CN1157783C - 壳式热沉及带壳式热沉的存储器模块 - Google Patents

壳式热沉及带壳式热沉的存储器模块 Download PDF

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CN1157783C
CN1157783C CNB991090365A CN99109036A CN1157783C CN 1157783 C CN1157783 C CN 1157783C CN B991090365 A CNB991090365 A CN B991090365A CN 99109036 A CN99109036 A CN 99109036A CN 1157783 C CN1157783 C CN 1157783C
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河村政史
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Abstract

具有U形剖面的“壳式热沉”5以下面的方式装配到存储器模块10上：存储器模块10插在“壳式热沉”5的U形深槽内，安装在印刷电路板1的每个表面上的所有的封装存储器IC3和其它的部件由“壳式热沉”5覆盖，硅滑脂6填充到“壳式热沉”5和封装的存储器之间。每个封装的存储器中产生的热通过硅滑脂6传导到“壳式热沉”5，热从“壳式热沉”5的表面散发出。此外，安装在印刷电路板1上的所有的部件都由“壳式热沉”5覆盖。

Description

壳式热沉及带壳式热沉的存储器模块
技术领域
本发明涉及构形为装配到存储器模块的壳式热沉，和装配有壳式热沉的存储器模块，具体地涉及构形为装配到由主要安装到印刷电路板上的多个DRAM组成的存储器模块的壳式热沉，和装配有壳式热沉的存储器模块。
背景技术
近来，如DRAM(动态随机存储存储器)等的半导体存储器中工作速度和存储容量正快速地增加。随着半导体存储器集成密度的增加，半导体存储器IC(集成电路)产生的热量也相应地增加。此外，需要容纳包括半导体存储器的微电子部件的模块减小尺寸。另一方面，有时存储器模块包括IC等，用来补偿分立的DRAM增加工作速度造成的信号延时。由此，除了半导体存储器IC以外，许多IC和芯片型电路部件安装在印刷电路板上，由此安装在存储器模块中的部件数量趋于增加。
现在，参考图1A和1B介绍现有技术的存储器模块，图1A和1B为现有技术的存储器模块的一个典型例子的平面图和侧视图。如图1A和1B所示，存储器模块一般由参考数字10表示，包括许多封装的存储器IC 3和多个片状电容器2安装在印刷电路板1的每一面上。印刷电路板1有沿印刷电路板1每一面的长边边缘设置的接触焊盘4的阵列，用于与适当匹配的插槽电连接。
从图1A和1B可以看出，半导体存储器IC 3和片状电容器2以无外壳的形式安装在印刷电路板1的每一面上，存储器模块10以所述无外壳的形式插入到如个人计算机的系统插槽内。因此，存储器IC 3内产生的热量仅由存储器IC 3的表面散发出。
在如上所述的现有技术的存储器模块中，由于存储器IC表面的散热是存储器IC内产生热量的唯一散热方式，因此不能得到满意的散热效率。此外，由于散热效率自身受DRAM封装形状的影响，遇到由于集成度增加引起的DRAM热量增加导致存储器性能下降的新问题。
此外，由于现有技术的存储器模块以安装在模块上的所有元件以无外壳形式的条件下装配，由于运输过程中机械冲击，位于存储器模块的印刷电路板边缘区域处如电容器和电阻器等的芯片型元件断裂或丢失的可能性很大。此外，随着安装在存储器模块的印刷电路板上IC性能的增加，封装的IC的管脚间距变得很窄，由此发生了如由外部原因造成的IC管脚之间短路的另一新问题。
