US20020001180A1 - Heat sink and memory module with heat sink - Google Patents

Heat sink and memory module with heat sink Download PDF

Info

Publication number
US20020001180A1
US20020001180A1 US09/332,325 US33232599A US2002001180A1 US 20020001180 A1 US20020001180 A1 US 20020001180A1 US 33232599 A US33232599 A US 33232599A US 2002001180 A1 US2002001180 A1 US 2002001180A1
Authority
US
United States
Prior art keywords
heat sink
memory module
circuit board
printed circuit
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
US09/332,325
Other versions
US6424532B2 (en
Inventor
Masashi Kawamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Electronics Corp
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Assigned to NEC CORPORATION reassignment NEC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KAWAMURA, MASASHI
Publication of US20020001180A1 publication Critical patent/US20020001180A1/en
Application granted granted Critical
Publication of US6424532B2 publication Critical patent/US6424532B2/en
Assigned to NEC CORPORATION, NEC ELECTRONICS CORPORATION reassignment NEC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NEC CORPORATION
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
    • H01L2225/1029—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being a lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1047—Details of electrical connections between containers
    • H01L2225/107—Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1094—Thermal management, e.g. cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A memory module 10 is fitted with a “cover and heat sink” 5 having a U-shape in cross section in such a manner that the memory module 10 is inserted into a U-shaped deep recess of the “cover and heat sink” 5, and all packaged memory ICs 3 and the other components 2 mounted on each face of a printed circuit board 1 are covered by the “cover and heat sink” 5, with a silicone grease 6 being filled between the “cover and heat sink” 5 and the packaged memory ICs 3. The heat generated in each packaged memory IC 3 is conducted to the “cover and heat sink” 5 through the silicone grease 6, and the heat is radiated from the surface of the “cover and heat sink” 5 having a large surface area. In addition, since all the components 2 and 3 mounted on the printed circuit board 1 are covered with the “cover and heat sink” 5, the components 2 and 3 mounted on the printed circuit board 1 are protected from a mechanical shock. Furthermore, it is possible to discriminate whether or not the degree of the warping of the printed circuit board 1 exceeds a permissible limit. Because, if the warping of the printed circuit board exceeds a certain limit, the memory module cannot be inserted into the U-shaped deep recess of the “cover and heat sink” 5.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention [0001]
  • The present invention relates to a heat sink configured to be fitted to a memory module, and a memory module fitted with a heat sink, and more specifically to a heat sink configured to be fitted to a memory module composed of a plurality of DRAMs mainly mounted on a printed circuit board, and such a memory module fitted with a heat sink. [0002]
  • 2. Description of Related Art [0003]
  • Recently, an increase of the operation speed and the storage capacity in semiconductor memories such as a DRAM (dynamic random access memory) is being rapidly advanced. With an increased integration density of the semiconductor memories, a generated heat amount of the semiconductor memory ICs (integrated circuit) increases correspondingly. In addition, the down-sizing of a module accommodating microelectronic components including the semiconductor memory ICs is demanded. On the other hand, it is in some cases that a memory module includes an IC or the like for compensating for a time delay of a signal caused by an increased operation speed of individual DRAMs. As a result, many ICs and chip-type circuit components are mounted on a printed circuit board in addition to the semiconductor memory ICs, so that the number of components mounted in a memory module has a tendency to increase. [0004]
  • Now, a prior art memory module will be described with reference to FIGS. 1A and 1B, which are a diagrammatic plan view and a diagrammatic side view of one typical example of the prior art memory module. As shown in FIGS. 1A and 1B, the memory module is generally designated with [0005] reference number 10, and includes a number of packaged memory ICs 3 and a plurality of chip-type capacitors 2 mounted on each face of a printed circuit board 1. The printed circuit board 1 has an array of contact pads 4 provided along a long-side edge of each face of the printed circuit board 1 for electrical connection with an appropriate mating socket.
  • As seen from FIGS. 1A and 1B, the [0006] semiconductor memory ICs 3 and the chip-type capacitors 2 are mounted on each face of the printed circuit board 1 in a naked condition, and the memory module 10 is inserted into a slot within a system such a personal computer in this naked condition. Therefore, heat generated in the memory ICs 3 is radiated from only the surface of the memory ICs 3.
  • In the prior art memory module as mentioned above, since the heat radiation from the surface of the memory ICs is only the dissipation of he heat generated in the memory ICs, a satisfactory heat dissipation efficiency cannot be obtained. Further, since the heat radiating efficiency itself is influenced by a shape of the DRAM package, a new problem is encountered in that the performance of the memory drops because of an increased heat of the DRAM caused with an increased integration density. [0007]
  • In addition, since the prior art memory module is assembled in the condition that all components mounted on the module are in a naked condition, there is high possibility that the chip-type components such as capacitors and resistors located at a peripheral zone of the printed circuit board of the memory module are broken or lost because of a mechanical shock in the course of transportation. Furthermore, with an increased performance of the ICs mounted on the printed circuit board of the memory module, a pin pitch of the packaged ICs becomes narrow, with the result that there occurs another new problem such as a short-circuiting between the pins of the IC caused by an external cause. [0008]
  • Besides, the components including the memory ICs are ordinarily mounted on the printed circuit board by locating the components on a solder paste printed on the printed circuit board, and putting the printed circuit board into a reflow oven so that the components are soldered on the printed circuit board. In this process, the printed circuit board is often warped, and if the components are mounted on the warped printed circuit board, when the memory module is inserted into a slot within a system such as a personal computer, a stress acts on the printed circuit board, with the result that the components are peeled off from the printed circuit board. [0009]
  • Japanese Patent Application Pre-examination Publication No. JP-A-07-202120 (an English abstract of JP-A-07-202120 is available and the content of the English abstract is incorporated by reference in its entirety into this application) proposes a high heat radiating memory constructed to efficiently radiate heat generated from a memory IC, by bonding the packaged memory IC to one surface of a heat radiating substrate and by covering the packaged memory IC and the one surface of the heat radiating substrate with resin. [0010]
  • This prior art is intended to elevate the heat radiating efficiency of individual memory ICs, with the result that the memory module composed of a number of memory ICs having a high heat radiating efficiency mounted on a printed circuit board, can have a high heat radiating efficiency in total. However, the individual memory IC becomes complicated in structure and expensive, and therefore, the memory module correspondingly becomes expensive. In addition, this approach cannot solve the problem of the warping of the printed circuit board. [0011]
    • SUMMARY OF THE INVENTION
  • Accordingly, it is an object of the present invention to provide a heat sink configured to be fitted to a memory module, and a memory module fitted with a heat sink, which have overcome the above mentioned problems of the prior art. [0012]
  • Another object of the present invention is to provide a heat sink which is configured to be fitted to a memory module, and which can efficiently dissipate heat generated from packaged semiconductor memories such as DRAMs mounted on the memory module, and can protect components mounted on a printed circuit board of the memory module, from a mechanical shock, and also can discriminate the degree of warping of the printed circuit board having the packaged semiconductor memories and the other components mounted thereon. [0013]
  • Still another object of the present invention is to provide a memory module fitted with the above mentioned heat sink. [0014]
  • The above and other objects of the present invention are achieved in accordance with the present invention by a heat sink configured to be fitted over a memory module composed of a plurality of packaged memory integrated circuits mounted on a printed circuit board, the heat sink having a U-shape in cross section so that the memory module can be inserted into a U-shaped recess of the heat sink with a thermal conductive material being interposed between the heat sink and the packaged memory integrated circuits mounted on the printed circuit board and being in contact with the heat sink and the packaged memory integrated circuits. [0015]
