CN1622304A - 倒装芯片接合方法和用于柱型凸起的衬底分层金属架构 - Google Patents

倒装芯片接合方法和用于柱型凸起的衬底分层金属架构 Download PDF

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CN1622304A
CN1622304A CNA2004100803660A CN200410080366A CN1622304A CN 1622304 A CN1622304 A CN 1622304A CN A2004100803660 A CNA2004100803660 A CN A2004100803660A CN 200410080366 A CN200410080366 A CN 200410080366A CN 1622304 A CN1622304 A CN 1622304A
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bumps
chip
substrate
bonding
ultrasonic waves
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具滋郁
金亨燦
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    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
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    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
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    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
    • H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping
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    • H10W72/07231—Techniques
    • H10W72/07232—Compression bonding, e.g. thermocompression bonding
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    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
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    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
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    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
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    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
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    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
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    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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CNA2004100803660A 2003-11-25 2004-09-29 倒装芯片接合方法和用于柱型凸起的衬底分层金属架构 Pending CN1622304A (zh)

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KR20030083891 2003-11-25
KR1020030083891 2003-11-25

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CN1622304A true CN1622304A (zh) 2005-06-01

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Country Status (7)

Country Link
US (1) US7115446B2 (https=)
JP (1) JP2005159356A (https=)
KR (1) KR100604334B1 (https=)
CN (1) CN1622304A (https=)
SG (1) SG128468A1 (https=)
TW (1) TWI255019B (https=)
WO (1) WO2005053013A1 (https=)

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CN101904230A (zh) * 2007-12-18 2010-12-01 美光科技公司 焊料球的无助熔剂微穿孔方法和所得的装置
CN101331681B (zh) * 2005-12-21 2012-04-18 株式会社大真空 压电谐振片和压电谐振器件

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