此外，通常通过将部件放置在印制在印刷电路板上的焊膏上，并将印刷电路板放入到回流炉内，以便部件焊接在印刷电路板上，由此将包括存储器IC的部件常规地安装在印刷电路板上。在所述工艺中，印刷电路板经常翘曲，如果部件安装在翘曲的印刷电路板上，当存储器模块插入到如个人计算机的系统插槽内时，应力作用在印刷电路板上，导致部件从印刷电路板上剥离。
日本专利申请审查前公开No.JP-A-07-202120(可以看到JP-A-07-202120的英文摘要，将英文摘要的内容引入到本申请中作为参考)提出通过将封装的存储器IC粘接到散热基片的表面，并用树脂覆盖封装的存储器IC和散热基片的一个表面构造成一种能有效地散发存储器IC产生的热的高散热存储器。
所述现有技术意在提高分立存储器IC的散热效率，由此由安装在印刷电路板上具有高散热效率的多个存储器IC组成的存储器模块，总体上具有高散热效率。然而，分立存储器IC的结构复杂并且昂贵，因此，存储器模块相应地变得昂贵。此外，所述措施不能解决印刷电路板翘曲的问题。
发明内容
因此，本发明的一个目的是提供一种能够克服以上提到的现有技术问题的构形为装配到存储器模块的壳式热沉，和装配有壳式热沉的存储器模块。
本发明的另一个目的是提供一种构形装配到存储器模块的壳式热沉，能有效地散发安装在印刷电路板上如DRAM等的封装半导体存储器产生的热量，并能保护安装在存储器模块的印刷电路板上的部件不受机械冲击，也能鉴别具有封装的半导体存储器和其它部件安装其上的印刷电路板的翘曲程度。
本发明的另一目的是提供一种装配有以上提到的壳式热沉的存储器模块。
根据本发明通过以下方式可以实现本发明的以上和其它目的：提供了一种壳式热沉，用于装配到由安装在印刷电路板上的多个封装的存储器集成电路组成的存储器模块上，所述壳式热沉具有U形剖面的U形槽以及形成于所述U型槽内表面上的导热材料。
在一个实施例中，导热材料是高导热构件，壳式热沉由具有夹紧功能的弹性材料形成，以便存储器模块由壳式热沉通过高导热构件机械地固定。优选壳式热沉在它的外表面上具有多个凸起，以增加外表面面积。
根据本发明的另一方面，提供一种带壳式热沉的存储器模块，它包括：壳式热沉，其具有U形剖面的U形槽以及形成于所述U型槽内表面上的导热材料；存储器模块，由安装在印刷电路板上的多个封装的存储器集成电路组成，所述封装的存储器集成电路插在所述壳式热沉的U形槽的导热材料之间并与所述导热材料接触；接触焊盘，暴露在所述U型壳式热沉的外面。
在一个实施例中，导热材料是高导热构件，壳式热沉由具有夹紧功能的弹性材料形成，以便存储器模块由壳式热沉通过高导热构件机械地固定。导热材料优选为具有电绝缘性质的高导热橡胶，壳式热沉在它的外表面上具有多个凸起，以增加外表面面积。
壳式热沉可以从存储器模块上拆卸下。在另一实施例中，导热材料是硅滑脂。
更优选地，壳式热沉的长度和U形槽的深度足以覆盖安装在印刷电路板上的所有封装的存储器集成电路。
从下面参考附图对本发明优选实施例的介绍中，本发明的以上和其它目的、特点和优点将变得很显然。
附图说明
图1A和1B分别为现有技术的存储器模块的一个典型例子的平面图和侧视图；
图2A和2B分别为根据本发明装配有壳式热沉的存储器模块的第一实施例的平面图和侧视图；
图2C为沿图2B中的线A-A截取的局部剖面图；
图3A和3B分别为根据本发明装配有壳式热沉的存储器模块的第二实施例的平面图和侧视图；以及
图3C为沿图3B中的线B-B截取的局部剖面图。
具体实施方式
参考图2A和2B，其分别显示出根据本发明装配有壳式热沉的存储器模块的第一实施例的平面图和侧视图。图2C为沿图2B中的线B-B截取的局部剖面图。在图2A、2B和2C中，和图1A和1B所示类似的元件用相同的参考标号表示，为简明省略了介绍。