  • In one embodiment, the thermal conductive material is a high thermal conductive member, and the heat sink is formed of a resilient material to have a clip function so that the memory module is mechanically held by the heat sink through the high thermal conductive member. Preferably, the heat sink has a number of convexities on an outer surface thereof to having an increased outer surface area. [0016]
  • According to another aspect of the present invention, there is provided a memory module composed of a plurality of packaged memory integrated circuits mounted on a printed circuit board, and fitted with a heat sink having a U-shape in cross section in such a manner that the memory module is inserted into a U-shaped recess of the heat sink with a thermal conductive material being interposed between the heat sink and the packaged memory integrated circuits and being in contact with the heat sink and the packaged memory integrated circuits [0017]
  • In one embodiment, the thermal conductive material is a high thermal conductive member, and the heat sink is formed of a resilient material to have a clip function so that the memory module is mechanically held by the heat sink through the high thermal conductive member. Preferably, the thermal conductive member is a high thermal conductive rubber having an electrical insulative property, and the heat sink has a number of convexities on an outer surface thereof to having an increased outer surface area. [0018]
  • The heat sink can be detachable from the memory module. In another embodiment, the thermal conductive material is a silicone grease. [0019]
  • More preferably, the heat sink has a length of the heat sink and a depth of the U-shaped recess sufficient to cover all of the packaged memory integrated circuits mounted on a printed circuit board. [0020]
  • The above and other objects, features and advantages of the present invention will be apparent from the following description of preferred embodiments of the invention with reference to the accompanying drawings.[0021]
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIGS. 1A and 1B are a diagrammatic plan view and a diagrammatic side view of one typical example of the prior art memory module, respectively; [0022]
  • FIGS. 2A and 2B are a diagrammatic plan view and a diagrammatic cross-sectional view of a first embodiment of the memory module fitted with the heat sink in accordance with the present invention, respectively; [0023]
  • FIG. 2C is a diagrammatic partial sectional view taken along the line A-A in FIG. 2B; [0024]
  • FIGS. 3A and 3B are a diagrammatic plan view and a diagrammatic cross-sectional view of a second embodiment of the memory module fitted with the heat sink in accordance with the present invention, respectively; and [0025]
  • FIG. 3C is a diagrammatic partial sectional view taken along the line B-B in FIG. 3B. [0026]
    • DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Referring to FIGS. 2A and 2B, there are shown a diagrammatic plan view and a diagrammatic cross-sectional view of a first embodiment of the memory module fitted with the heat sink in accordance with the present invention, respectively. FIG. 2C is a diagrammatic partial sectional view taken along the line A-A in FIG. 2B. In FIGS. 2A, 2B and [0027] 2C, elements similar to those shown in FIGS. 1A and 1B are given with the same reference numbers, and explanation will be omitted for simplification.
  • As seen from comparison between FIGS. 1A and 1B and FIGS. 2A and 2B, the first embodiment is characterized in that the conventional memory module [0028] 10 (composed of a plurality of memory ICs 3 and a plurality of chip-type capacitors 2 mounted on a printed circuit board 1 having a number of contact pads 4 located along one side edge of the printed circuit board 1) is fitted with a “cover and heat sink” 5 in accordance with present invention.
  • This “cover and heat sink” [0029] 5 has a U-shape in a cross-section as shown in FIG. 2B. Namely, the “cover and heat sink” 5 has a top plate 5A and a pair of side plates 5B and 5C vertically and straight downward extending from opposite longitudinal sides of the top plate 5A so as to confine therebetween a U-shaped deep recess. A spacing 5 between opposing inner surfaces of the side plates 5B and 5C is larger than a thickness T of the memory module 10. This spacing 5 is at constant from an upper end to a lower end of the side plates 5B and 5C. A length L of the “cover and heat sink” 5 and a depth D of the U-shaped deep recess (a distance from an inner surface of the top plate 5A to a free edge of the pair of side plates 5B and 5C) are sufficient to cover all the packaged memory ICs and the other components mounted on the printed circuit board 1, but to maintain the contact pads 4 in an exposed condition. In the shown embodiment, the length L of the “cover and heat sink” 5 is longer than a distance from a left edge of the leftmost packaged memory IC to a right edge of the rightmost packaged memory IC, in FIG. 2A, but shorter than a length of the printed circuit board 1, and the depth D is slightly longer than a distance from an upper end of the printed circuit board 1 to a lower end of the packaged memory ICs in the condition shown in FIG. 2A.
  • In addition, as shown in FIGS. 2A and 2B, at least the pair of [0030] side plates 5B and 5C of the “cover and heat sink” 5 preferably have a number of convexities or small projections 5D formed on an outer surface thereof in order to have an increase surface area so as to elevate heat radiation efficiency. But, not only the pair of side plates 5B and 5C but also both the top plate 5A can have a number of convexities or small projections 5D on an outer surface thereof.
  • Thus, the “cover and heat sink” [0031] 5 is fitted over the memory module 10 in such a manner that the memory module 10 is inserted into the U-shaped deep recess between the pair of side plates 5B and 5C and all the packaged memory ICs 3 and the other components 2 mounted on each face of the printed circuit board 1 are covered by the side plates 5B and 5C but the contact pads 4 are not covered by the side plates 5B and 5C.
  • In this condition, as shown in FIG. 2C, a [0032] silicone grease 6 having a good thermal conductivity and an electric insulative property, is filled into a space between the inner surface of each of the side plates 5B and 5C and each of the packaged memory ICs 3 so that the heat generated in each packaged memory IC 3 is conducted through the silicone grease 6 to a corresponding side plate 5B or 5C. Since the silicone grease 6 is between the side plates 5B and 5C of the “cover and heat sink” 5 and each of the packaged memory ICs 3, the “cover and heat sink” 5 is detachable from the memory module 10.
  • As mentioned above, in the first embodiment, the “cover and heat sink” [0033] 5 is fitted over the conventional memory module 10 with the silicone grease 6 being filled between the “cover and heat sink” 5 and the packaged memory ICs 3. With this arrangement, the heat generated in each packaged memory IC 3 is conducted to the “cover and heat sink” 5 through the silicone grease 6, and the heat is radiated from the surface of the “cover and heat sink” 5. Since the outer surface area of the “cover and heat sink” 5 is remarkably larger than the total of respective outer surface areas of all the packaged memory IC 3 mounted on the printed circuit board 1, the heat generated in the packaged memory ICs 3 can be more efficiently dissipated from the “cover and heat sink” 5, than in the conventional memory module 10 shown in FIGS. 1A and 1B. Here, even if the outer surface of the “cover and heat sink” 5 have no convexity 5D, if the outer surface area of the “cover and heat sink” 5 is remarkably larger than the total of respective outer surface areas of all the packaged memory IC 3 mounted on the printed circuit board 1, the convexities 5D may not necessarily be provided on the outer surface of the “cover and heat sink” 5. However, it is the most preferable that the convexities 5D are provided on the outer surface of the “cover and heat sink” 5, since it is possible to further increase the outer surface area of the “cover and heat sink” 5.
  • Furthermore, since all the packaged [0034] memory IC 3 and the other components 2 mounted on the printed circuit board 1 are covered with the “cover and heat sink” 5, the chip-type components such as capacitors and resistors located at a peripheral zone of the printed circuit board 1 are protected from a mechanical shock, and therefore, there is no possibility that the chip-type components located at the peripheral zone of the printed circuit board of the memory module are broken or lost in the course of transportation.
  • In addition, as mentioned above, when the components including the memory ICs are mounted on the printed circuit board by melting the solder paste printed on the printed circuit board, the printed circuit board is often warped. If the warping of the printed circuit board exceeds a certain limit, the “cover and heat sink” [0035] 5 can no longer be fitted over the memory module 10. Therefore, it is possible to discriminate the degree of the warping of the printed circuit board, on the basis of whether or not the “cover and heat sink” 5 can be fitted over the memory module 10. Accordingly, it is possible to prevent the components from being peeled off from the printed circuit board, which would be caused by inserting the printed circuit board having the warping exceeding the limit, into a slot within a system such as a personal computer.
  • In this first embodiment, it is sufficient if the “cover and heat sink” [0036] 5 has a good thermal conductivity and a mechanical strength sufficient to protect the components 2 and 3 mounted on the printed circuit board 1 from a mechanical shock. Accordingly, the “cover and heat sink” 5 can be formed of a metal or a ceramic. In addition, the silicone grease 6 can be replaced with any material which has a viscosity comparable to the silicone grease and which has a thermal stability, an electrical insulative property and a good thermal conductivity. Furthermore, if it is unnecessary to detach the “cover and heat sink” 5 from the memory module 10 after the “cover and heat sink” 5 is fitted over the memory module 10, the silicone grease 6 can be replaced with a close contact adhesive which has a thermal stability, an electrical insulative property and a good thermal conductivity.
  • Referring to FIGS. 3A and 3B, there are shown a diagrammatic plan view and a diagrammatic cross-sectional view of a second embodiment of the memory module fitted with the heat sink in accordance with the present invention, respectively. FIG. 3C is a diagrammatic partial sectional view taken along the line B-B in FIG. 3B. In FIGS. 3A, 3B and [0037] 3C, elements similar to those shown in FIGS. 2A, 2B and 2C are given with the same reference numbers, and explanation will be omitted for simplification.
  • As seen from comparison between FIGS. 3A, 3B and [0038] 3C and FIGS. 2A, 2B and 2C, the second embodiment is different from the first embodiment in that the “cover and heat sink” 5 and the silicone grease 6 of the first embodiment are replaced with a clip type “cover and heat sink” 7 and a high thermal conductive rubber 8 having an electrical insulative property, respectively.
  • The clip type “cover and heat sink” [0039] 7 is formed of a resilient material, for example a metal or ceramic having a spring property, and has a deformed U-shape in cross section, as shown in FIG. 3B. More specifically, the clip type “cover and heat sink” 7 has a top plate 7A and a pair of side plates 7B and 7C downward extending from opposite longitudinal sides of the top plate 5A to first slightly inwardly extend a short distance from the top plate 7A and to then extend vertically and straight, so as to confine therebetween a deformed U-shape deep recess and to have a clip function between the pair of side plates 7B and 7C.
  • In addition, similarly to the first embodiment, at least the pair of [0040] side plates 7B and 7C of the clip type “cover and heat sink” 7 preferably Å@ have a number of convexities or small projections 7D formed on an outer surface thereof in order to have an increase surface area so as to elevate heat radiation efficiency. But, not only the pair of side plates 7B and 7C but also both the top plate 7A can have a number of convexities or small projections 7D on an outer surface thereof.
  • Similarly to the first embodiment, a [0041] spacing 5 between opposing inner surfaces of a vertical straight portion of the side plates 7B and 7C is larger than a thickness T of the memory module 10. A length L of the “cover and heat sink” 5 and a depth D of the deep recess (a distance from an inner surface of the top plate 7A to a free edge of the pair of side plates 7B and 7C) are sufficient to cover all the packaged memory ICs and the other components mounted on the printed circuit board 1, but to maintain the contact pads 4 in an exposed condition. In addition, the vertical straight portion of each of the side plates 7B and 7C has a size sufficient to cover all the packaged memory ICs and the other components mounted on the printed circuit board 1, as shown in FIG. 3B.
  • Thus, the clip type “cover and heat sink” [0042] 7 is fitted over the memory module 10 in such a manner that the memory module 10 is inserted into the deep recess between the pair of side plates 7B and 7C and that all the packaged memory ICs 3 and the other components 2 mounted on each face of the printed circuit board 1 are covered by the side plates 7B and 7C and held between the side plates 7B and 7C with the high thermal conductive rubber 8 being inserted between the inner surface of each of the side plates 7B and 7C and each of the packaged memory ICs 3. But, the contact pads 4 are not covered by the side plates 7B and 7C.
  • In this second embodiment, since the “cover and heat sink” [0043] 5 is replaced with the clip type “cover and heat sink” 7 formed of the resilient material with the high thermal conductive rubber 8 being inserted between the side plates 7B and 7C and the packaged memory ICs 3, the bonding between the clip type “cover and heat sink” 7 and the packaged memory ICs 3 can be elevated in comparison with the first embodiment. Therefore, the heat generated in each packaged memory IC 3 can be more efficiently conducted to the clip type “cover and heat sink” 7 through the high thermal conductive rubber 8, so that the heat is radiated from the surface of the clip type “cover and heat sink” 7.
  • Similarly to the first embodiment, since the outer surface area of the clip type “cover and heat sink” [0044] 7 is remarkably larger than the total of respective outer surface areas of all the packaged memory IC 3 mounted on the printed circuit board 1, the heat generated in the packaged memory ICs 3 can be more efficiently dissipated from the clip type “cover and heat sink” 7, than in the conventional memory module 10 shown in FIGS. 1A and 1B. In addition, since the bonding between the clip type “cover and heat sink” 7 and the packaged memory ICs 3 can be elevated in comparison with the first embodiment, the heat generated in the packaged memory ICs 3 can be more efficiently dissipated than the “cover and heat sink” 5 of the first embodiment.
  • Moreover, since the [0045] memory module 10 is held by the clip type “cover and heat sink” 7 with an appropriate force exerted by the resilient property of the clip type “cover and heat sink” 7, possibility of the “cover and heat sink” being dropped off from the memory module 10 becomes remarkably small in comparison with the first embodiment using the silicone grease 6.
  • Furthermore, similarly to the first embodiment, since all the packaged [0046] memory IC 3 and the other components 2 mounted on the printed circuit board 1 are covered with the clip type “cover and heat sink” 7, the chip-type components such as capacitors and resistors located at a peripheral zone of the printed circuit board 1 are protected from a mechanical shock, and therefore, there is no possibility that the chip-type components located at the peripheral zone of the printed circuit board of the memory module are broken or lost in the course of transportation.
  • In addition, as mentioned above, when the components including the memory ICs are mounted on the printed circuit board by melting the solder paste printed on the printed circuit board, the printed circuit board is often warped. If the warping of the printed circuit board exceeds a certain limit, the clip type “cover and heat sink” [0047] 7 can no longer be fitted over the memory module 10. Therefore, similarly to the first embodiment, it is possible to discriminate the degree of the warping of the printed circuit board, on the basis of whether or not the clip type “cover and heat sink” 7 can be fitted over the memory module 10. Accordingly, it is possible to prevent the components from being peeled off from the printed circuit board, which would be caused by inserting the printed circuit board having the warping exceeding the limit, into a slot within a system such as a personal computer.
  • As seen from the above, the memory module fitted with the heat sink in accordance with the present invention have the following advantages: [0048]
  • A first advantage is that the heat generated in the packaged memory ICs, and preferably the other components, mounted in the memory module can be efficiently dissipated. The reason for this is that, since the heat generating bodies such as the packaged memory ICs are coupled to the “cover and heat sink” through the silicone grease or the high thermal conductive rubber in a good heat conducting relation, the heat generated in the heat generating bodies are efficiently conducted to the “cover and heat sink”, and further efficiently dissipated from the surface of the “cover and heat sink” having a large surface area. [0049]
  • A second advantage is that the components mounted on the printed circuit board are protected from a mechanical shock, since all the components mounted on the printed circuit board are covered with the “cover and heat sink” having a mechanical strength sufficient to protect the components mounted on the printed circuit board from the mechanical shock, with the result that an externally applied force is not applied to the components mounted on the printed circuit board. [0050]
  • A third advantage is that it is possible to discriminate whether or not the degree of the warping of the printed circuit board exceeds a permissible limit. Because, if the warping of the printed circuit board (which occurred because of heat and other causes when the components including the memory ICs are mounted on the printed circuit board) exceeds a certain limit, the “cover and heat sink” can no longer be fitted over the memory module. In addition, even if the “cover and heat sink” could be fitted over the memory module having a slight warping, it is possible to know whether or not the component mounted on the printed circuit board is peeled off from the printed circuit board, by carrying out an electric test for the memory module fitted with the “cover and heat sink”. Therefore, it is possible to prevent a defective memory module from being supplied to a market. [0051]
  • The invention has thus been shown and described with reference to the specific embodiments. However, it should be noted that the present invention is in no way limited to the details of the illustrated structures but changes and modifications may be made within the scope of the appended claims. [0052]

