KR100778022B1 - A heat sink manufacturing method for memory module - Google Patents

A heat sink manufacturing method for memory module Download PDF

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KR100778022B1
KR100778022B1 KR1020060066502A KR20060066502A KR100778022B1 KR 100778022 B1 KR100778022 B1 KR 100778022B1 KR 1020060066502 A KR1020060066502 A KR 1020060066502A KR 20060066502 A KR20060066502 A KR 20060066502A KR 100778022 B1 KR100778022 B1 KR 100778022B1
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South Korea
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heat sink
bridge
memory module
coloring
continuous array
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KR1020060066502A
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Korean (ko)
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KR20060090206A (en
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명윤경
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주식회사 일창프리시젼
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Priority to KR1020060066502A priority Critical patent/KR100778022B1/en
Publication of KR20060090206A publication Critical patent/KR20060090206A/en
Priority to PCT/KR2007/002711 priority patent/WO2008007860A1/en
Priority to US12/373,463 priority patent/US20090241340A1/en
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Abstract

본 발명은 취출, 착색 및 접착패드 취부 등의 단계에서 복수의 히트싱크가 소정 간격으로 연속배열된 단일체로 취급되어 생산성을 획기적으로 향상시킴으로 제조원가를 절감함과 아울러 가공 및 조립단계에서 취급시 히트싱크에 대한 직접 접촉이 차단되어 스크래치 발생을 방지함으로써 상품성을 향상시키도록 하는 메모리모듈용 히트싱크 제조방법에 관한 것이다.The present invention treats a plurality of heat sinks in a continuous array at predetermined intervals in the stages of taking out, coloring, and attaching adhesive pads, thereby significantly reducing productivity by improving productivity and heat sinks during handling in the processing and assembly stages. The present invention relates to a method for manufacturing a heat sink for a memory module to prevent direct scratches and to prevent scratches, thereby improving the marketability.

이를 실현하기 위한 본 발명은 금속판 원단코일로부터 프레스장치를 이용하는 절단 취출단계를 포함하여 제조되는 메모리모듈용 히트싱크 제조방법에 있어서, 상기 히트싱크는 상기 절단 취출단계에서 브릿지를 통하여 소정간격으로 연속배열된 단일체의 히트싱크 연속배열체로 취출되는 것을 특징으로 한다.In the present invention for realizing this, in the method for manufacturing a heat sink for a memory module manufactured by including a cutting take-out step using a press device from the metal sheet fabric coil, the heat sink is continuously arranged at a predetermined interval through a bridge in the cutting take-out step Characterized in that it is taken out as a single heatsink continuous array.

본 발명에 따른 일 실시예로서, 상기 취출단계 이후 히트싱크 연속배열체를 착색하는 착색단계; 상기 착색단계를 거친 히트싱크 연속배열체(10)에 접착패드(5)를 취부하는 접착패드 취부 단계; 및 상기 접착패드 취부단계 이후 상기 브릿지를 절단 제거하는 히트싱크 개별화단계;가 이어짐을 특징으로 한다.As an embodiment according to the invention, the coloring step of coloring the heat sink continuous array after the take-out step; An adhesive pad attaching step of attaching the adhesive pad 5 to the heat sink continuous array 10 which has undergone the coloring step; And a heatsink individualization step of cutting and removing the bridge after the adhesive pad mounting step.

Description

메모리모듈용 히트싱크 제조방법{A HEAT SINK MANUFACTURING METHOD FOR MEMORY MODULE} Heat sink manufacturing method for memory module {A HEAT SINK MANUFACTURING METHOD FOR MEMORY MODULE}

도 1은 메모리모듈에 히트싱크의 장착을 보이는 분해도1 is an exploded view illustrating the mounting of a heat sink on a memory module;

도 2는 도 1의 결합 상태도2 is a combined state diagram of FIG.

도 3은 본 발명에 따른 히트싱크 연속배열체의 사시도3 is a perspective view of a heat sink continuous array according to the present invention;

도 4는 본 발명에 따른 일 실시예의 흐름도4 is a flowchart of one embodiment according to the present invention.

*도면의 주요 부분에 대한 부호의 설명* Explanation of symbols for the main parts of the drawings

10: 본 발명의 히트싱크 연속배열체10: heat sink continuous array of the present invention

11: 히트싱크 12: 브릿지 12a: 제1브릿지11: heat sink 12: bridge 12a: first bridge

12b: 제2브릿지 12c: 절단라인 12d: 통공12b: second bridge 12c: cutting line 12d: through hole

본 발명은 메모리모듈의 히트싱크 제조에 관한 것으로서 특히 취출, 착색 및 접착패드 취부 등의 단계에서 복수의 히트싱크가 소정 간격으로 연속배열된 단일체 로 취급되어 생산성을 획기적으로 향상시킴으로 제조원가를 절감함과 아울러 가공 및 조립단계에서 취급시 히트싱크에 대한 직접 접촉이 차단되어 스크래치 발생을 방지함으로써 상품성을 향상시키도록 하는 메모리모듈용 히트싱크 제조방법에 관한 것이다.The present invention relates to the manufacture of a heat sink of a memory module, in particular, in the process of taking out, coloring, and attaching an adhesive pad, a plurality of heat sinks are treated as a single unit arranged in series at predetermined intervals, thereby significantly reducing productivity and reducing manufacturing costs. In addition, the present invention relates to a method of manufacturing a heat sink for a memory module to improve directivity by preventing direct scratches on the heat sink during handling in the processing and assembly stages.

일반적으로 반도체 메모리모듈은 메인보드 등에 커넥팅 실장되어 전기적인 외부 접속경로를 이루기 위한 다수개의 핀이 구비된 인쇄회로기판(PCB)에 반도체칩이 형성되어 이루어진다.In general, a semiconductor memory module is formed by connecting a semiconductor chip to a printed circuit board (PCB) having a plurality of pins for connecting to a main board to form an electrical external connection path.

반도체 소자의 소형화, 고집적화 및 경량화가 진행되면서 데이터 전송이 고속동작되는 DDR(Double Data Rate)이 보편화 된지 이미 오래이며, 최근에는 메모리칩의 작동속도를 DDR모듈의 수 배에 달하기까지 상승시킨 메모리모듈이 상용화되고 있다. It has been a long time since DDR (Double Data Rate), in which data transfer is high speed, has become popular as miniaturization, high integration, and light weight of semiconductor devices have progressed. In recent years, memory chips have increased the operating speed of memory chips to several times that of DDR modules. Modules are commercially available.

이와 같이 메모리모듈의 고속화가 증대됨과 함께 기판이 경량 박형화됨으로 발열에 대한 효과적인 방열기능과 더불어 대량생산에 따른 생산성이 요구된다.As the speed of the memory module is increased and the substrate is light and thin, the heat dissipation function is required as well as the productivity of mass production.

메모리모듈용 방열장치는 도 1 및 도 2에 도시된 바와 같이, 반도체칩(2a)이 형성된 메모리모듈(2) 양면에 각각 열전도 특성을 갖는 접착패드(5)를 통하여 히트싱크(11)가 접착되고, 양쪽의 히트싱크(11)를 고정시키는 클립(3)이 부여되어 구성된다.As shown in FIGS. 1 and 2, the heat sink 11 for the memory module is attached to the heat sink 11 through adhesive pads 5 having thermal conductivity on both surfaces of the memory module 2 on which the semiconductor chip 2a is formed. The clip 3 which fixes both heat sinks 11 is provided and comprised.

상기 히트싱크(11)의 종래기술에 따른 제조과정을 살펴보면 금속판을 히트싱크의 형상에 대응형성된 프레스 금형장치를 이용하여 하나씩 절단해낸 다음 착색단계를 거쳐 완성되고 이후 메모리모듈에 취부 고정된다.Looking at the manufacturing process according to the prior art of the heat sink 11 is cut out one by one using a press mold apparatus formed corresponding to the shape of the heat sink and then completed through a coloring step and then fixed to the memory module.

이와 같은 종래기술은 히트싱크(11)를 낱개 단위로 절단 및 취출하여 착색이 이루어짐으로써 생산성이 극히 저조할 뿐만 아니라 착색단계나 이후 접착패드 취부 등의 과정에서 히트싱크 몸체를 직접 잡아야하기 때문에 표면에 스크래치가 발생되어 상품성을 떨어뜨리는 문제점이 있었다.Such a prior art is not only extremely low productivity by cutting and taking out the heat sink 11 by a single unit, but also because the coloring is extremely low, and the heat sink body must be directly grasped during the coloring step or the process of attaching the adhesive pad to the surface. Scratch occurred and there was a problem of degrading the merchandise.

또한, 접착패드 취부 및 기타 부품의 조립도 낱개 단위로 이루어짐으로써 조립생산성을 저하시켜 제조원가를 상승시키는 문제점이 있었다.In addition, the assembly of the adhesive pad and the assembly of the other parts is also made of a single unit, there is a problem to increase the manufacturing cost by lowering the assembly productivity.

본 발명은 상기한 문제점을 해소하기 위하여 안출된 것으로서,The present invention has been made to solve the above problems,

본 발명의 목적은 취출, 착색 및 접착패드 취부 등의 단계에서 복수의 히트싱크가 소정 간격으로 연속배열된 단일체로 취급되어 생산성을 획기적으로 향상시킴으로 제조원가를 현저히 절감토록 하는 메모리모듈용 히트싱크 제조방법을 제공함에 있다.An object of the present invention is a method of manufacturing a heat sink for a memory module which significantly reduces the manufacturing cost by significantly improving the productivity by treating a plurality of heat sinks in a continuous arrangement at a predetermined interval in a step of taking out, coloring, and attaching an adhesive pad. In providing.

본 발명의 다른 목적은 이동 취급시 히트싱크에 대한 직접 접촉이 차단되어 스크래치 발생을 방지함으로써 상품성을 향상시키도록 하는 메모리모듈용 히트싱크 제조방법을 제공함에 있다.Another object of the present invention is to provide a method for manufacturing a heat sink for a memory module to improve directivity by preventing direct scratches on the heat sink during movement handling.

상기한 목적을 달성하는 본 발명에 따른 메모리모듈용 히트싱크 제조방법은,Heat sink manufacturing method for a memory module according to the present invention for achieving the above object,

금속판 원단코일로부터 프레스장치를 이용하는 절단 취출단계를 포함하여 제 조되는 메모리모듈용 히트싱크 제조방법에 있어서,In the manufacturing method of the heat sink for a memory module, including a step of taking out the cut using a press device from the metal sheet fabric coil,

상기 히트싱크는 상기 절단 취출단계에서 브릿지를 통하여 소정간격으로 연속배열된 단일체의 히트싱크 연속배열체로 취출됨을 특징으로 한다.The heat sink is characterized in that the heat sink is taken out as a single heat sink continuous array that is continuously arranged at a predetermined interval through a bridge in the cut out step.

본 발명에 따른 일 실시예로서,In one embodiment according to the invention,

상기 취출단계 이후 히트싱크 연속배열체를 착색하는 착색단계;A coloring step of coloring the heat sink continuous array after the extraction step;

상기 착색단계를 거친 히트싱크 연속배열체에 접착패드를 취부하는 접착패드 취부 단계; 및An adhesive pad attaching step of attaching an adhesive pad to the heat sink continuous array having undergone the coloring step; And

상기 접착패드 취부단계 이후 상기 브릿지를 절단 제거하는 히트싱크 개별화단계;가 이어짐을 특징으로 한다.After the adhesive pad mounting step, the heatsink individualization step of cutting off the bridge; characterized in that follows.