从图1A和1B与图2A和2B之间的对比可以看出，第一实施例的特征在于根据本发明常规的存储器模块10(由安装在印刷电路板1上的多个存储器IC 3和多个片状电容器2组成，多个接触焊盘4沿印刷电路板1的一侧边缘设置)装配有“壳式热沉”5。
所述“壳式热沉”5有图2B所示的U形剖面。即，“壳式热沉”5有一个顶板5A和从顶板5A的相对纵向侧垂直并向下延伸的一对侧板5B和5C，由此限定出U形深凹槽。侧板5B和5C的相对内表面之间的间距S大于存储器模块10的厚度T。从侧板5B和5C的上端到下端，所述间距S固定不变。“壳式热沉”5的长度L和U形深凹槽的深度D(从顶板5A的内表面到一对侧板5B和5C的空(free)边之间的距离)足以覆盖安装在印刷电路板1上的所有封装存储器IC和其它的部件，但将接触焊盘4固定在暴露的状态。在显示的实施例中，“壳式热沉”5的长度L大于从最左边封装的存储器IC的左边到最右边封装的存储器IC的右边的距离，如图2A所示，但短于印刷电路板1的长度，深度D稍长于从如图2A所示印刷电路板1上端到封装的存储器IC下端的距离。
此外，如图2A和2B所示，至少“壳式热沉”5的一对侧板5B和5C具有多个形成在它的外表面上的凸起或小突块5D，以便增加表面面积，由此提高散热效率。但是，不仅一对侧板5B和5C，而且顶板5A在它的外表面上也有多个凸起或小突块5D。
由此，“壳式热沉”5以下面的方式固定到存储器模块10上：存储器模块10插在一对侧板5B和5C之间的U形深槽内，安装在印刷电路板1的每个表面上的所有的封装存储器IC 3和其它的部件由侧板5B和5C覆盖，但接触焊盘4没有被侧板5B和5C覆盖。在这种情况下，如图2C所示，具有良好导热性和电绝缘性的硅滑脂6填充到每个侧板5B和5C的内表面和每个封装的存储器IC 3之间的空间内，由此每个封装的存储器IC 3中产生的热通过硅滑脂6传导到对应的侧板5B和5C。由于硅滑脂6存在于“壳式热沉”5的侧板5B和5C和每个封装的存储器IC 3之间，所以“壳式热沉”5可以从存储器模块10上拆卸下。
如上所述，在第一实施例中，“壳式热沉”5装配在常规的存储器模块10上，硅滑脂6填充在“壳式热沉”5和封装的存储器IC 3之间。采用这种布局，每个封装的存储器IC 3中产生的热通过硅滑脂6传导到“壳式热沉”5，热从“壳式热沉”5的表面散发出。由于“壳式热沉”5的外表面面积显著大于安装在印刷电路板1上的所有封装的存储器IC3的各个外表面面积的总合，因此存储器IC 3中产生的热可以更有效地从“壳式热沉”5上散发，比图1A和1B所示的常规存储器模块10散热更有效。这里，即使“壳式热沉”5的外表面没有凸起5D，如果“壳式热沉”5的外表面面积显著大于安装在印刷电路板1上的所有封装存储器IC 3的各个外表面面积的总合，那么没有必要在“壳式热沉”5的外表面上设置凸起5D。然而，最好是在“壳式热沉”5的外表面上设置凸起5D，这是因为可以进一步地增加“壳式热沉”5的外表面面积。
此外，由于安装在印刷电路板1上的所有的封装存储器IC 3和其它的部件都由“壳式热沉”5覆盖，位于印刷电路板1周边区域如电容器和电阻等的芯片型部件可以免受机械冲击，因此，不存在位于存储器模块的印刷电路板周边区域的芯片型部件在运输过程中断裂或丢失的可能性。
此外，如上所述，当包括存储器IC的部件通过融化印制在印刷电路板上的焊膏安装在印刷电路板上时，印刷电路板经常翘曲。如果印刷电路板的翘曲超过某个限度时，“壳式热沉”5不能装配在存储器模块10上。因此，可以根据“壳式热沉”5是否能装配在存储器模块10上来鉴别印刷电路板的翘曲程度。因此，可以防止将翘曲超过限度的印刷电路板插入到如计算机的系统插槽内引起部件从印刷电路板上脱离。
