CN1527370A - 半导体器件的制造方法 - Google Patents
半导体器件的制造方法 Download PDFInfo
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- CN1527370A CN1527370A CNA2003101149763A CN200310114976A CN1527370A CN 1527370 A CN1527370 A CN 1527370A CN A2003101149763 A CNA2003101149763 A CN A2003101149763A CN 200310114976 A CN200310114976 A CN 200310114976A CN 1527370 A CN1527370 A CN 1527370A
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims (42)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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JP2002332260 | 2002-11-15 | ||
JP332260/2002 | 2002-11-15 | ||
JP312059/2003 | 2003-09-04 | ||
JP2003312059A JP4159431B2 (ja) | 2002-11-15 | 2003-09-04 | 半導体装置の製造方法 |
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Publication Number | Publication Date |
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CN1527370A true CN1527370A (zh) | 2004-09-08 |
CN100433277C CN100433277C (zh) | 2008-11-12 |
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CNB2003101149763A Expired - Fee Related CN100433277C (zh) | 2002-11-15 | 2003-11-14 | 半导体器件的制造方法 |
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US (1) | US6927096B2 (zh) |
JP (1) | JP4159431B2 (zh) |
KR (1) | KR20040042834A (zh) |
CN (1) | CN100433277C (zh) |
TW (1) | TW200411870A (zh) |
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2003
- 2003-09-04 JP JP2003312059A patent/JP4159431B2/ja not_active Expired - Fee Related
- 2003-11-05 US US10/700,577 patent/US6927096B2/en not_active Expired - Lifetime
- 2003-11-10 KR KR1020030078947A patent/KR20040042834A/ko not_active Application Discontinuation
- 2003-11-11 TW TW092131552A patent/TW200411870A/zh unknown
- 2003-11-14 CN CNB2003101149763A patent/CN100433277C/zh not_active Expired - Fee Related
Cited By (8)
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CN101431050A (zh) * | 2007-11-02 | 2009-05-13 | 英飞凌科技股份有限公司 | 制造多半导体器件的方法 |
CN101656238B (zh) * | 2008-08-21 | 2012-09-05 | 日月光半导体制造股份有限公司 | 四方扁平无引脚封装结构及制造方法 |
CN103681521A (zh) * | 2012-09-25 | 2014-03-26 | 英飞凌科技股份有限公司 | 用于芯片卡的半导体壳体 |
CN103681521B (zh) * | 2012-09-25 | 2017-01-04 | 英飞凌科技股份有限公司 | 用于芯片卡的半导体壳体 |
CN104658929A (zh) * | 2014-04-22 | 2015-05-27 | 柯全 | 倒装芯片的封装方法及装置 |
CN110957285A (zh) * | 2019-12-04 | 2020-04-03 | 苏州日月新半导体有限公司 | 集成电路封装体及其制造方法 |
CN112992810A (zh) * | 2021-04-29 | 2021-06-18 | 甬矽电子(宁波)股份有限公司 | 半导体封装结构及其制作方法 |
CN112992810B (zh) * | 2021-04-29 | 2021-08-06 | 甬矽电子(宁波)股份有限公司 | 半导体封装结构及其制作方法 |
Also Published As
Publication number | Publication date |
---|---|
JP4159431B2 (ja) | 2008-10-01 |
US6927096B2 (en) | 2005-08-09 |
KR20040042834A (ko) | 2004-05-20 |
CN100433277C (zh) | 2008-11-12 |
TW200411870A (en) | 2004-07-01 |
US20040097017A1 (en) | 2004-05-20 |
JP2004179622A (ja) | 2004-06-24 |
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