CN1271766C - 氮化物系半导体元件及其制造方法 - Google Patents
氮化物系半导体元件及其制造方法 Download PDFInfo
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- CN1271766C CN1271766C CNB031088279A CN03108827A CN1271766C CN 1271766 C CN1271766 C CN 1271766C CN B031088279 A CNB031088279 A CN B031088279A CN 03108827 A CN03108827 A CN 03108827A CN 1271766 C CN1271766 C CN 1271766C
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- semiconductor layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
- H01S5/32341—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28575—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34333—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer based on Ga(In)N or Ga(In)P, e.g. blue laser
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/015—Manufacture or treatment of FETs having heterojunction interface channels or heterojunction gate electrodes, e.g. HEMT
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
- H10H20/01335—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2304/00—Special growth methods for semiconductor lasers
- H01S2304/04—MOCVD or MOVPE
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04252—Electrodes, e.g. characterised by the structure characterised by the material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2201—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure in a specific crystallographic orientation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/305—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/816—Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Biophysics (AREA)
- Computer Hardware Design (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Lasers (AREA)
- Led Devices (AREA)
- Drying Of Semiconductors (AREA)
- Weting (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002085085 | 2002-03-26 | ||
| JP200285085 | 2002-03-26 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006100959057A Division CN1913104B (zh) | 2002-03-26 | 2003-03-26 | 氮化物系半导体元件的制造方法 |
| CNB2005101286986A Division CN100448039C (zh) | 2002-03-26 | 2003-03-26 | 氮化物系半导体元件 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1447485A CN1447485A (zh) | 2003-10-08 |
| CN1271766C true CN1271766C (zh) | 2006-08-23 |
Family
ID=28449238
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101286986A Expired - Lifetime CN100448039C (zh) | 2002-03-26 | 2003-03-26 | 氮化物系半导体元件 |
| CN2006100959057A Expired - Lifetime CN1913104B (zh) | 2002-03-26 | 2003-03-26 | 氮化物系半导体元件的制造方法 |
| CNB031088279A Expired - Lifetime CN1271766C (zh) | 2002-03-26 | 2003-03-26 | 氮化物系半导体元件及其制造方法 |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101286986A Expired - Lifetime CN100448039C (zh) | 2002-03-26 | 2003-03-26 | 氮化物系半导体元件 |
| CN2006100959057A Expired - Lifetime CN1913104B (zh) | 2002-03-26 | 2003-03-26 | 氮化物系半导体元件的制造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (9) | US6791120B2 (OSRAM) |
| JP (5) | JP5025540B2 (OSRAM) |
| CN (3) | CN100448039C (OSRAM) |
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| US8352400B2 (en) | 1991-12-23 | 2013-01-08 | Hoffberg Steven M | Adaptive pattern recognition based controller apparatus and method and human-factored interface therefore |
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| KR101017657B1 (ko) | 2002-04-30 | 2011-02-25 | 크리 인코포레이티드 | 고 전압 스위칭 디바이스 및 이의 제조 방법 |