Claims (16)

1. A heat sink configured to be fitted over a memory module composed of a plurality of packaged memory integrated circuits mounted on a printed circuit board, the heat sink having a U-shape in cross section so that the memory module can be inserted into a U-shaped recess of the heat sink with a thermal conductive material being interposed between the heat sink and said packaged memory integrated circuits mounted on said printed circuit board and being in contact with the heat sink and said packaged memory integrated circuits.
2. A heat sink claimed in claim 1 wherein said thermal conductive material is a high thermal conductive member, and the heat sink is formed of a resilient material to have a clip function so that the memory module is mechanically held by the heat sink through said high thermal conductive member.
3. A heat sink claimed in claim 2 wherein the heat sink has a number of convexities on an outer surface thereof to having an increased outer surface area.
4. A heat sink claimed in claim 1 wherein the heat sink has a number of convexities on an outer surface thereof to having an increased outer surface area.
5. A memory module composed of a plurality of packaged memory integrated circuits mounted on a printed circuit board, and fitted with a heat sink having a U-shape in cross section in such a manner that the memory module is inserted into a U-shaped recess of said heat sink with a thermal conductive material being interposed between said heat sink and said packaged memory integrated circuits and being in contact with said heat sink and said packaged memory integrated circuits
6. A memory module claimed in claim 5 wherein said thermal conductive material is a high thermal conductive member, and said heat sink is formed of a resilient material to have a clip function so that the memory module is mechanically held by said heat sink through said high thermal conductive member.
7. A memory module claimed in claim 6 wherein said thermal conductive member is a high thermal conductive rubber having an electrical insulative property.
8. A memory module claimed in claim 6 wherein said heat sink has a number of convexities on an outer surface thereof to having an increased outer surface area.
9. A memory module claimed in claim 6 wherein said heat sink is detachable from the memory module.
10. A memory module claimed in claim 5 wherein said thermal conductive material is a silicone grease.
11. A memory module claimed in claim 10 wherein the heat sink has a number of convexities on an outer surface thereof to having an increased outer surface area.
12. A memory module claimed in claim 10 wherein said heat sink is detachable from the memory module.
13. A memory module claimed in claim 5 wherein the heat sink has a number of convexities on an outer surface thereof to having an increased outer surface area.
14. A memory module claimed in claim 5 wherein said heat sink is detachable from the memory module.
15. A memory module claimed in claim 5 wherein said thermal conductive member is a high thermal conductive rubber having an electrical insulative property.
16. A memory module claimed in claim 5 wherein said heat sink has a length of said heat sink and a depth of said U-shaped recess sufficient to cover all of said packaged memory integrated circuits mounted on a printed circuit board.
US09/332,325 1998-06-12 1999-06-14 Heat sink and memory module with heat sink Expired - Lifetime US6424532B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10164720A JP3109479B2 (en) 1998-06-12 1998-06-12 Heat radiator and memory module equipped with heat radiator
JP10-164720 1998-06-12