이하, 본 발명의 메모리모듈용 히트싱크 제조방법에 대한 실시예를 첨부도면을 참조하여 보다 상세히 설명한다.Hereinafter, an embodiment of a heat sink manufacturing method for a memory module of the present invention will be described in more detail with reference to the accompanying drawings.

도 3은 본 발명에 따른 히트싱크 연속배열체의 사시도, 도 4는 본 발명에 따른 일 실시예의 흐름도이다.3 is a perspective view of a heat sink continuous array according to the present invention, and FIG. 4 is a flowchart of an embodiment according to the present invention.

도 3 및 도 4에 도시된 바와 같이, 본 발명에 따른 일 실시예의 메모리모듈용 히트싱크 제조방법은 금속판 원단코일로부터 프레스장치를 이용하여 이루어지는 절단 취출단계를 포함하는 메모리모듈용 히트싱크 제조방법에 있어서, 상기 히트싱크(11)는 상기 절단 취출단계 프레스장치에서 브릿지(12)를 통하여 소정간격으로 연속배열된 단일체의 히트싱크 연속배열체(10)로 취출되는 것이다.3 and 4, the method for manufacturing a heat sink for a memory module according to an embodiment of the present invention is a method for manufacturing a heat sink for a memory module including a cutting take-out step made by using a press apparatus from a metal sheet fabric coil. In the heat sink 11, the heat sink 11 is taken out as a single heat sink continuous array 10 continuously arranged at a predetermined interval through the bridge 12 in the cutting take-out step press apparatus.

본 발명에 따른 일 실시예는 상기 절단 취출단계 이후 상기 히트싱크 연속배 열체(10)를 착색하는 착색단계, 상기 착색단계를 거친 히트싱크 연속배열체(10)에 접착패드(5)를 취부하는 접착패드 취부 단계 및 상기 접착패드 취부단계 이후 상기 브릿지(12)를 절단 제거하는 히트싱크 개별화단계가 이어짐이 바람직하다.According to an embodiment of the present invention, after the cutting take-out step, the coloring step of coloring the heat sink continuous array 10 is performed, and the adhesive pad 5 is attached to the heat sink continuous array 10 passed through the coloring step. After the adhesive pad attaching step and the adhesive pad attaching step, the heat sink individualizing step of cutting and removing the bridge 12 is preferably followed.

상기 히트싱크 연속배열체의 브릿지(12)는 히트싱크(11) 좌우에 연결되는 제1브릿지(12a)와 외곽에 위치되어 상기 제1브릿지(12a) 사이를 연결하며 히트싱크(11)의 배열간격을 유지시키는 제2브릿지(12b)로 형성된다.The bridge 12 of the heat sink continuous array is positioned at the outer side of the first bridge 12a connected to the left and right of the heat sink 11 and connects the first bridge 12a to arrange the heat sink 11. It is formed of the second bridge 12b to maintain the gap.

여기서, 상기 절단 취출단계에서 히트싱크(11)와 연결되는 상기 제1브릿지(12a)의 선단에 절단라인(12c)이 요입형성되고, 상기 제2브릿지(12b)에는 각 피치마다 통공(12d)이 형성된다.Here, the cutting line 12c is recessed at the tip of the first bridge 12a connected to the heat sink 11 in the cutting take-out step, and the second bridge 12b has holes 12d for each pitch. Is formed.

상기 통공(12d)은 절단 취출 등의 가공단계에서 이송시 기준점으로 기능하는 한편, 접착패드 취부 및 기타부품 조립시 히트싱크 연속배열체를 고정하는 지그 핀에 끼워져 자동조립을 가능하게 한다. The through hole 12d functions as a reference point during transfer in a machining step such as cutting and taking out, and is fitted to a jig pin for fixing a heat sink continuous array when attaching an adhesive pad and assembling other parts to enable automatic assembly.