| US6864502B2 (en) * | 2002-09-18 | 2005-03-08 | Toyoda Gosei Co., Ltd. | III group nitride system compound semiconductor light emitting element |
| JP3841092B2 (ja) * | 2003-08-26 | 2006-11-01 | 住友電気工業株式会社 | 発光装置 |
| JP4479657B2 (ja) * | 2003-10-27 | 2010-06-09 | 住友電気工業株式会社 | 窒化ガリウム系半導体基板の製造方法 |
| JP2005191530A (ja) * | 2003-12-03 | 2005-07-14 | Sumitomo Electric Ind Ltd | 発光装置 |
| KR101154494B1 (ko) | 2003-12-09 | 2012-06-13 | 재팬 사이언스 앤드 테크놀로지 에이젼시 | 질소면의 표면상의 구조물 제조를 통한 고효율 3족 질화물계 발광다이오드 |
| US7355284B2 (en) * | 2004-03-29 | 2008-04-08 | Cree, Inc. | Semiconductor light emitting devices including flexible film having therein an optical element |
| JP4379208B2 (ja) * | 2004-06-03 | 2009-12-09 | 三菱電機株式会社 | 窒化物半導体装置の製造方法 |
| JP2006128558A (ja) * | 2004-11-01 | 2006-05-18 | Sony Corp | 半導体レーザ、半導体レーザの実装方法、半導体レーザ実装構造体および光ディスク装置 |
| JP5065574B2 (ja) * | 2005-01-12 | 2012-11-07 | 住友電気工業株式会社 | GaN基板の研磨方法 |
| EP1681712A1 (en) | 2005-01-13 | 2006-07-19 | S.O.I. Tec Silicon on Insulator Technologies S.A. | Method of producing substrates for optoelectronic applications |
| CN101124704A (zh) | 2005-03-16 | 2008-02-13 | 松下电器产业株式会社 | 氮化物半导体装置及其制造方法 |
| US7606276B2 (en) * | 2005-05-19 | 2009-10-20 | Panasonic Corporation | Nitride semiconductor device and method for fabricating the same |
| JP2007080896A (ja) * | 2005-09-12 | 2007-03-29 | Sanyo Electric Co Ltd | 半導体素子 |
| JP2008042157A (ja) * | 2006-07-12 | 2008-02-21 | Sumitomo Electric Ind Ltd | 3族窒化物基板の製造方法、および3族窒化物基板 |
| US7585772B2 (en) * | 2006-07-26 | 2009-09-08 | Freiberger Compound Materials Gmbh | Process for smoothening III-N substrates |
| KR100755656B1 (ko) * | 2006-08-11 | 2007-09-04 | 삼성전기주식회사 | 질화물계 반도체 발광소자의 제조방법 |
| EP2087507A4 (en) * | 2006-11-15 | 2010-07-07 | Univ California | METHOD FOR THE HETEROEPITAXIAL GROWTH OF QUALITATIVELY HIGH-QUALITY N-SIDE-GAN, INN AND AIN AND THEIR ALLOYS THROUGH METALLORGANIC CHEMICAL IMMUNE |
| US8193020B2 (en) | 2006-11-15 | 2012-06-05 | The Regents Of The University Of California | Method for heteroepitaxial growth of high-quality N-face GaN, InN, and AlN and their alloys by metal organic chemical vapor deposition |
| US20080111144A1 (en) * | 2006-11-15 | 2008-05-15 | The Regents Of The University Of California | LIGHT EMITTING DIODE AND LASER DIODE USING N-FACE GaN, InN, AND AlN AND THEIR ALLOYS |
| JP2010510655A (ja) * | 2006-11-15 | 2010-04-02 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | N面GaN、InNおよびAlNならびにそれらの合金を用いた発光ダイオードおよびレーザダイオード |
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| JP2011187579A (ja) * | 2010-03-05 | 2011-09-22 | Sony Corp | モードロック半導体レーザ素子及びその駆動方法 |
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| JP5598437B2 (ja) * | 2011-07-12 | 2014-10-01 | 豊田合成株式会社 | Iii族窒化物半導体発光素子の製造方法 |
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| JP6151135B2 (ja) | 2013-09-03 | 2017-06-21 | 株式会社東芝 | 半導体装置及びその製造方法 |
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| CN104752306B (zh) * | 2013-12-31 | 2018-03-09 | 北京北方华创微电子装备有限公司 | 在氮化镓层上刻蚀隔离槽的处理方法 |
| JPWO2015146069A1 (ja) * | 2014-03-28 | 2017-04-13 | パナソニックIpマネジメント株式会社 | 発光ダイオード素子 |
| CN105355550B (zh) * | 2015-12-02 | 2018-05-01 | 中国科学院微电子研究所 | Iii族氮化物低损伤刻蚀方法 |
