DE10149093B4 - Halbleiterbauelement mit Harzgehäuse - Google Patents

Halbleiterbauelement mit Harzgehäuse Download PDF

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Publication number
DE10149093B4
DE10149093B4 DE2001149093 DE10149093A DE10149093B4 DE 10149093 B4 DE10149093 B4 DE 10149093B4 DE 2001149093 DE2001149093 DE 2001149093 DE 10149093 A DE10149093 A DE 10149093A DE 10149093 B4 DE10149093 B4 DE 10149093B4
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Germany
Prior art keywords
metal block
semiconductor device
insulating layer
resin
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE2001149093
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German (de)
English (en)
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DE10149093A1 (de
Inventor
Toshiaki Shinohara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication of DE10149093A1 publication Critical patent/DE10149093A1/de
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Publication of DE10149093B4 publication Critical patent/DE10149093B4/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
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    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DE2001149093 2001-02-09 2001-10-05 Halbleiterbauelement mit Harzgehäuse Expired - Lifetime DE10149093B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001033707A JP4286465B2 (ja) 2001-02-09 2001-02-09 半導体装置とその製造方法
JPP2001-033707 2001-02-09

Publications (2)

Publication Number Publication Date
DE10149093A1 DE10149093A1 (de) 2002-08-29
DE10149093B4 true DE10149093B4 (de) 2009-05-07

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DE2001149093 Expired - Lifetime DE10149093B4 (de) 2001-02-09 2001-10-05 Halbleiterbauelement mit Harzgehäuse

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US (2) US6979909B2 (enExample)
JP (1) JP4286465B2 (enExample)
KR (2) KR20020066362A (enExample)
DE (1) DE10149093B4 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011088218A1 (de) * 2011-12-12 2013-06-13 Robert Bosch Gmbh Elektronisches Leistungsmodul mit thermischen Kopplungsschichten zu einem Entwärmungselement
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US7045907B2 (en) 2006-05-16
US20060022331A1 (en) 2006-02-02
US20020109211A1 (en) 2002-08-15
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