DE4029070A1 - Halbleiterbauelement und verfahren zu seiner herstellung - Google Patents

Halbleiterbauelement und verfahren zu seiner herstellung

Info

Publication number
DE4029070A1
DE4029070A1 DE4029070A DE4029070A DE4029070A1 DE 4029070 A1 DE4029070 A1 DE 4029070A1 DE 4029070 A DE4029070 A DE 4029070A DE 4029070 A DE4029070 A DE 4029070A DE 4029070 A1 DE4029070 A1 DE 4029070A1
Authority
DE
Germany
Prior art keywords
layer
trench
conductive layer
semiconductor substrate
source region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE4029070A
Other languages
German (de)
English (en)
Other versions
DE4029070C2 (https=
Inventor
Su-Han Choi
Seong-Tae Kim
Kyung-Hun Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of DE4029070A1 publication Critical patent/DE4029070A1/de
Application granted granted Critical
Publication of DE4029070C2 publication Critical patent/DE4029070C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03—Making the capacitor or connections thereto
    • H10B12/033—Making the capacitor or connections thereto the capacitor extending over the transistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03—Making the capacitor or connections thereto
    • H10B12/036—Making the capacitor or connections thereto the capacitor extending under the transistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03—Making the capacitor or connections thereto
    • H10B12/038—Making the capacitor or connections thereto the capacitor being in a trench in the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/37—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor being at least partially in a trench in the substrate
    • H10B12/377—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor being at least partially in a trench in the substrate having a storage electrode extension located over the transistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/39—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor and the transistor being in a same trench
    • H10B12/395—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor and the transistor being in a same trench the transistor being vertical

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Thin Film Transistor (AREA)
  • Bipolar Transistors (AREA)
DE4029070A 1990-07-12 1990-09-13 Halbleiterbauelement und verfahren zu seiner herstellung Granted DE4029070A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019900010587A KR930006144B1 (ko) 1990-07-12 1990-07-12 반도체 장치 및 방법

Publications (2)

Publication Number Publication Date
DE4029070A1 true DE4029070A1 (de) 1992-01-23
DE4029070C2 DE4029070C2 (https=) 1992-07-16

Family

ID=19301186

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4029070A Granted DE4029070A1 (de) 1990-07-12 1990-09-13 Halbleiterbauelement und verfahren zu seiner herstellung

Country Status (6)

Country Link
JP (1) JPH0472757A (https=)
KR (1) KR930006144B1 (https=)
DE (1) DE4029070A1 (https=)
FR (1) FR2664742A1 (https=)
GB (1) GB2246014A (https=)
IT (1) IT1243102B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016069227A1 (en) * 2014-10-31 2016-05-06 Dow Global Technologies Llc Separation process
KR102482504B1 (ko) * 2018-04-23 2022-12-30 주식회사 엘지화학 t-부틸 메타크릴레이트의 제조방법
US11031404B2 (en) * 2018-11-26 2021-06-08 Etron Technology, Inc. Dynamic memory structure with a shared counter electrode
CN121013355B (zh) * 2025-10-28 2026-03-17 上海维安半导体有限公司 一种硅电容器及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS627153A (ja) * 1985-07-03 1987-01-14 Hitachi Ltd 半導体メモリ
JPS627152A (ja) * 1985-07-03 1987-01-14 Hitachi Ltd 半導体メモリ
EP0223616A2 (en) * 1985-11-20 1987-05-27 Kabushiki Kaisha Toshiba Semiconductor memory device and manufacturing method
US4734384A (en) * 1985-05-13 1988-03-29 Hitachi, Ltd. Process for manufacturing semiconductor memory device
EP0164829B1 (en) * 1984-04-19 1988-09-28 Nippon Telegraph And Telephone Corporation Semiconductor memory device and method of manufacturing the same
DE3916228A1 (de) * 1988-05-18 1989-11-30 Toshiba Kawasaki Kk Halbleiterspeichervorrichtung mit stapelkondensatorzellenstruktur und verfahren zu ihrer herstellung

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6187358A (ja) * 1984-10-05 1986-05-02 Nec Corp 半導体記憶装置およびその製造方法
EP0236089B1 (en) * 1986-03-03 1992-08-05 Fujitsu Limited Dynamic random access memory having trench capacitor
JPS6384149A (ja) * 1986-09-29 1988-04-14 Hitachi Ltd 半導体メモリの製造方法
GB2199695B (en) * 1987-01-06 1990-07-25 Samsung Semiconductor Inc Dynamic random access memory with selective well biasing
JPH01101664A (ja) * 1987-10-15 1989-04-19 Nec Corp 半導体集積回路装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0164829B1 (en) * 1984-04-19 1988-09-28 Nippon Telegraph And Telephone Corporation Semiconductor memory device and method of manufacturing the same
US4734384A (en) * 1985-05-13 1988-03-29 Hitachi, Ltd. Process for manufacturing semiconductor memory device
JPS627153A (ja) * 1985-07-03 1987-01-14 Hitachi Ltd 半導体メモリ
JPS627152A (ja) * 1985-07-03 1987-01-14 Hitachi Ltd 半導体メモリ
EP0223616A2 (en) * 1985-11-20 1987-05-27 Kabushiki Kaisha Toshiba Semiconductor memory device and manufacturing method
DE3916228A1 (de) * 1988-05-18 1989-11-30 Toshiba Kawasaki Kk Halbleiterspeichervorrichtung mit stapelkondensatorzellenstruktur und verfahren zu ihrer herstellung

Also Published As

Publication number Publication date
IT9021516A0 (it) 1990-09-19
GB2246014A (en) 1992-01-15
GB9020480D0 (en) 1990-10-31
FR2664742A1 (fr) 1992-01-17
JPH0472757A (ja) 1992-03-06
IT1243102B (it) 1994-05-24
KR920003557A (ko) 1992-02-29
DE4029070C2 (https=) 1992-07-16
KR930006144B1 (ko) 1993-07-07
IT9021516A1 (it) 1992-03-19

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee