CN1471446A - 官能化合金颗粒 - Google Patents
官能化合金颗粒 Download PDFInfo
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- CN1471446A CN1471446A CNA018180728A CN01818072A CN1471446A CN 1471446 A CN1471446 A CN 1471446A CN A018180728 A CNA018180728 A CN A018180728A CN 01818072 A CN01818072 A CN 01818072A CN 1471446 A CN1471446 A CN 1471446A
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- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/1035—Liquid phase sintering
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/07—Metallic powder characterised by particles having a nanoscale microstructure
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- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
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- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/103—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing an organic binding agent comprising a mixture of, or obtained by reaction of, two or more components other than a solvent or a lubricating agent
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
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- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
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- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
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Abstract
Description
导电填料 | 有机粘结剂 | 添加剂 | 薄膜No. | |||
类型 | 量(重量份) | 类型 | 量(重量份) | 类型 | 量(重量份) | |
实施例1所得的导电填料 | 1 | 环氧树脂(双酚A型)1) | 12 | 咪唑固化剂8) | 0.3 | 1 |
实施例1所得的导电填料 | 1 | 环氧树脂(双酚F型)2) | 50 | 脂族胺固化剂9〕硅烷偶联剂10) | 0.20.01 | 2 |
实施例1所得的导电填料 | 1 | 酚醛树脂(甲阶酚醛树脂类)3) | 170 | 抗氧化剂11)钛偶联剂12) | 0.040.003 | 3 |
实施例2所得的导电填料 | 1 | 环氧树脂(环氧丙烯酸酯)4) | 3 | 酸酐13)铝偶联剂14) | 0.050.03 | 4 |
实施例2所得的导电填料 | 1 | 聚酰亚胺树脂(加成型)5) | 1 | 硅烷偶联剂10)抗氧化剂丙酮17)己烷18)丁基卡必醇19) | 0.050.10.050.020.04 | 5 |
实施例2所得的导电填料 | 1 | 聚酯树脂(聚对苯二甲酸乙二醇酯)6) | 0.2 | 硅烷偶联剂10)增塑剂15)乙基卡必醇20) | 0.00010.0030.05 | 6 |
实施例2所得的导电填料 | 1 | 环氧树脂(脂肪酸改性)7) | 4 | 芳族二胺16)钛偶联剂12) | 0.0030.05 | 7 |
电子仪器零件 | 各向异性导电薄膜No. | 柔性绝缘薄膜 | 基材 | 电极节距(μm) | ||
材料 | 电极 | 材料 | 电极 | |||
1 | 1 | 聚酰亚胺 | Cu | 玻璃 | ITO | 200 |
2 | 2 | 聚酰亚胺 | Al | 玻璃 | ITO | 40 |
3 | 3 | 聚对苯二甲酸乙二醇酯 | Cu | 纸酚醛树脂 | Cu | 200 |
4 | 4 | 聚苯硫醚 | Au | 玻璃环氧树脂 | 镀Sn的铜 | 50 |
5 | 5 | 聚酰亚胺 | 镀Sn的Cu | 聚亚苯基醚 | Al | 100 |
6 | 6 | 聚醚酮 | 镀Au的Ni | 聚酰亚胺 | 镀Sn/Pb的铜 | 60 |
7 | 7 | 氧化铝 | Ag-Pd | 氮化铝 | Ag-Pd | 120 |
电子仪器零件No. | 电阻(Ω) | 绝缘性能 | 由环境试验引起的电阻变化率(%) 评价 | 用途 |
1 | 1 | ◎ | 2 ◎ | 液晶平板 |
2 | 2 | ◎ | 1.5 ◎ | 液晶平板 |
3 | 0.05 | ◎ | 1 ◎ | 印刷电路板 |