이와 같은 구성을 지닌 본 발명에 따른 메모리모듈용 히트싱크 제조방법을 단계별로 살펴보면 다음과 같다.Looking at the step of manufacturing a heat sink for a memory module according to the present invention having such a configuration as follows.

상기 절단 취출단계에서는 먼저 금속판 원단코일에서 히트싱크(11)와 히트싱크(11) 사이에 공간(15)으로 삭제될 부분을 타발하여 제거하고 메모리모듈에 조립시 가이드가 되는 이어링(11a)부분을 가압 절곡한다.In the cutting take-out step, first, by removing the portion to be erased into the space 15 between the heat sink 11 and the heat sink 11 in the sheet metal coil of the metal plate, and removes the portion of the ear ring 11a that is a guide when assembling the memory module. Pressurized bending.

이때 프레스장치에서는 소정 길이의 원단코일이 주기적으로 공급되고 금형커터를 이용하여 프레스장치가 상기 공간(15)으로 삭제될 부분을 타발하는데 일회 1 피치 또는 복수 피치로 타발하고, 설정된 절단단위, 예컨대 히트싱크가 10개 또는 15개 배열된 형태로 되면 상기 외곽의 제2브릿지(12b)를 절단하여 히트싱크 연속배열체(10)를 배출한다.At this time, in the press apparatus, a fabric coil having a predetermined length is periodically supplied, and the press apparatus punches a portion to be erased into the space 15 by using a mold cutter. When the sink is arranged in the form of 10 or 15, the second bridge 12b of the outer portion is cut to discharge the heat sink continuous array 10.

이후, 상기 착색단계에서 히트싱크 연속배열체의 착색이 이루어진 후 접착패드가 취부된다. 이때 히트싱크에 수반되는 기타 부품들도 조립된다.Subsequently, after the coloring of the heat sink continuous array is made in the coloring step, the adhesive pad is mounted. Other components involved in the heatsink are also assembled.

즉, 본 발명은 취출, 착색 및 접착패드 취부 등의 단계에서 복수의 히트싱크가 소정 간격으로 연속배열된 단일체로 취급되어 생산성을 획기적으로 향상시킨다. 또한 취급 이동시 제2브릿지(12b) 부분을 잡게 됨으로써 히트싱크에는 직접 접촉이 방지되어 스크래치 발생이 완전히 차단된다.That is, the present invention treats a plurality of heat sinks in a continuous array at predetermined intervals at the stage of taking out, coloring, and attaching the adhesive pad, thereby significantly improving productivity. In addition, since the second bridge 12b is gripped during handling, direct contact with the heat sink is prevented, and scratches are completely blocked.

이와 같이 연속배열체 상태에서 각각의 히트싱크(11)가 완성된 상태로 브릿지(12)에 의하여 연결된 상태로 된다.In this manner, each heat sink 11 is connected by the bridge 12 in a state where the heat sink 11 is completed.

그리고, 상기 히트싱크 개별화단계에서 히트싱크(11)와 연결된 상기 제1브릿지(12a)를 절단 탈거시키면 복수의 히트싱크 제조가 일거에 완료되는 것이다.In addition, when the first bridge 12a connected to the heat sink 11 is removed and removed in the heat sink individualizing step, the manufacture of the plurality of heat sinks is completed in one step.

이때, 상기 제1브릿지(12a)의 히트싱크 연결부에 절단라인(12c)이 요입형성되어 절단이 더욱 용이하게 이루어진다.At this time, since the cutting line 12c is recessed in the heat sink connecting portion of the first bridge 12a, cutting is more easily performed.

본 발명은 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 있어 본 발명의 기술적 사상을 벗어나지 않는 범위 내에서 여러 가지 치환, 변형 및 변경이 가능하므로 전술한 실시예 및 도면에 한정되는 것은 아니다.The present invention is not limited to the above-described embodiments and drawings since various substitutions, modifications, and changes are possible to those skilled in the art without departing from the technical spirit of the present invention. .

