
JP4746342B2 (ja) * | 2005-04-15 | 2011-08-10 | Okiセミコンダクタ株式会社 | 半導体装置及びその製造方法 |
KR20080039830A (ko) * | 2005-08-25 | 2008-05-07 | 스미토모덴키고교가부시키가이샤 | 이방성 도전시트, 그 제조방법, 접속방법 및 검사방법 |
TWI434119B (zh) * | 2006-06-28 | 2014-04-11 | Creator Technology Bv | 用於可撓性顯示器之改良的共同接點佈局 |
JP2008117945A (ja) | 2006-11-06 | 2008-05-22 | Nitto Denko Corp | ウォータージェットレーザダイシング用粘着シート |
CN101212085B (zh) * | 2006-12-29 | 2012-01-18 | 鸿富锦精密工业(深圳)有限公司 | 导电元件之粘合结构组合 |
JP2014018389A (ja) * | 2012-07-18 | 2014-02-03 | Dainippon Printing Co Ltd | 異物除去用シート、その使用方法、及び処理方法 |
JP6004441B2 (ja) | 2013-11-29 | 2016-10-05 | インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Machines Corporation | 基板接合方法、バンプ形成方法及び半導体装置 |
JP2017126688A (ja) * | 2016-01-15 | 2017-07-20 | 株式会社ジェイデバイス | 半導体パッケージの製造方法及び半導体パッケージ |
US10727195B2 (en) * | 2017-09-15 | 2020-07-28 | Technetics Group Llc | Bond materials with enhanced plasma resistant characteristics and associated methods |
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US3630799A (en) * | 1966-06-06 | 1971-12-28 | Thomas & Betts Corp | Method of making a supporting medium having a plurality of spaced holes |
AU514985B2 (en) * | 1975-06-26 | 1981-03-12 | Union Carbide Corporation | Making oxygenated carbon compounds |
US4346700A (en) * | 1979-11-16 | 1982-08-31 | Minnesota Mining & Manufacturing Company | Pressure-sensitive adhesive sheet material |
US4404243A (en) * | 1982-08-03 | 1983-09-13 | Reeves Bros., Inc. | Latent pressure-sensitive sheet material and method of making same using solvent-based pressure-sensitive adhesive |
JPS59145273A (ja) * | 1983-02-07 | 1984-08-20 | Sony Corp | 透孔性熱接着シ−ト及びその製造方法 |
FR2544031B1 (fr) * | 1983-04-08 | 1986-09-05 | Pasquali Jean Claude | Nouveau materiau auto-adhesif et son procede de fabrication |
JPS6190835U (de) * | 1984-11-19 | 1986-06-12 | ||
JPS61259406A (ja) * | 1985-05-10 | 1986-11-17 | 日東電工株式会社 | 異方導電性シ−ト及びその製造方法 |
JPS6251111A (ja) * | 1985-08-29 | 1987-03-05 | 日東電工株式会社 | 異方導電性フイルム |
JPS62105379A (ja) * | 1985-11-01 | 1987-05-15 | 株式会社日立製作所 | コネクタ装置 |
FR2592050B1 (fr) * | 1985-12-24 | 1988-01-08 | Centre Etd Mat Org Tech Avance | Copolyimides arylaliphatiques a enchainements ether, leur preparation, leurs melanges ou produits de reaction avec des resines epoxydes et leur utilisation pour la fabrication de materiaux composites flexibles |
JPS62191847U (de) * | 1986-05-22 | 1987-12-05 | ||
JPS63136527A (ja) * | 1986-11-27 | 1988-06-08 | Nec Corp | 半導体基板処理用粘着シ−ト |
JPS6419607A (en) * | 1987-07-13 | 1989-01-23 | Nitto Denko Corp | Anisotropic conductive sheet |
JPH031945U (de) * | 1989-05-26 | 1991-01-10 | ||
JPH04130426U (ja) * | 1991-05-16 | 1992-11-30 | 日東電工株式会社 | 電子部品用粘着テ−プ又はシ−ト |
JP3352705B2 (ja) * | 1991-06-07 | 2002-12-03 | 日東電工株式会社 | 異方導電性接着フィルムを用いた実装構造 |