4 | 0.1 | ◎ | 3.5 ◎ | 印刷电路板 |
5 | 0.02 | ◎ | 2 ◎ | 柔性印刷电路板 |
6 | 0.03 | ◎ | 2.2 ◎ | 柔性印刷电路板 |
7 | 0.08 | ◎ | 1 ◎ | 混合IC |
导电填料 | 有机粘结剂 | 添加剂 | 薄膜No. | |||
类型 | 量(重量份) | 类型 | 量(重量份) | 类型 | 量(重量份) | |
Cu粉 | 1 | 环氧树脂(双酚A型) | 12 | 咪唑固化剂 | 0.3 | 8 |
Cu粉 | 1 | 环氧树脂(双酚F型) | 50 | 脂族胺固化剂硅烷偶联剂 | 0.20.01 | 9 |
Cu粉 | 1 | 酚醛树脂(甲阶酚醛树脂类) | 170 | 抗氧化剂钛偶联剂 | 0.040.003 | 10 |
Cu粉 | 1 | 环氧树脂(环氧丙烯酸酯) | 3 | 酸酐铝偶联剂 | 0.050.03 | 11 |
Cu粉 | 1 | 聚酰亚胺树脂(加成型) | 1 | 硅烷偶联剂抗氧化剂丙酮己烷丁基卡必醇 | 0.050.10.050.020.04 | 12 |
Cu粉 | 1 | 聚酯树脂(聚对苯二甲酸乙二醇酯) | 0.2 | 硅烷偶联剂增塑剂乙基卡必醇 | 0.00010.0030.05 | 13 |
Cu粉 | 1 | 环氧树脂(脂肪酸改性) | 4 | 芳族二胺钛偶联剂 | 0.0030.05 | 14 |
电子仪器零件 | 各向异性导电薄膜No. | 柔性绝缘薄膜 | 基材 | 电极节距(μm) | ||
材料 | 电极 | 材料 | 电极 | |||
8 | 8 | 聚酰亚胺 | Cu | 玻璃 | ITO | 200 |
9 | 9 | 聚酰亚胺 | Al | 玻璃 | ITO | 40 |
10 | 10 | 聚对苯二甲酸乙二醇酯 | Cu | 纸-酚醛树脂 | Cu | 200 |
11 | 11 | 聚苯硫醚 | Au | 玻璃-环氧树脂 | 镀Sn的铜 | 50 |
12 | 12 | 聚酰亚胺 | 镀Sn的Cu | 聚亚苯基醚 | Al | 100 |
13 | 13 | 聚醚酮 | 镀Au的Ni | 聚酰亚胺 | 镀Sn/Pb的铜 | 60 |
14 | 14 | 氧化铝 | Ag-Pd | 氮化铝 | Ag-Pd | 120 |
电子仪器零件No. | 电阻(Ω) | 绝缘性能 | 由环境试验引起的电阻变化率(%)评价 | 用途 |
8 | 80 | ◎ | 400 × | 液晶平板 |
9 | 2 | × | 10 ◎ | 液晶平板 |
10 | 0.05 | △ | 55 × | 印刷电路板 |
11 | 0.5 | △ | 70 × | 印刷电路板 |
12 | 0.3 | ◎ | 200 × | 柔性印刷电路板 |
13 | 0.5 | ◎ | 150 × | 柔性印刷电路板 |
14 | 0.4 | △ | 90 × | 混合IC |
Claims (24)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP301762/2000 | 2000-10-02 | ||
JP2000301762 | 2000-10-02 |
Publications (2)
Publication Number | Publication Date |
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CN1471446A true CN1471446A (zh) | 2004-01-28 |
CN1273249C CN1273249C (zh) | 2006-09-06 |
Family
ID=18783241
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB018180728A Expired - Lifetime CN1273249C (zh) | 2000-10-02 | 2001-10-02 | 基本不含铅的金属合金颗粒及其生产方法和用途 |
Country Status (9)
Country | Link |
---|---|
US (1) | US7169209B2 (zh) |
EP (1) | EP1327491B1 (zh) |
JP (1) | JP4342176B2 (zh) |
KR (1) | KR100615870B1 (zh) |
CN (1) | CN1273249C (zh) |
AU (1) | AU2001292338A1 (zh) |
DE (1) | DE60142119D1 (zh) |
TW (1) | TW516979B (zh) |
WO (1) | WO2002028574A1 (zh) |
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CN106794516A (zh) * | 2014-08-29 | 2017-05-31 | 同和电子科技有限公司 | 银被覆铜粉及其制造方法 |
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EP2202791B1 (en) * | 2005-11-16 | 2016-01-27 | STMicroelectronics Srl | Semiconductor device having deep through vias |
JP2007169763A (ja) * | 2005-12-26 | 2007-07-05 | Osaka Univ | 二種以上の金属からなる金属ナノ粒子及びその形成方法 |