Publications (2)

Publication Number Publication Date
US20020001180A1 true US20020001180A1 (en) 2002-01-03
US6424532B2 US6424532B2 (en) 2002-07-23

Family

ID=15798620

Family Applications (1)

Application Number Title Priority Date Filing Date
US09/332,325 Expired - Lifetime US6424532B2 (en) 1998-06-12 1999-06-14 Heat sink and memory module with heat sink

Country Status (6)

Country Link
US (1) US6424532B2 (en)
JP (1) JP3109479B2 (en)
KR (1) KR100297226B1 (en)
CN (1) CN1157783C (en)
DE (1) DE19928075B4 (en)
TW (1) TW405248B (en)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050014308A1 (en) * 2003-07-17 2005-01-20 Yuan-Ping Tseng Manufacturing process of memory module with direct die-attachment
US20050201063A1 (en) * 2004-03-15 2005-09-15 Hae-Hyung Lee Semiconductor module with heat sink and method thereof
US20060067054A1 (en) * 2004-09-29 2006-03-30 Super Talent Electronics, Inc. Memory module assembly including heat sink attached to integrated circuits by adhesive
US20060133048A1 (en) * 2003-05-07 2006-06-22 Fujitsu Limited Cooling device, substrate, and electronic equipment
US20060192947A1 (en) * 2005-02-25 2006-08-31 William Roberts Optimizing light path uniformity in inspection systems
US20070070607A1 (en) * 2005-09-23 2007-03-29 Staktek Group, L.P. Applied heat spreader with cooling fin
US20070274059A1 (en) * 2006-05-25 2007-11-29 Chennupati Raghuram Siva Apparatus and method for shielding of electromagnetic interference of a memory module
US20080151487A1 (en) * 2004-09-29 2008-06-26 Super Talent Electronics, Inc. Memory Module Assembly Including Heat-Sink Plates With Heat-Exchange Fins Attached To Integrated Circuits By Adhesive
US20080212297A1 (en) * 2004-09-29 2008-09-04 Super Talent Electronics, Inc. Flash Memory Device Assembly Using Adhesive
US20080315402A1 (en) * 2007-06-25 2008-12-25 Samsung Electronics Co., Ltd. Printed circuit board, memory module having the same and fabrication method thereof
US20090129012A1 (en) * 2007-11-21 2009-05-21 Anton Legen Method and apparatus for heat transfer
US7609523B1 (en) 2004-09-29 2009-10-27 Super Talent Electronics, Inc. Memory module assembly including heat sink attached to integrated circuits by adhesive and clips
US20090294099A1 (en) * 2008-05-30 2009-12-03 Comptake Technology Inc. Heat dispensing unit for memory chip
US8705239B1 (en) * 2008-04-30 2014-04-22 Netlist, Inc. Heat dissipation for electronic modules
US20140117528A1 (en) * 2012-10-29 2014-05-01 Samsung Electronics Co., Ltd. Semiconductor module
US9245820B2 (en) 2010-03-08 2016-01-26 International Business Machines Corporation Liquid DIMM cooling device

