M346847 八、新型說明： 【新型所屬之技術領域】 本創作翁_-種輯體散細 早及可快速組合完成，且能增加散 ^尤和種、、、。構間 的記憶體散織組。 賴面提减㈣散熱功效 【先前技術】 按，習知記憶體散熱裝置3 〇， •熱膠片3 G i、二散熱片3 〇 =二===者，係由二導 > 該導熱膠片3 01分別貼設在散熱3 〇 3所組成，其中 3 0 2之上端緣二側分別設有扣^ 之^則面’而散熱片 及承扣座3 0 2 c，使二散4 2 :與扣接孔3 0 2 b -可供記憶體2 ◦容置之空間，該承扣二U贮=成 方所設置之⑽凸面狀之限位S3 2在其片身外側面下 有-扣孔3 0 5，且在扣孔3 〇胃5上部設=端^ 呈门型之夾扣件3 0 3跨置定位片q n 0 ^ ^^孔3 0 6，供 3之二侧内面所設之倒鉤3 〇 3 a，„丨5痛…:並使二爽扣件3 〇 丨入扣孔3 Q 5，使倒鉤3 Q 3 a反iaiii :者^位孔3 Q 6下滑谈 與記憶體2 0緊密貼合包覆著 ^ =而將二散熱片3 〇 2 •的熱量可迅速、平均的傳在運作時所產生 到散Q_完成後，雖能達 1、為使二散熱片3 0 2與記憶體2 〇緊密 憶體散熱裝置3 0在熱片3 Ω 9 Η 貼口包覆者，習知記 3 0 5 ^^3 0 6，3 〇 4 ' 等複雜結構設計，使得習知記怜體 ^倒鉤3 〇 3 a 瑣不便，且製作程序也非常MM上非f繁 5 M346847 2、 習知記憶體散熱裝置3 0因無防塵之設計，使得气熱 2與記憶體2 0在組接時，其上端形成轩縫隙，而=灰 質侵入散熱片3 0 2内，而使記憶體2 〇及散熱片3 受到影響。 …、 之功效 3、 因現今科技日新月異下’電腦處理效能大幅提高，相對 記憶體所產生的溫度越來越高，習知記憶體散熱裝置3 〇，雖炉 達到基礎的賴之功效，但並料有鼓散知積，故散熱^ 有限’仍容紐記憶體因溫度過高而損毁，故明顯的習知記 散熱裝置3 0的散熱效能已無法滿足現今高階記憶體的妙 求’所以如何有效的增進習知記憶體散錄置能， 成為當今触讀題。 麦是’本創作人有鑑於此，逐利用本身的學理知識及多年的 實務經驗，積極從事研究及反覆測試，終於研發出—種 且應用範圍更廣且符合產業利用價值之本創作。 、 【新型内容】 =作之主要目的’在於提供一種結構簡單及可快速組合完 成，且=加賴面齡提綠_编姐之纖體散熱模組。 r的到上迭目的，本創作記憶體散熱模組改良，係由兩對 ΪΓϊί ，其間夹持—記憶體；其中：兩散熱片内侧面 之導熱塾片而附著於記憶體之兩側，以使記憶體在 謝财、物料靖刪而散發， *別财—散熱面㈣，嘯_面板部上 __之折部’可增加散熱面積使記憶體提 率，且該等折部上分別具有相互對應卡扣的扣件及扣 夢由拆智創作結構簡單，且可快速結合而組成散熱模組，並能 稭由折部㈣散熱面積來提高記㈣散熱功效。 6 M346847 【實施方式】 為了使審查委員能對本創作之目的、特徵、及功能，有更 進一步瞭解，茲舉一較佳實施例並配合圖式詳細說明如下·· 首先請芩閱第1圖至第4圖，係為本創作之立體分解示意 圖、本創作之立體組合示意圖 '本創作之局部剖面示意圖及本創 作之較佳實施例示意圖，本創作係為一種記憶體散熱模組改良， 係由兩對稱的政熱片1 〇所構成，其間夾持一記憶體2 〇 ;其中： 兩散熱片10内侧面設有導熱效能之導熱墊片i 5而附著於 • $憶體2 Q之兩侧，以使記憶體2 0在運作時所產生的熱量可迅 速平均的傳導至該對散熱片1 〇而散發，並且該對散熱片1 〇 上分別具有一散熱面板部1，而該對散熱面板部丄上分別沖壓出 複數個向内彎折之折部丄^，本實施例中該折部丄丄係為一鰭片 ^恶’故可增加散熱面積使記憶體2 0提高散熱效率，且該等折 1上为別具有複數個相互對應卡扣的扣件1 1 1及扣孔1 1 2 (請參閱第3A圖），本實施例中該扣件1χι係為徑向突出 之凸片…構，藉以，當该插接扣件1 1 1插入對應之扣孔1 1 2 • 日寺，該凸片結構抵頂住該扣孔1 1 2周沿，使其快速組合成散埶 模組。 . 一在前述本創作實施例中，該對散熱片i 〇在其上端分別設有 向内壓折之防塵部1 2，用以防止灰塵雜質侵入散熱片1 〇 内，以避免記憶體2 〇及散熱片1〇之功效受到影響。而該對防 塵"卩1 2上更分別具有相互對應結合的插片1 3及插孔1 4，其 ，當該插片13插人對應之插孔χ 4時，該對散熱片丄〇係藉^ 該插片13及該插孔14形成支點，並結合該扣件i i丨及^扣 孔112用以將該記憶體2 〇夾固於該對散熱片丄〇之間，因此 本創作結構簡單，且可快速組成散熱模組。 7 M346847 時， 呈一夾具型態’此時該對散熱片1 〇上端=塵5月2欠 11，使灰塵雜質無法侵人散熱片i Q内，以 0及散熱片10之功效受到影響，再將 ^、 構抵頂住該扣孔i i 2周沿而相互扣人， 11之凸片結 且可藉由扣件111及扣孔11 2相;對應卡敎 t組古再者藉由折部i i設計可具體增加散熱模 故可有效提高記憶體2 0散熱功效。 政…、面積， 综上所陳，本創作實為不可多得之 進步等要件，法提二 上述實施例僅例示性說明本創作之原理及其功 =制士創作。任何熟習此項技藝之人士均可在不射=用於 7及範臂下，對上述實施例進行修飾與改變。目此 之精 利保護範®，應如後述之ψ請專利範騎列。。作之權 【圖式簡單說明】 第1圖係為本創作之立體分解示意圖。 第2圖係為本創作之立體組合示意圖。 第3圖係為本創作之局部剖面示意圖。 第3 A圖係為本創作之扣件及扣孔局部放大圖。 8 M346847 第4圖係為本創作之較佳實施例示意圖。 第5圖係為習知記憶體散熱裝置之立體組接示意圖。 【主要元件符號說明】 散熱片·· •••10 散熱面板部· • · 1 折部· · · •••11 扣件···· ••11 扣孔· · · •••112 防塵部··· ••12 插片· · · •••13 插孔···· .•14 導熱墊片· •••15 吞己十思體··· ••20 習知記憶體散熱裝置···· • 3 0 導熱膠片· •••301 散熱片· · · ••30 扣接鉤·· •••302a 扣接孔··· ••30 承扣座·· •••3 0 2 c 定位片· · · ••30 夾扣件·· •••303 倒鉤···· ••30 限位槽·· • · · 304 扣孔···· ••30 i^位孔·· •••306M346847 VIII. New description: 【New technology field】 The creation of Weng _- kinds of body parts can be combined quickly and quickly, and can increase the number of special types, and. Interstitial memory dispersion group. (4) heat dissipation effect [prior art] Press, the conventional memory heat sink 3 〇, • thermal film 3 G i, two heat sink 3 〇 = two == =, by the two guides > the thermal film 3 01 is respectively attached to the heat dissipation 3 〇 3, wherein the upper side of the edge of the 3 0 2 is respectively provided with the buckle surface of the ^ ^ and the heat sink and the buckle seat 3 0 2 c, so that the two are scattered 4 2 : And the fastening hole 3 0 2 b - the space for the memory 2 to be accommodated, the buckle 2 U storage = the (10) convex-shaped limit S3 2 provided on the outer side of the sheet has a buckle Hole 3 0 5, and in the