WO2007120418A2 (en) * | 2006-03-13 | 2007-10-25 | Nextwire Systems, Inc. | Electronic multilingual numeric and language learning tool |
DE102006048513A1 (de) * | 2006-04-29 | 2007-11-08 | Michael Metzke | Wärmeleitschicht und Verfahren zu deren Herstellung |
US7714535B2 (en) * | 2006-07-28 | 2010-05-11 | Semiconductor Energy Laboratory Co., Ltd. | Power storage device |
WO2008105867A1 (en) | 2007-01-02 | 2008-09-04 | Ormet Circuits, Inc. | Methods to produce high density, multilayer printed wiring boards from parallel-fabricated circuits and filled vias |
JP4703581B2 (ja) * | 2007-01-30 | 2011-06-15 | 旭化成イーマテリアルズ株式会社 | 導電性フィラー、及びはんだペースト |
JP5064060B2 (ja) * | 2007-02-22 | 2012-10-31 | 新日本製鐵株式会社 | 高強度ばね用鋼線及び高強度ばね並びにそれらの製造方法 |
JP2008218643A (ja) * | 2007-03-02 | 2008-09-18 | Fujitsu Ltd | 半導体装置及びその製造方法 |
WO2008111615A1 (ja) * | 2007-03-12 | 2008-09-18 | Senju Metal Industry Co., Ltd. | 異方性導電材料 |
US20080225490A1 (en) * | 2007-03-15 | 2008-09-18 | Daewoong Suh | Thermal interface materials |
EP2176929A4 (en) * | 2007-08-01 | 2011-08-31 | Deep Photonics Corp | METHOD AND DEVICE FOR PRODUCING HARMONIC APPARATUS OF PULSED UV LASER |
WO2009032984A1 (en) * | 2007-09-07 | 2009-03-12 | E. I. Du Pont De Nemours And Company | Multi-element alloy powder containing silver and at least two non-silver containing elements |
KR20090067249A (ko) * | 2007-12-21 | 2009-06-25 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
US8071953B2 (en) * | 2008-04-29 | 2011-12-06 | Redlen Technologies, Inc. | ACF attachment for radiation detector |
CN102196881B (zh) * | 2008-10-24 | 2014-06-04 | 三菱电机株式会社 | 半导体装置 |
JP5740979B2 (ja) * | 2009-07-10 | 2015-07-01 | 東レ株式会社 | 接着組成物、接着シート、それらを用いた回路基板および半導体装置ならびにそれらの製造方法 |
JP2011096900A (ja) * | 2009-10-30 | 2011-05-12 | Fujitsu Ltd | 導電体およびプリント配線板並びにそれらの製造方法 |
JP5488241B2 (ja) * | 2010-06-18 | 2014-05-14 | 信越化学工業株式会社 | 合成石英ガラス基板の処理方法 |
JP2011062752A (ja) * | 2010-10-26 | 2011-03-31 | Asahi Kasei E-Materials Corp | 導電性フィラー、及び低温はんだ材料 |
JP5802081B2 (ja) * | 2011-08-24 | 2015-10-28 | 株式会社タムラ製作所 | 異方性導電性ペースト |
US8802989B2 (en) * | 2012-03-26 | 2014-08-12 | Sekisui Chemical Co., Ltd. | Conductive material and connection structure |
US9583453B2 (en) | 2012-05-30 | 2017-02-28 | Ormet Circuits, Inc. | Semiconductor packaging containing sintering die-attach material |
US12053934B2 (en) | 2012-06-18 | 2024-08-06 | Ormet Circuits, Inc. | Conductive film adhesive |
US9005330B2 (en) | 2012-08-09 | 2015-04-14 | Ormet Circuits, Inc. | Electrically conductive compositions comprising non-eutectic solder alloys |