Families Citing this family (105)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3831159B2 (en) * 1999-10-18 2006-10-11 日本圧着端子製造株式会社 Electronic module with connector
KR100370270B1 (en) * 2000-01-19 2003-01-30 원지금속 주식회사 A heat sink for the RAN of computer and it is manufacturing method
DE10038161A1 (en) * 2000-08-04 2002-02-21 Infineon Technologies Ag Cooling device for electronic components and method for producing the cooling device
KR100389920B1 (en) * 2000-12-12 2003-07-04 삼성전자주식회사 Semiconductor module improving a reliability deterioration due to coefficient of thermal expansion
DE10134983A1 (en) * 2001-07-18 2002-09-19 Infineon Technologies Ag Arrangement for cooling integrated semiconducting components has cooling body extending from components on top of module board over end of board to components on bottom of board
DE10343525B4 (en) 2002-09-27 2011-06-16 Qimonda Ag Method for operating semiconductor components, control device for semiconductor components and arrangement for operating memory components
US6711021B1 (en) * 2003-01-15 2004-03-23 Hewlett-Packard Development Company, L.P. Systems and methods that use at least one component to remove the heat generated by at least one other component
US6967843B2 (en) * 2003-02-11 2005-11-22 Hewlett-Packard Development Company, L.P. System and method for dissipating heat from an electronic board
JP3845408B2 (en) * 2003-10-06 2006-11-15 エルピーダメモリ株式会社 Memory module heat dissipation device
JP2005150454A (en) * 2003-11-17 2005-06-09 Yaskawa Electric Corp Cooling structure of electric power conversion system
US7023700B2 (en) * 2003-12-24 2006-04-04 Super Talent Electronics, Inc. Heat sink riveted to memory module with upper slots and open bottom edge for air flow
DE102004009055B4 (en) * 2004-02-23 2006-01-26 Infineon Technologies Ag Cooling arrangement for devices with power semiconductors and method for cooling such devices
KR100564620B1 (en) 2004-03-31 2006-03-29 삼성전자주식회사 Memory module, socket for memory module and mounting method using the same for improving a heat spread characteristics
US7254036B2 (en) * 2004-04-09 2007-08-07 Netlist, Inc. High density memory module using stacked printed circuit boards
US7079396B2 (en) 2004-06-14 2006-07-18 Sun Microsystems, Inc. Memory module cooling
EP1626410B1 (en) * 2004-08-13 2007-05-09 Wan-Chien Chang Heat radiating and protective device for a memory module
KR20060018453A (en) * 2004-08-24 2006-03-02 삼성전자주식회사 Semiconductor device comprising heat sink
US7446410B2 (en) * 2004-09-03 2008-11-04 Entorian Technologies, Lp Circuit module with thermal casing systems
US7443023B2 (en) * 2004-09-03 2008-10-28 Entorian Technologies, Lp High capacity thin module system
JP2006140192A (en) * 2004-11-10 2006-06-01 Matsushita Electric Ind Co Ltd Electronic circuit apparatus
US7521788B2 (en) * 2004-11-15 2009-04-21 Samsung Electronics Co., Ltd. Semiconductor module with conductive element between chip packages
JP2006148105A (en) * 2004-11-15 2006-06-08 Samsung Electronics Co Ltd Semiconductor module and its manufacturing method
KR100659071B1 (en) * 2004-11-19 2006-12-21 삼성에스디아이 주식회사 Plasma display apparatus
US7310036B2 (en) * 2005-01-10 2007-12-18 International Business Machines Corporation Heat sink for integrated circuit devices
JP2006216956A (en) * 2005-02-02 2006-08-17 Samsung Electronics Co Ltd Memory module with wiring structure
KR100702016B1 (en) 2005-02-02 2007-03-30 삼성전자주식회사 Printed Circuit Board of Dual In-line Memory Module and Dual In-line Memory Module using the same
US7289331B2 (en) * 2005-03-30 2007-10-30 International Business Machines Corporation Interposable heat sink for adjacent memory modules
JP2006287080A (en) 2005-04-04 2006-10-19 Hitachi Ltd Memory module
US20080082763A1 (en) 2006-10-02 2008-04-03 Metaram, Inc. Apparatus and method for power management of memory circuits by a system or component thereof
US8090897B2 (en) 2006-07-31 2012-01-03 Google Inc. System and method for simulating an aspect of a memory circuit
US10013371B2 (en) 2005-06-24 2018-07-03 Google Llc Configurable memory circuit system and method
US8386722B1 (en) 2008-06-23 2013-02-26 Google Inc. Stacked DIMM memory interface
US8397013B1 (en) 2006-10-05 2013-03-12 Google Inc. Hybrid memory module
KR101318116B1 (en) 2005-06-24 2013-11-14 구글 인코포레이티드 An integrated memory core and memory interface circuit
US7386656B2 (en) 2006-07-31 2008-06-10 Metaram, Inc. Interface circuit system and method for performing power management operations in conjunction with only a portion of a memory circuit
US8335894B1 (en) 2008-07-25 2012-12-18 Google Inc. Configurable memory system with interface circuit
US8060774B2 (en) 2005-06-24 2011-11-15 Google Inc. Memory systems and memory modules
US7609567B2 (en) * 2005-06-24 2009-10-27 Metaram, Inc. System and method for simulating an aspect of a memory circuit
US8244971B2 (en) 2006-07-31 2012-08-14 Google Inc. Memory circuit system and method
US8796830B1 (en) 2006-09-01 2014-08-05 Google Inc. Stackable low-profile lead frame package
US8077535B2 (en) 2006-07-31 2011-12-13 Google Inc. Memory refresh apparatus and method
US8327104B2 (en) 2006-07-31 2012-12-04 Google Inc. Adjusting the timing of signals associated with a memory system
US8089795B2 (en) 2006-02-09 2012-01-03 Google Inc. Memory module with memory stack and interface with enhanced capabilities
US8041881B2 (en) 2006-07-31 2011-10-18 Google Inc. Memory device with emulated characteristics
US8111566B1 (en) 2007-11-16 2012-02-07 Google, Inc. Optimal channel design for memory devices for providing a high-speed memory interface
US8438328B2 (en) 2008-02-21 2013-05-07 Google Inc. Emulation of abstracted DIMMs using abstracted DRAMs
US9507739B2 (en) 2005-06-24 2016-11-29 Google Inc. Configurable memory circuit system and method
US8130560B1 (en) 2006-11-13 2012-03-06 Google Inc. Multi-rank partial width memory modules
US9542352B2 (en) 2006-02-09 2017-01-10 Google Inc. System and method for reducing command scheduling constraints of memory circuits
US9171585B2 (en) 2005-06-24 2015-10-27 Google Inc. Configurable memory circuit system and method
US20080028136A1 (en) 2006-07-31 2008-01-31 Schakel Keith R Method and apparatus for refresh management of memory modules
US8619452B2 (en) 2005-09-02 2013-12-31 Google Inc. Methods and apparatus of stacking DRAMs