buttonhole 3 〇 stomach 5 upper set = end ^ door type clips 3 0 3 span positioning piece qn 0 ^ ^ ^ hole 3 0 6, for the two sides of the two sides set Barbs 3 〇 3 a, „丨5 pain...: and make the two cool fasteners 3 into the buttonholes 3 Q 5, so that the barbs 3 Q 3 a anti iaiii: the holes of the holes 3 Q 6 The memory 20 is closely attached to cover the ^ = and the heat sink of the two heat sinks 3 〇 2 • can be quickly and evenly distributed during the operation to generate the Q_ after completion, although it can reach 1, for two heat dissipation Sheet 3 0 2 and memory 2 〇 close memory heat sink 3 0 in hot sheet 3 Ω 9 贴 patch wrap , Xizhiji 3 0 5 ^^3 0 6,3 〇4 ' and other complex structure design, making the knowledge of the pity body barb 3 〇 3 a inconvenient, and the production process is also very MM non-f complex 5 M346847 2. The conventional memory heat sink 30 has no dust-proof design, so that when the air heat 2 and the memory 20 are assembled, the upper end forms a sinus gap, and the gray matter invades the heat sink 3 0 2 , so that Memory 2 散热 and heat sink 3 are affected. ..., the effect of 3, due to the rapid improvement of computer processing efficiency, the temperature generated by the memory is getting higher and higher, the conventional memory heat sink 3 〇, Although the furnace has achieved the basic effect of the foundation, but it is expected to have a bulging knowledge, so the heat dissipation ^ limited 'still memory is damaged due to excessive temperature, so the obvious heat dissipation performance of the heat sink 30 can not be To meet the requirements of today's high-order memory', how to effectively improve the knowledge memory scatter and become the current problem of reading. Mai is 'this creator has this in mind, using his own academic knowledge and years of practical experience. Actively engaged in research and repeated testing, and finally Developed a new type of application that is more widely used and in line with the value of industrial use. [New content] = The main purpose of the work is to provide a simple structure and quick combination, and = add the age of the face to green The slimming module of the sister. The upper part of the r, the improvement of the heat dissipation module of the creation memory is made up of two pairs of ΪΓϊί, during which the clamping-memory body; wherein: the thermal fins on the inner side of the two heat sinks are attached On both sides of the memory, so that the memory is distributed in Xie Cai, the material is deleted, * Don't make money - the heat sink surface (4), Xiao _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ And the fasteners and the buckles on the folding portions respectively have a simple structure, and can be quickly combined to form a heat dissipation module, and can be improved by the heat dissipation area of the folding portion (four). . 6 M346847 [Embodiment] In order to enable the reviewing committee to have a better understanding of the purpose, features, and functions of the present invention, a preferred embodiment will be described in detail below with reference to the drawings. First, please refer to Figure 1 to Figure 4 is a three-dimensional exploded view of the creation, a three-dimensional schematic diagram of the creation, a partial cross-sectional view of the creation, and a schematic diagram of a preferred embodiment of the creation. The creation is a memory heat dissipation module improvement. Two symmetrical political heating sheets 1 are formed, and a memory body 2 is sandwiched