在所述第一实施例中，如果“壳式热沉”5有良好的导热性和足以保护安装在印刷电路板1上的部件2和3的机械强度免受机械冲击就足够了。因此，“壳式热沉”5可以由金属或陶瓷形成。此外，硅滑脂6可以用粘性系数与硅滑脂相当，并且具有热稳定性、电绝缘性和良好导热性的任何材料代替。此外，如果将“壳式热沉”5装配到存储器模块10上之后，不必将“壳式热沉”5从存储器模块10上拆卸下，那么硅滑脂6可以用具有热稳定性、电绝缘性和良好导热性的紧密接触的粘合剂代替。
参考图3A和3B，分别显示出根据本发明装配有壳式热沉的存储器模块的第二实施例的平面图和侧视图。图3C为沿图3B中的线B-B截取的局部剖面图。在图3A、3B和3C中，和图2A、2B和2C所示类似的元件用相同的参考标号表示，为简化省略了介绍。
从图3A、3B和3C与图2A、2B和2C之间的对比可以看出，第二实施例与第一实施例的不同之处在于第一实施例的“壳式热沉”5和硅滑脂6用分别具有电绝缘性的夹型“壳式热沉”7和高导热橡胶8代替。
夹型“壳式热沉”7由例如具有弹性的金属或陶瓷等弹性材料形成，并具有变形的U形剖面，如图3B所示。具体地，夹型“壳式热沉”7有一个顶板7A和从顶板7A相对的纵向侧向下延伸的一对侧板7B和7C，首先稍微向内延伸距顶板7A一段短距离，然后垂直地延伸，由此限定出之间变形的U形深凹槽，在一对侧板7B和7C之间具有夹紧功能。
此外，类似于第一实施例，至少“壳式热沉”7的一对侧板7B和7C具有多个形成在它的外表面上的凸起或小突块7D，以便增加表面面积，由此提高散热效率。但是，不仅是一对侧板7B和7C，而且顶板7A在它的外表面上也有多个凸起或小突块7D。
类似于第一实施例，侧板7B和7C的相对内表面之间的间距S大于存储器模块10的厚度T。“壳式热沉”7的长度L和U形深凹槽的深度D(从顶板7A的内表面到一对侧板7B和7C的空边之间的距离)足以盖住安装在印刷电路板1上的所有封装的存储器IC和其它的部件，但将接触焊盘4固定在暴露的状态。此外，每个侧板7B和7C的垂直部分的尺寸足以覆盖安装在印刷电路板1上的所有封装的存储器IC和其它的部件，如图3B所示。
由此，夹型“壳式热沉”7以下面的方式固定到存储器模块10上：存储器模块10插在一对侧板7B和7C之间的U形深槽内，安装在印刷电路板1的每个表面上的所有的封装存储器IC 3和其它的部件2由侧板7B和7C覆盖，并由插在每个侧板7B和7C的内表面和每个封装的存储器IC 3之间的高导热橡胶8固定在侧板7B和7C之间。但接触焊盘4没有被侧板7B和7C覆盖。
在第二实施例中，由于“壳式热沉”5由插在侧板7B和7C和封装的存储器IC 3之间高导热橡胶8的弹性材料形成的夹型“壳式热沉”7代替，与第一实施例相比，“壳式热沉”7和封装的存储器IC 3之间的结合可以增强。因此，在每个封装的存储器IC 3中产生的热可以更有效地通过高导热橡胶8传导到“壳式热沉”7，从而热量由“壳式热沉”7的表面散发出。
类似于第一实施例，由于“壳式热沉”7的外表面面积显著大于安装在印刷电路板1上的所有封装存储器IC 3的各个外表面面积的总合，因此存储器IC 3中产生的热可以更有效地从“壳式热沉”7上散发，比图1A和1B所示的常规存储器模块10散热更有效。此外，由于与第一实施例相比，“壳式热沉”7和封装的存储器IC 3之间的结合可以增强，在封装的存储器IC 3中产生的热可以比第一实施例的“壳式热沉”5更有效地散发出。
此外，由于夹型“壳式热沉”7用夹型“壳式热沉”7的弹性施加的适当的外力固定存储器模块10，与使用硅滑脂6的第一实施例相比，“壳式热沉”从存储器模块10上脱落的可能性非常小。