US8081474B1 (en) * 2007-12-18 2011-12-20 Google Inc. Embossed heat spreader
US8055833B2 (en) 2006-10-05 2011-11-08 Google Inc. System and method for increasing capacity, performance, and flexibility of flash storage
US8359187B2 (en) 2005-06-24 2013-01-22 Google Inc. Simulating a different number of memory circuit devices
KR100693920B1 (en) 2005-07-07 2007-03-12 삼성전자주식회사 Heat spreader, semiconductor package module and memory module having the heat spreader
US7442050B1 (en) 2005-08-29 2008-10-28 Netlist, Inc. Circuit card with flexible connection for memory module with heat spreader
US7295433B2 (en) * 2005-10-28 2007-11-13 Delphi Technologies, Inc. Electronics assembly having multiple side cooling and method
US20070121286A1 (en) * 2005-11-29 2007-05-31 International Business Machines Corporation Memory module airflow redirector
US9632929B2 (en) 2006-02-09 2017-04-25 Google Inc. Translating an address associated with a command communicated between a system and memory circuits
KR100849614B1 (en) * 2006-12-27 2008-07-31 주식회사 이노바텍 Radiating heat apparatus for circuit board
US7619893B1 (en) 2006-02-17 2009-11-17 Netlist, Inc. Heat spreader for electronic modules
DE102006012446B3 (en) * 2006-03-17 2007-12-20 Infineon Technologies Ag Memory module with a means for cooling, method for producing the memory module with a means for cooling and data processing device comprising a memory module with a means for cooling
TWM304705U (en) * 2006-07-04 2007-01-11 Cooler Master Co Ltd Display card heat sink
US7400506B2 (en) * 2006-07-11 2008-07-15 Dell Products L.P. Method and apparatus for cooling a memory device
JP5069876B2 (en) 2006-07-13 2012-11-07 新光電気工業株式会社 Semiconductor module and heat sink
KR100778022B1 (en) * 2006-07-14 2007-11-21 주식회사 일창프리시젼 A heat sink manufacturing method for memory module
US7724589B2 (en) 2006-07-31 2010-05-25 Google Inc. System and method for delaying a signal communicated from a system to at least one of a plurality of memory circuits
CN101118458A (en) * 2006-07-31 2008-02-06 华硕电脑股份有限公司 Electronic device having homogeneous-temperature plate
US7474529B2 (en) * 2006-11-29 2009-01-06 International Business Machines Corporation Folded-sheet-metal heatsinks for closely packaged heat-producing devices
KR100885027B1 (en) * 2006-12-21 2009-04-02 티티엠주식회사 Cooling System for Memory Module
WO2008082042A1 (en) * 2006-12-29 2008-07-10 Top Thermal Management Co, . Ltd. Cooling system for memory module
KR100885421B1 (en) * 2007-02-06 2009-02-24 삼성전자주식회사 Printed Circuit Board and Semiconductor Memory Module Using the Same
US7957134B2 (en) * 2007-04-10 2011-06-07 Hewlett-Packard Development Company, L.P. System and method having evaporative cooling for memory
US7679913B2 (en) * 2007-05-11 2010-03-16 Ming-Yang Hsieh Memory module assembly and heat sink thereof
US8209479B2 (en) 2007-07-18 2012-06-26 Google Inc. Memory circuit system and method
KR100848837B1 (en) * 2007-08-06 2008-07-28 주식회사 휘닉스아이씨피 A memory module heat sink and it's manufacturing method
US8080874B1 (en) 2007-09-14 2011-12-20 Google Inc. Providing additional space between an integrated circuit and a circuit board for positioning a component therebetween
KR101403901B1 (en) 2007-11-05 2014-06-27 삼성전자주식회사 Heat sink for dissipating heat
KR100955936B1 (en) 2008-01-02 2010-05-03 주식회사 하이닉스반도체 Heat dissipation device for semiconductor package module and semiconductor package module having the same
JP2009230505A (en) * 2008-03-24 2009-10-08 Fujitsu Ltd Board unit and electronic apparatus
KR100965269B1 (en) 2008-04-16 2010-06-22 이상철 Dissipating device of electronic element and memory module employing the dissipating device
TWM346844U (en) * 2008-05-12 2008-12-11 Comptake Technology Inc Improved heat-dissipating structure for memory device
US7684196B2 (en) * 2008-05-13 2010-03-23 International Business Machines Corporation Enhancing the cooling of dual in-line memory modules
US7715197B2 (en) * 2008-06-05 2010-05-11 International Business Machines Corporation Coined-sheet-metal heatsinks for closely packaged heat-producing devices such as dual in-line memory modules (DIMMs)
JP5557441B2 (en) * 2008-10-31 2014-07-23 日立オートモティブシステムズ株式会社 Power converter and electric vehicle
US20100134982A1 (en) * 2008-12-01 2010-06-03 Meyer Iv George Anthony Memory heat dissipating structure and memory device having the same
EP2441007A1 (en) 2009-06-09 2012-04-18 Google, Inc. Programming of dimm termination resistance values
CN101998808A (en) * 2009-08-25 2011-03-30 富准精密工业(深圳)有限公司 Heat dissipating device
WO2011053311A1 (en) * 2009-10-30 2011-05-05 Hewlett-Packard Development Company, L.P. A frame having frame blades that participate in cooling memory modules
DE102009044368B4 (en) * 2009-10-30 2014-07-03 Lear Corporation Gmbh cooling arrangement
US8139355B2 (en) 2010-05-24 2012-03-20 International Business Machines Corporation Memory module connector having memory module cooling structures
TWI391087B (en) * 2010-06-07 2013-03-21 Hon Hai Prec Ind Co Ltd Expansion card assembly and heat sink thereof
CN201725266U (en) * 2010-06-17 2011-01-26 深圳富泰宏精密工业有限公司 Memory-bank heat-radiating assembly
CN102541218A (en) * 2010-12-25 2012-07-04 鸿富锦精密工业（深圳）有限公司 Heat radiator for memory module
US9076753B2 (en) 2012-05-18 2015-07-07 International Business Machines Corporation Apparatus for the compact cooling of modules
KR102127335B1 (en) * 2012-10-29 2020-06-30 삼성전자주식회사 Semiconductor Module
HK1210376A2 (en) 2015-08-17 2016-04-15 馮文標 號 Assembly structure of high-power semiconductor and heat sink
USD819746S1 (en) * 2018-01-08 2018-06-05 David Theodore Bernstein Chess board
US11011452B2 (en) * 2018-11-29 2021-05-18 Micron Technology, Inc. Heat spreaders for semiconductor devices, and associated systems and methods
US11079820B2 (en) 2019-01-15 2021-08-03 Microsoft Technology Licensing, Llc Method and apparatus for improving removable storage performance
US11520311B2 (en) 2019-07-25 2022-12-06 Microsoft Technology Licensing, Llc High performance removable storage devices
TWI777280B (en) * 2020-10-27 2022-09-11 技嘉科技股份有限公司 Expansion card housing, expansion card module and server
CN114428539A (en) * 2020-10-29 2022-05-03 技嘉科技股份有限公司 Expansion card shell, expansion card module and server
US11612084B1 (en) * 2020-12-18 2023-03-21 Zoox, Inc. Modular heatsink for vehicle computer cooling architecture