JP6036083B2 (ja) * | 2012-09-21 | 2016-11-30 | 株式会社ソシオネクスト | 半導体装置及びその製造方法並びに電子装置及びその製造方法 |
US10005127B2 (en) | 2014-01-24 | 2018-06-26 | United Technologies Corporation | Powder improvement for additive manufacturing |
CN105684096B (zh) * | 2014-03-07 | 2018-04-17 | 积水化学工业株式会社 | 导电糊剂、连接结构体及连接结构体的制造方法 |
WO2018105125A1 (ja) * | 2016-12-09 | 2018-06-14 | 日立化成株式会社 | 組成物、接着剤、焼結体、接合体及び接合体の製造方法 |
WO2018105126A1 (ja) * | 2016-12-09 | 2018-06-14 | 日立化成株式会社 | 組成物、接着剤、焼結体、接合体及び接合体の製造方法 |
WO2018105128A1 (ja) * | 2016-12-09 | 2018-06-14 | 日立化成株式会社 | 組成物、接着剤、焼結体、接合体及び接合体の製造方法 |
JPWO2018199259A1 (ja) | 2017-04-27 | 2019-11-07 | 三菱電機株式会社 | 半導体装置及び電力変換装置並びに半導体装置の製造方法 |
US11185919B2 (en) | 2018-01-12 | 2021-11-30 | Hammond Group, Inc. | Methods and systems for forming mixtures of lead oxide and lead metal particles |
US12030139B2 (en) * | 2018-10-31 | 2024-07-09 | Robert Bosch Gmbh | Sn—Cu mixed alloy solder paste, method of making the same and soldering method |
CN112743255B (zh) * | 2019-10-30 | 2022-11-04 | 芜湖聚飞光电科技有限公司 | 锡膏及其制备方法、发光器件 |
CN112589108A (zh) * | 2020-11-27 | 2021-04-02 | 青岛科技大学 | 一种二元金属壳层结构微米纳米粒子批量制备方法 |
WO2024070436A1 (ja) * | 2022-09-28 | 2024-04-04 | 綜研化学株式会社 | 異方導電性材料、異方導電性シートおよび異方導電性ペースト並びに接続構造体および接続構造体の製造方法 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB544833A (en) * | 1940-03-07 | 1942-04-29 | Gen Motors Corp | Improved method of making porous metal articles |
JPH02134897A (ja) | 1988-11-15 | 1990-05-23 | Nec Corp | 金属細線補強はんだ付方法 |
JP2648712B2 (ja) * | 1989-07-12 | 1997-09-03 | 触媒化成工業 株式会社 | 異方導電性接着剤およびその異方導電性接着剤を使用した電極間を電気的に接続する方法並びにその方法により形成される電気回路基板 |
US5376403A (en) * | 1990-02-09 | 1994-12-27 | Capote; Miguel A. | Electrically conductive compositions and methods for the preparation and use thereof |
US5853622A (en) * | 1990-02-09 | 1998-12-29 | Ormet Corporation | Transient liquid phase sintering conductive adhesives |
JPH05337679A (ja) | 1992-06-04 | 1993-12-21 | Matsushita Electric Ind Co Ltd | クリーム半田用半田粉末およびその製造方法 |
JPH0647577A (ja) | 1992-07-16 | 1994-02-22 | Mitsubishi Electric Corp | 半田材料及び接合方法 |
JPH07155980A (ja) | 1993-12-09 | 1995-06-20 | Nec Kansai Ltd | 接合方法 |
JPH07171693A (ja) | 1993-12-20 | 1995-07-11 | Toshiba Corp | ハンダ |
JPH09174278A (ja) | 1995-12-27 | 1997-07-08 | Hitachi Ltd | 無鉛はんだ合金およびそれを用いた電子回路装置 |
JPH09206983A (ja) | 1996-02-02 | 1997-08-12 | Sony Corp | はんだ材料 |
JP3776505B2 (ja) | 1996-05-02 | 2006-05-17 | 松下電器産業株式会社 | はんだ接合 |
JP3303227B2 (ja) | 1996-06-13 | 2002-07-15 | 日本航空電子工業株式会社 | AuSn多層ハンダ |
