DE10103106B4 - Leistungsmodul - Google Patents

Leistungsmodul Download PDF

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Publication number
DE10103106B4
DE10103106B4 DE10103106.8A DE10103106A DE10103106B4 DE 10103106 B4 DE10103106 B4 DE 10103106B4 DE 10103106 A DE10103106 A DE 10103106A DE 10103106 B4 DE10103106 B4 DE 10103106B4
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DE
Germany
Prior art keywords
electrode
power module
smoothing capacitor
port
smoothing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE10103106.8A
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German (de)
English (en)
Other versions
DE10103106A1 (de
Inventor
Nobuyoshi Kimoto
Takanobu Yoshida
Naoki Yoshimatsu
Masuo Koga
Dai Nakajima
Gourab Majumdar
Masakazu Fukada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Semiconductor Engineering Corp
Mitsubishi Electric Corp
Original Assignee
Renesas Semiconductor Engineering Corp
Mitsubishi Electric Corp
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Filing date
Publication date
Application filed by Renesas Semiconductor Engineering Corp, Mitsubishi Electric Corp filed Critical Renesas Semiconductor Engineering Corp
Publication of DE10103106A1 publication Critical patent/DE10103106A1/de
Application granted granted Critical
Publication of DE10103106B4 publication Critical patent/DE10103106B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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    • H01L23/053Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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    • H01L23/50Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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    • H01L2924/351Thermal stress

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Inverter Devices (AREA)
  • Rectifiers (AREA)
  • Power Conversion In General (AREA)
DE10103106.8A 2000-05-16 2001-01-24 Leistungsmodul Expired - Fee Related DE10103106B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000-143482 2000-05-16
JP2000143482A JP4044265B2 (ja) 2000-05-16 2000-05-16 パワーモジュール

Publications (2)

Publication Number Publication Date
DE10103106A1 DE10103106A1 (de) 2001-12-06
DE10103106B4 true DE10103106B4 (de) 2015-11-12

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DE10103106.8A Expired - Fee Related DE10103106B4 (de) 2000-05-16 2001-01-24 Leistungsmodul

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US (3) US6522544B1 (enExample)
JP (1) JP4044265B2 (enExample)
DE (1) DE10103106B4 (enExample)

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JP4423031B2 (ja) * 2001-09-28 2010-03-03 トランスパシフィック・アクティヴァ,リミテッド・ライアビリティ・カンパニー 高い電流の出力制御のための出力半導体構成素子を備えた装置および該装置の使用
US6898072B2 (en) * 2002-01-16 2005-05-24 Rockwell Automation Technologies, Inc. Cooled electrical terminal assembly and device incorporating same
US6965514B2 (en) * 2002-01-16 2005-11-15 Rockwell Automation Technologies, Inc. Fluid cooled vehicle drive module
US7142434B2 (en) 2002-01-16 2006-11-28 Rockwell Automation Technologies, Inc. Vehicle drive module having improved EMI shielding
US7061775B2 (en) 2002-01-16 2006-06-13 Rockwell Automation Technologies, Inc. Power converter having improved EMI shielding
US7177153B2 (en) 2002-01-16 2007-02-13 Rockwell Automation Technologies, Inc. Vehicle drive module having improved cooling configuration
US6972957B2 (en) * 2002-01-16 2005-12-06 Rockwell Automation Technologies, Inc. Modular power converter having fluid cooled support
US7187568B2 (en) * 2002-01-16 2007-03-06 Rockwell Automation Technologies, Inc. Power converter having improved terminal structure
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US20030063442A1 (en) 2003-04-03
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