WO2002028574A1 - Functional alloy particles - Google Patents

Functional alloy particles Download PDF

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Publication number
WO2002028574A1
WO2002028574A1 PCT/JP2001/008687 JP0108687W WO0228574A1 WO 2002028574 A1 WO2002028574 A1 WO 2002028574A1 JP 0108687 W JP0108687 W JP 0108687W WO 0228574 A1 WO0228574 A1 WO 0228574A1
Authority
WO
WIPO (PCT)
Prior art keywords
melting point
alloy particles
initial minimum
minimum melting
functional alloy
Prior art date
Application number
PCT/JP2001/008687
Other languages
French (fr)
Japanese (ja)
Inventor
Shuichi Nakata
Yasuki Shimamura
Original Assignee
Asahi Kasei Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Kabushiki Kaisha filed Critical Asahi Kasei Kabushiki Kaisha
Priority to EP01972661A priority Critical patent/EP1327491B1/en
Priority to AU2001292338A priority patent/AU2001292338A1/en
Priority to KR1020037004633A priority patent/KR100615870B1/en
Priority to DE60142119T priority patent/DE60142119D1/en
Priority to JP2002532390A priority patent/JP4342176B2/en
Priority to US10/398,114 priority patent/US7169209B2/en
Publication of WO2002028574A1 publication Critical patent/WO2002028574A1/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10Sintering only
    • B22F3/1035Liquid phase sintering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/07Metallic powder characterised by particles having a nanoscale microstructure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/103Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing an organic binding agent comprising a mixture of, or obtained by reaction of, two or more components other than a solvent or a lubricating agent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/16Metallic particles coated with a non-metal
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17Metallic particles coated with metal
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00Supplementary information concerning processes or compositions relating to powder metallurgy
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00Supplementary information concerning processes or compositions relating to powder metallurgy
    • B22F2998/10Processes characterised by the sequence of their steps
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262Sn as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302Cu as the principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12229Intermediate article [e.g., blank, etc.]
    • Y10T428/12236Panel having nonrectangular perimeter
    • Y10T428/1225Symmetrical

Abstract

An alloy particle, characterized in that it contains no lead, has a plurality of melting points including an initial minimum melting point (a) and an maximum melting point, has the initial minimum melting point (a) al least in a surface portion, and exhibits an elevated minimum melting point (a') higher than the initial minimum melting point (a) after it is heated to a temperature of the initial minimum melting point (a) or higher to melt it at least at the surface portion and then is cooled to room temperature to thereby solidify the molten portion.
PCT/JP2001/008687 2000-10-02 2001-10-02 Functional alloy particles WO2002028574A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
EP01972661A EP1327491B1 (en) 2000-10-02 2001-10-02 Functional metal alloy particles
AU2001292338A AU2001292338A1 (en) 2000-10-02 2001-10-02 Functional alloy particles
KR1020037004633A KR100615870B1 (en) 2000-10-02 2001-10-02 Functional alloy particles
DE60142119T DE60142119D1 (en) 2000-10-02 2001-10-02 PARTICLES OF A FUNCTIONAL METAL ALLOY.
JP2002532390A JP4342176B2 (en) 2000-10-02 2001-10-02 Functional alloy particles
US10/398,114 US7169209B2 (en) 2000-10-02 2001-10-02 Functional alloy particles

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000-301762 2000-10-02
JP2000301762 2000-10-02

Publications (1)

Publication Number Publication Date
WO2002028574A1 true WO2002028574A1 (en) 2002-04-11

Family

ID=18783241

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2001/008687 WO2002028574A1 (en) 2000-10-02 2001-10-02 Functional alloy particles

Country Status (9)

Country Link
US (1) US7169209B2 (en)
EP (1) EP1327491B1 (en)
JP (1) JP4342176B2 (en)
KR (1) KR100615870B1 (en)
CN (1) CN1273249C (en)
AU (1) AU2001292338A1 (en)
DE (1) DE60142119D1 (en)
TW (1) TW516979B (en)
WO (1) WO2002028574A1 (en)

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JP2003286457A (en) * 2002-03-28 2003-10-10 Asahi Kasei Corp Anisotropic conductive adhesive sheet and its manufacturing method
JP2003286456A (en) * 2002-03-28 2003-10-10 Asahi Kasei Corp Conductive adhesive sheet having anisotropy and its manufacturing method
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WO2006109573A1 (en) 2005-04-01 2006-10-19 Asahi Kasei Emd Corporation Conductive filler and solder material
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WO2015133343A1 (en) * 2014-03-07 2015-09-11 積水化学工業株式会社 Conductive paste, connection structure, and production method for connection structure
WO2018105745A1 (en) * 2016-12-09 2018-06-14 日立化成株式会社 Composition, adhesive, sintered body, joined body, and method for producing joined body
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CN110050040A (en) * 2016-12-09 2019-07-23 日立化成株式会社 The manufacturing method of composition, bonding agent, sintered body, conjugant and conjugant
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DE112018002186T5 (en) 2017-04-27 2020-01-09 Mitsubishi Electric Corporation SEMICONDUCTOR UNIT, POWER CONVERSION DEVICE AND METHOD FOR PRODUCING A SEMICONDUCTOR UNIT
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CN1471446A (en) 2004-01-28
EP1327491A4 (en) 2006-11-22
TW516979B (en) 2003-01-11
KR20030063352A (en) 2003-07-28
EP1327491A1 (en) 2003-07-16
US7169209B2 (en) 2007-01-30
KR100615870B1 (en) 2006-08-25
EP1327491B1 (en) 2010-05-12
US20040079194A1 (en) 2004-04-29
JP4342176B2 (en) 2009-10-14
DE60142119D1 (en) 2010-06-24
JPWO2002028574A1 (en) 2004-02-12
AU2001292338A1 (en) 2002-04-15
CN1273249C (en) 2006-09-06

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