이상에서 상세히 살펴본 바와 같이, 본 발명에 따른 메모리모듈용 히트싱크 제조방법은 절단 취출, 착색 및 접착패드 취부 등의 단계에서 복수의 히트싱크가 소정 간격으로 연속배열된 단일체로 취급되어 생산성을 획기적으로 향상시키는 뛰어난 효과가 있다.As described in detail above, the method of manufacturing a heat sink for a memory module according to the present invention is treated as a single body in which a plurality of heat sinks are continuously arranged at predetermined intervals in a step of cutting out, coloring, and attaching an adhesive pad, thereby dramatically improving productivity. There is an excellent effect to improve.

또한, 이동 취급시 히트싱크에 대한 직접 접촉이 차단되어 스크래치 발생을 방지함으로써 상품성을 향상시키는 이점이 있다.In addition, the direct contact with the heat sink is blocked during the movement handling, there is an advantage to improve the commerciality by preventing scratches.

Claims (4)

금속판 원단코일로부터 프레스장치를 이용하여 이루어지는 절단 취출단계를 포함하는 메모리모듈용 히트싱크 제조방법에 있어서,In the manufacturing method of the heat sink for a memory module comprising a cutting take-out step made by using a press apparatus from a metal sheet fabric coil, 상기 히트싱크(11)는 상기 절단 취출단계 프레스장치에서 브릿지(12)를 통하여 소정간격으로 연속배열된 단일체의 히트싱크 연속배열체(10)로 취출되는 것을 특징으로 하는 메모리모듈용 히트싱크 제조방법.The heat sink 11 is a method for manufacturing a heat sink for a memory module, characterized in that the cut-out step press apparatus is taken out through the bridge 12 as a single heat sink continuous array 10 continuously arranged at a predetermined interval. . 제 1항에 있어서,The method of claim 1, 상기 절단 취출단계 이후 상기 히트싱크 연속배열체(10)를 착색하는 착색단계;A coloring step of coloring the heat sink continuous array 10 after the cut out step; 상기 착색단계를 거친 히트싱크 연속배열체(10)에 접착패드(5)를 취부하는 접착패드 취부 단계; 및An adhesive pad attaching step of attaching the adhesive pad 5 to the heat sink continuous array 10 which has undergone the coloring step; And 상기 접착패드 취부단계 이후 상기 브릿지(12)를 절단 제거하는 히트싱크 개별화단계;가 이어짐을 특징으로 하는 메모리모듈용 히트싱크 제조방법.And a heat sink individualizing step of cutting and removing the bridge 12 after the adhesive pad attaching step. 제 1항에 있어서,The method of claim 1, 상기 히트싱크 연속배열체의 브릿지(12)는 히트싱크(11) 좌우에 연결되는 제 1브릿지(12a)와 외곽에 위치되어 상기 제1브릿지(12a) 사이를 연결하며 히트싱크(11)의 배열간격을 유지시키는 제2브릿지(12b)로 형성됨을 특징으로 하는 메모리모듈용 히트싱크 제조방법.The bridge 12 of the heat sink continuous array is positioned outside the first bridge 12a connected to the left and right of the heat sink 11 and connects the first bridge 12a to arrange the heat sink 11. Method for manufacturing a heat sink for a memory module, characterized in that formed by the second bridge (12b) to maintain the gap. 제 1항 또는 제 3항에 있어서,The method according to claim 1 or 3, 상기 절단 취출단계에서 히트싱크(11)와 연결되는 상기 제1브릿지(12a)의 선단에 절단라인(12c)이 요입형성되고, 상기 제2브릿지(12b)에는 각 피치마다 통공(12d)이 형성됨을 특징으로 하는 메모리모듈용 히트싱크 제조방법.The cutting line 12c is recessed at the tip of the first bridge 12a connected to the heat sink 11 in the cutting take-out step, and the second bridge 12b has a through hole 12d formed at each pitch. Heat sink manufacturing method for a memory module, characterized in that.
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