EP0560072A3 (de) * | 1992-03-13 | 1993-10-06 | Nitto Denko Corporation | Anisotropisch-elektroleitende Klebe-Schicht und diese verwendende Verbindungsstruktur |
US5300618A (en) * | 1993-01-15 | 1994-04-05 | Indspec Chemical Corporation | Resorcinol-based epoxy resins |
JPH06231818A (ja) * | 1993-02-01 | 1994-08-19 | Nitto Denko Corp | 弾性を有する異方導電コネクター |
WO1995012643A1 (en) | 1993-11-03 | 1995-05-11 | W. L. Gore & Associates, Inc. | Electrically conductive adhesives |
US5435480A (en) * | 1993-12-23 | 1995-07-25 | International Business Machines Corporation | Method for filling plated through holes |
JP2570617B2 (ja) * | 1994-05-13 | 1997-01-08 | 日本電気株式会社 | 多層配線セラミック基板のビア構造及びその製造方法 |
JPH08306415A (ja) * | 1995-05-11 | 1996-11-22 | Nitto Denko Corp | 異方導電性接着フィルムおよびこれを用いた接続構造、並びに接続方法 |
JPH09241589A (ja) | 1996-03-13 | 1997-09-16 | Minnesota Mining & Mfg Co <3M> | 衝撃緩和性粘着シート及び衝撃緩和構造体 |
CN1111926C (zh) * | 1996-08-08 | 2003-06-18 | 日东电工株式会社 | 各向异性导电膜及其制造方法 |
SG76530A1 (en) * | 1997-03-03 | 2000-11-21 | Hitachi Chemical Co Ltd | Circuit boards using heat resistant resin for adhesive layers |
JPH10284156A (ja) * | 1997-04-07 | 1998-10-23 | Nitto Denko Corp | 異方導電性シートおよびその製造方法 |
JP3797763B2 (ja) * | 1997-09-08 | 2006-07-19 | 富士通テン株式会社 | フラックス組成物 |
DE69839896D1 (de) * | 1997-10-29 | 2008-09-25 | Hitachi Chemical Co Ltd | Siloxanmodifizierte Polyamidharzzusammensetzungsklebefolie, CSP Leiterplatte und Folie und hergestelltes Halbleiterbauelement |
JP4049452B2 (ja) * | 1998-07-02 | 2008-02-20 | 日東電工株式会社 | 半導体素子用接着シートおよびそれを用いた半導体装置 |
JP2003260017A (ja) * | 2002-03-11 | 2003-09-16 | Lintec Corp | 有孔除塵マット |
-
2000
- 2000-08-18 EP EP00953509A patent/EP1270694B1/de not_active Expired - Lifetime
- 2000-08-18 DE DE60031448T patent/DE60031448T2/de not_active Expired - Lifetime
- 2000-08-18 WO PCT/JP2000/005553 patent/WO2001051580A1/ja active IP Right Grant
- 2000-08-18 KR KR1020027009088A patent/KR20020069015A/ko not_active Application Discontinuation
- 2000-08-18 US US10/181,020 patent/US6890617B1/en not_active Expired - Fee Related
- 2000-08-18 JP JP2001551156A patent/JP4113710B2/ja not_active Expired - Fee Related
-
2003
- 2003-08-27 US US10/648,322 patent/US7056406B2/en not_active Expired - Fee Related
-
2004
- 2004-12-06 US US11/003,731 patent/US20050153101A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
JP4113710B2 (ja) | 2008-07-09 |
DE60031448T2 (de) | 2007-02-01 |
EP1270694B1 (de) | 2006-10-18 |
US7056406B2 (en) | 2006-06-06 |
KR20020069015A (ko) | 2002-08-28 |
US6890617B1 (en) | 2005-05-10 |
US20050074578A1 (en) | 2005-04-07 |
US20050153101A1 (en) | 2005-07-14 |
JPWO2001051580A1 (ja) | 2004-01-08 |
EP1270694A4 (de) | 2004-11-10 |
EP1270694A1 (de) | 2003-01-02 |
WO2001051580A1 (fr) | 2001-07-19 |
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