JPH10144718A (ja) * | 1996-11-14 | 1998-05-29 | Fukuda Metal Foil & Powder Co Ltd | スズ基鉛フリーハンダワイヤー及びボール |
JPH10265748A (ja) | 1997-03-26 | 1998-10-06 | Asahi Chem Ind Co Ltd | 導電性接着剤 |
JPH10279902A (ja) * | 1997-04-01 | 1998-10-20 | Asahi Chem Ind Co Ltd | 導電性接着剤 |
US6059952A (en) | 1997-07-10 | 2000-05-09 | International Business Machines Corporation | Method of fabricating coated powder materials and their use for high conductivity paste applications |
US5980785A (en) * | 1997-10-02 | 1999-11-09 | Ormet Corporation | Metal-containing compositions and uses thereof, including preparation of resistor and thermistor elements |
JPH11129091A (ja) | 1997-10-28 | 1999-05-18 | Ngk Spark Plug Co Ltd | 半田合金 |
JP3574738B2 (ja) | 1998-01-29 | 2004-10-06 | 京セラ株式会社 | 配線基板 |
US6342442B1 (en) * | 1998-11-20 | 2002-01-29 | Agere Systems Guardian Corp. | Kinetically controlled solder bonding |
US6613123B2 (en) * | 2000-05-24 | 2003-09-02 | Stephen F. Corbin | Variable melting point solders and brazes |
US6416597B1 (en) * | 2000-08-18 | 2002-07-09 | Visteon Global Tech., Inc. | Solder composition and a method for making the same |
-
2001
- 2001-10-02 JP JP2002532390A patent/JP4342176B2/ja not_active Expired - Lifetime
- 2001-10-02 CN CNB018180728A patent/CN1273249C/zh not_active Expired - Lifetime
- 2001-10-02 AU AU2001292338A patent/AU2001292338A1/en not_active Abandoned
- 2001-10-02 DE DE60142119T patent/DE60142119D1/de not_active Expired - Lifetime
- 2001-10-02 KR KR1020037004633A patent/KR100615870B1/ko not_active IP Right Cessation
- 2001-10-02 US US10/398,114 patent/US7169209B2/en not_active Expired - Fee Related
- 2001-10-02 TW TW090124446A patent/TW516979B/zh not_active IP Right Cessation
- 2001-10-02 EP EP01972661A patent/EP1327491B1/en not_active Expired - Lifetime
- 2001-10-02 WO PCT/JP2001/008687 patent/WO2002028574A1/ja active Application Filing
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Also Published As
Publication number | Publication date |
---|---|
EP1327491A4 (en) | 2006-11-22 |
JPWO2002028574A1 (ja) | 2004-02-12 |
TW516979B (en) | 2003-01-11 |
CN1273249C (zh) | 2006-09-06 |
DE60142119D1 (de) | 2010-06-24 |
KR100615870B1 (ko) | 2006-08-25 |
JP4342176B2 (ja) | 2009-10-14 |
US7169209B2 (en) | 2007-01-30 |
EP1327491B1 (en) | 2010-05-12 |
US20040079194A1 (en) | 2004-04-29 |
WO2002028574A1 (en) | 2002-04-11 |
EP1327491A1 (en) | 2003-07-16 |
AU2001292338A1 (en) | 2002-04-15 |
KR20030063352A (ko) | 2003-07-28 |
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