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5396403A (en) * 1993-07-06 1995-03-07 Hewlett-Packard Company Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate
JPH07202120A (en) * 1993-12-28 1995-08-04 Hitachi Ltd High heat radiating memory and memory module
DE9415755U1 (en) * 1994-09-29 1994-11-24 Siemens Nixdorf Inf Syst Arrangement of highly integrated circuits on a multilayer ceramic
US5587608A (en) * 1995-10-27 1996-12-24 Meng; Ching-Ming Structure heat sink for power semiconductors
US5815371A (en) * 1996-09-26 1998-09-29 Dell U.S.A., L.P. Multi-function heat dissipator
US5959839A (en) * 1997-01-02 1999-09-28 At&T Corp Apparatus for heat removal using a flexible backplane
US5867367A (en) * 1997-12-04 1999-02-02 Intel Corporation Quad flat pack integrated circuit package

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7405933B2 (en) 2003-05-07 2008-07-29 Fujitsu Limited Cooling device, substrate, and electronic equipment
US20060133048A1 (en) * 2003-05-07 2006-06-22 Fujitsu Limited Cooling device, substrate, and electronic equipment
US20050014308A1 (en) * 2003-07-17 2005-01-20 Yuan-Ping Tseng Manufacturing process of memory module with direct die-attachment
US20050201063A1 (en) * 2004-03-15 2005-09-15 Hae-Hyung Lee Semiconductor module with heat sink and method thereof
US20080144292A1 (en) * 2004-03-15 2008-06-19 Hae-Hyung Lee Semiconductor module with heat sink and method thereof
US7345882B2 (en) * 2004-03-15 2008-03-18 Samsung Electronics Co., Ltd. Semiconductor module with heat sink and method thereof
US7215551B2 (en) * 2004-09-29 2007-05-08 Super Talent Electronics, Inc. Memory module assembly including heat sink attached to integrated circuits by adhesive
US7609523B1 (en) 2004-09-29 2009-10-27 Super Talent Electronics, Inc. Memory module assembly including heat sink attached to integrated circuits by adhesive and clips
US7944703B2 (en) 2004-09-29 2011-05-17 Super Talent Electronics, Inc. Flash memory device assembly using adhesive
US7365985B1 (en) 2004-09-29 2008-04-29 Super Talent Electronics, Inc. Memory module assembly including heat sink attached to integrated circuits by adhesive
US7768785B2 (en) 2004-09-29 2010-08-03 Super Talent Electronics, Inc. Memory module assembly including heat-sink plates with heat-exchange fins attached to integrated circuits by adhesive
US20080151487A1 (en) * 2004-09-29 2008-06-26 Super Talent Electronics, Inc. Memory Module Assembly Including Heat-Sink Plates With Heat-Exchange Fins Attached To Integrated Circuits By Adhesive
US20060067054A1 (en) * 2004-09-29 2006-03-30 Super Talent Electronics, Inc. Memory module assembly including heat sink attached to integrated circuits by adhesive
US20080212297A1 (en) * 2004-09-29 2008-09-04 Super Talent Electronics, Inc. Flash Memory Device Assembly Using Adhesive
US20100000655A1 (en) * 2004-09-29 2010-01-07 Super Talent Electronics, Inc. Memory Module Assembly Including Heat Sink Attached To Integrated Circuits By Adhesive And Clips
US20060192947A1 (en) * 2005-02-25 2006-08-31 William Roberts Optimizing light path uniformity in inspection systems
US20070070607A1 (en) * 2005-09-23 2007-03-29 Staktek Group, L.P. Applied heat spreader with cooling fin
US20070274059A1 (en) * 2006-05-25 2007-11-29 Chennupati Raghuram Siva Apparatus and method for shielding of electromagnetic interference of a memory module
KR100885976B1 (en) * 2007-06-25 2009-03-03 삼성전자주식회사 Printed circuit board, memory module having the same and fabrication method thereof
US20080315402A1 (en) * 2007-06-25 2008-12-25 Samsung Electronics Co., Ltd. Printed circuit board, memory module having the same and fabrication method thereof
US8076772B2 (en) 2007-06-25 2011-12-13 Samsung Electronics Co., Ltd. Printed circuit board, memory module having the same and fabrication method thereof
US20090129012A1 (en) * 2007-11-21 2009-05-21 Anton Legen Method and apparatus for heat transfer
US8705239B1 (en) * 2008-04-30 2014-04-22 Netlist, Inc. Heat dissipation for electronic modules
US20090294099A1 (en) * 2008-05-30 2009-12-03 Comptake Technology Inc. Heat dispensing unit for memory chip
US9245820B2 (en) 2010-03-08 2016-01-26 International Business Machines Corporation Liquid DIMM cooling device
US20140117528A1 (en) * 2012-10-29 2014-05-01 Samsung Electronics Co., Ltd. Semiconductor module
US9437518B2 (en) * 2012-10-29 2016-09-06 Samsung Electronics Co., Ltd. Semiconductor module

Also Published As

Publication number Publication date
CN1157783C (en) 2004-07-14
US6424532B2 (en) 2002-07-23
JPH11354701A (en) 1999-12-24
JP3109479B2 (en) 2000-11-13
TW405248B (en) 2000-09-11
DE19928075A1 (en) 2000-01-27
DE19928075B4 (en) 2010-04-08
KR100297226B1 (en) 2001-11-01
KR20000006134A (en) 2000-01-25
CN1239327A (en) 1999-12-22

Similar Documents

Publication Publication Date Title
US6424532B2 (en) Heat sink and memory module with heat sink
US8213180B2 (en) Electromagnetic interference shield with integrated heat sink
KR100833185B1 (en) heatsink and memory module using the same
US7015073B2 (en) Method of forming heat spreader with down set leg attachment feature
US20060221573A1 (en) Heat sink for multiple semiconductor modules
US20020181216A1 (en) Electronic module having a three dimensional array of carrier-mounted integrated circuit packages
KR100373228B1 (en) Thermal bus bar design for an electronic cartridge
US5926376A (en) Printed circuit board card for mounting packages in faces thereof
EP0587294B1 (en) Semiconductor package
US8040682B2 (en) Semiconductor device
JP2006324326A (en) Semiconductor device
US7649253B2 (en) Semiconductor device
JPH09213851A (en) Heat radiation method and heat radiation means for ic device
KR100302973B1 (en) Circuit substrate including printed circuit board having heat-shielding portion
US6922338B2 (en) Memory module with a heat dissipation means
US6373701B1 (en) Heat dissipation assembly
US6706972B1 (en) Electronic assembly comprising a sole plate forming a heat sink
US6888722B2 (en) Thermal design for minimizing interface in a multi-site thermal contact condition
US5808870A (en) Plastic pin grid array package
JPH1050877A (en) Semiconductor package
JP3492504B2 (en) Heat dissipation device for electronic components
JP2004259977A (en) Electronic circuit module
US6541710B1 (en) Method and apparatus of supporting circuit component having a solder column array using interspersed rigid columns
CN214753706U (en) Semiconductor packaging structure
CN215181717U (en) Main control cabinet

Legal Events

Date Code Title Description
AS Assignment

Owner name: NEC CORPORATION, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:KAWAMURA, MASASHI;REEL/FRAME:010036/0103

Effective date: 19990611

STCF Information on status: patent grant

Free format text: PATENTED CASE

AS Assignment

Owner name: NEC CORPORATION, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:NEC CORPORATION;REEL/FRAME:013746/0838

Effective date: 20030110

Owner name: NEC ELECTRONICS CORPORATION, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:NEC CORPORATION;REEL/FRAME:013746/0838

Effective date: 20030110

FPAY Fee payment

Year of fee payment: 4

FPAY Fee payment

Year of fee payment: 8

FPAY Fee payment

Year of fee payment: 12