| CN107460546B (zh) * | 2017-07-18 | 2019-06-25 | 成都新柯力化工科技有限公司 | 一种规模化制备led用半导体材料氮化镓薄膜的方法 |
| CN109755356B (zh) * | 2017-11-07 | 2020-08-21 | 山东浪潮华光光电子股份有限公司 | 一种提升GaN基发光二极管内置欧姆接触性能的方法 |
| JP2022523861A (ja) * | 2019-03-12 | 2022-04-26 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | 支持板を使用して1つ以上の素子のバーを除去するための方法 |
| JP2021012900A (ja) * | 2019-07-03 | 2021-02-04 | パナソニックIpマネジメント株式会社 | Iii族窒化物系半導体レーザ素子 |
| US11538849B2 (en) * | 2020-05-28 | 2022-12-27 | X Display Company Technology Limited | Multi-LED structures with reduced circuitry |
| CN112548845B (zh) * | 2021-02-19 | 2021-09-14 | 清华大学 | 一种基板加工方法 |
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-
2003
- 2003-03-24 US US10/394,260 patent/US6791120B2/en not_active Expired - Lifetime
- 2003-03-26 CN CNB2005101286986A patent/CN100448039C/zh not_active Expired - Lifetime
- 2003-03-26 CN CN2006100959057A patent/CN1913104B/zh not_active Expired - Lifetime
- 2003-03-26 CN CNB031088279A patent/CN1271766C/zh not_active Expired - Lifetime
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2004
- 2004-09-09 US US10/936,499 patent/US6890779B2/en not_active Expired - Lifetime
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2005
- 2005-04-26 US US11/114,193 patent/US7655484B2/en not_active Expired - Lifetime
-
2006
- 2006-12-04 US US11/607,896 patent/US20070077669A1/en not_active Abandoned
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2007
- 2007-06-04 US US11/806,709 patent/US20070235750A1/en not_active Abandoned
- 2007-10-30 US US11/927,905 patent/US20080069162A1/en not_active Abandoned
- 2007-10-30 US US11/928,185 patent/US20080067541A1/en not_active Abandoned
- 2007-10-30 US US11/928,077 patent/US20080179601A1/en not_active Abandoned
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2008
- 2008-03-24 JP JP2008076847A patent/JP5025540B2/ja not_active Expired - Lifetime
- 2008-03-24 JP JP2008076844A patent/JP4180107B2/ja not_active Expired - Lifetime
- 2008-03-24 JP JP2008076845A patent/JP2008211228A/ja active Pending
- 2008-06-16 US US12/139,807 patent/US7629623B2/en not_active Expired - Lifetime
-
2011
- 2011-10-13 JP JP2011226265A patent/JP2012028812A/ja active Pending
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2013
- 2013-08-06 JP JP2013162967A patent/JP2013243400A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US7629623B2 (en) | 2009-12-08 |
| JP2008160166A (ja) | 2008-07-10 |
| CN100448039C (zh) | 2008-12-31 |
| US6890779B2 (en) | 2005-05-10 |
| US20050191775A1 (en) | 2005-09-01 |
| US6791120B2 (en) | 2004-09-14 |
| JP2013243400A (ja) | 2013-12-05 |
| US20070077669A1 (en) | 2007-04-05 |
| CN1797803A (zh) | 2006-07-05 |
| US20080069162A1 (en) | 2008-03-20 |
| US20080067541A1 (en) | 2008-03-20 |
| JP5025540B2 (ja) | 2012-09-12 |
| US7655484B2 (en) | 2010-02-02 |
| JP2008211228A (ja) | 2008-09-11 |
| JP4180107B2 (ja) | 2008-11-12 |
| CN1447485A (zh) | 2003-10-08 |
| JP2008160167A (ja) | 2008-07-10 |
| CN1913104B (zh) | 2010-05-12 |
| CN1913104A (zh) | 2007-02-14 |
| JP2012028812A (ja) | 2012-02-09 |
| US20070235750A1 (en) | 2007-10-11 |
| US20040012032A1 (en) | 2004-01-22 |
| US20050029539A1 (en) | 2005-02-10 |
| US20080179601A1 (en) | 2008-07-31 |
| US20080315221A1 (en) | 2008-12-25 |
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