此外，类似于第一实施例，由于安装在印刷电路板1的每个表面上的所有的封装存储器IC 3和其它的部件2都由夹型“壳式热沉”7覆盖，位于印刷电路板1周边区域如电容器和电阻等的芯片型部件可以免受机械冲击，因此，不存在位于存储器模块的印刷电路板周边区域的芯片型部件在运输过程中断裂或丢失的可能性。
此外，如上所述，当包括存储器IC的部件通过融化印制在印刷电路板上的焊膏安装在印刷电路板上，印刷电路板经常翘曲。如果印刷电路板的翘曲超过某个限度时，夹型“壳式热沉”7不能安装在存储器模块10上。因此，与第一实施例类似，可以根据“壳式热沉”7是否能安装在存储器模块10上来鉴别印刷电路板的翘曲程度。因此，可以防止将翘曲超过限度的印刷电路板插入到如个人计算机的系统插槽内引起的部件从印刷电路板上剥离。
从以上可以看出，根据本发明装配有壳式热沉的存储器模块具有以下优点：
第一个优点是安装在存储器模块中的封装存储器IC，优选其它的部件中产生的热可以有效地散发。原因是由于如封装的存储器IC等的热产生体通过硅滑脂或高导热橡胶以良好的导热关系连接到“壳式热沉”，热产生体中产生的热可以有效地传导到“壳式热沉”，进一步有效地从具有大表面积的“壳式热沉”表面上散发出。
第二个优点是保护安装在印刷电路板上的部件免受机械冲击，由于安装在印刷电路板上的所有部件都由机械强度足以保护安装在印刷电路板上的部件免受机械冲击的“壳式热沉”覆盖，由此从外部施加的力并没有施加到安装在印刷电路板上的部件上。
第三个优点是可以鉴别印刷电路板的翘曲程度是否超出了允许的限度。由于如果印刷电路板的翘曲(当包括存储器IC的部件安装在印刷电路板上时由于热和其它原因造成)超过某个限度时，“壳式热沉”不能装配到存储器模块上。此外，即使“壳式热沉”装配到轻微翘曲的存储模块上，通过对装配有“壳式热沉”的存储器模块进行电测试，可以知道安装到印刷电路板上的部件是否从印刷电路板上剥离。因此，可以防止有缺陷的存储器模块供应到市场。
由此参考具体的实施例显示和介绍了本发明。然而，应该注意本发明并不局限于示出结构的细节，变型和修改都在附带的权利要求书的范围内。

Claims (10)

1.一种壳式热沉，装配到由安装在印刷电路板上的多个封装的存储器集成电路组成的存储器模块上，所述壳式热沉具有U形剖面的U形槽以及形成于所述U型槽内表面上的导热材料。
2.根据权利要求1的壳式热沉，其中所述导热材料是高导热构件，壳式热沉由具有夹紧功能的弹性材料形成，以便存储器模块由壳式热沉通过高导热构件机械地固定。
3.根据权利要求1或2的壳式热沉，其中所述壳式热沉在它的外表面上具有多个凸起，以增加外表面面积。
4.一种带壳式热沉的存储器模块，包括：
壳式热沉，其具有U形剖面的U形槽以及形成于所述U型槽内表面上的导热材料；
存储器模块，由安装在印刷电路板上的多个封装的存储器集成电路组成，所述封装的存储器集成电路插在所述壳式热沉的U形槽的导热材料之间并与所述导热材料接触；
接触焊盘，暴露在所述U型壳式热沉的外面。
5.根据权利要求4的存储器模块，其中所述导热材料是高导热构件，壳式热沉由具有夹紧功能的弹性材料形成，以便存储器模块由壳式热沉通过所述高导热构件机械地固定。
6.根据权利要求4的存储器模块，其中所述导热材料为硅滑脂。
7.根据权利要求4，5或6的存储器模块，其中所述壳式热沉在它的外表面上具有多个凸起，以增加外表面面积。
8.根据权利要求4，5或6的存储器模块，其中所述壳式热沉可以从存储器模块上拆卸下。
9.根据权利要求4或5的存储器模块，其中所述导热材料优选为具有电绝缘性质的高导热橡胶。
10.根据权利要求4的存储器模块，其中所述壳式热沉的长度和所述U形凹槽的深度足以覆盖安装在印刷电路板上的所有所述封装的存储器集成电路。
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