therebetween; wherein: two heat-dissipating thermal conductive pads i 5 are disposed on the inner side of the heat sink 10 and attached to both sides of the body So that the heat generated by the memory 20 during operation can be quickly and evenly transmitted to the pair of heat sinks 1 散, and the pair of heat sinks 1 respectively have a heat dissipation panel portion 1 and the pair of heat dissipation panels A plurality of inwardly bent portions Φ are respectively punched out on the cymbal, and the folded portion is a fin 恶 ' in the embodiment, so that the heat dissipation area can be increased to improve the heat dissipation efficiency of the memory 20, and The fold is 1 The fastener 1 1 1 and the buckle hole 1 1 2 (see FIG. 3A) having a plurality of mutually corresponding buckles, in the embodiment, the fastener 1χ is a radially protruding tab structure, thereby The plug fastener 1 1 1 is inserted into the corresponding button hole 1 1 2 • Japanese temple, the tab structure abuts against the circumference of the button hole 1 1 2, so that it is quickly combined into a dilation module. In the foregoing embodiment, the pair of heat sinks 〇 are respectively provided at the upper ends thereof with the dustproof portion 12 which is folded inwardly to prevent dust impurities from intruding into the heat sink 1 to avoid the memory 2 〇 And the effect of the heat sink 1 受到 is affected. And the pair of dustproofs 卩1 2 respectively have a corresponding inserting piece 13 and a socket 1 4, wherein when the inserting piece 13 is inserted into the corresponding jack χ 4, the pair of fins 丄〇 The ferrule 13 and the insertion hole 14 form a fulcrum, and the fastener ii 丨 and the fastening hole 112 are used to clamp the memory 2 丄〇 between the pair of heat sinks, so the creation The structure is simple and can quickly form a heat dissipation module. 7 M346847, in a fixture type 'At this time, the pair of fins 1 〇 upper end = dust May 2 owed 11, so that dust impurities can not invade the heat sink i Q, with the effect of 0 and heat sink 10, Then, the structure is clamped against the circumference of the button hole ii 2 to buckle each other, and the protrusion of the 11 piece can be connected by the fastener 111 and the buckle hole 11 2; The design of the part ii can specifically increase the heat dissipation mode, which can effectively improve the heat dissipation effect of the memory 20 . Politics..., area, and above, this creation is a rare and progressive element, and the above examples are only illustrative of the principles of this creation and its merits = the creation of the master. Anyone skilled in the art can modify and change the above embodiments without using the invention. For the purpose of this, the protection of the Fan® should be as follows. . The right to make a simple description of the figure The first picture is a three-dimensional decomposition diagram of the creation. The second picture is a three-dimensional combination diagram of the creation. Figure 3 is a partial cross-sectional view of the creation. Figure 3A is a partial enlarged view of the fastener and the buttonhole of the creation. 8 M346847 Figure 4 is a schematic diagram of a preferred embodiment of the present invention. Figure 5 is a schematic diagram of a three-dimensional assembly of a conventional memory heat sink. [Description of main component symbols] Heat sink ··•••10 Heat-dissipating panel section · • · 1 Folding part · · · •••11 Fastener ···· ••11 Buttonhole · · · •••112 Dustproof part ··· ••12 Inserts · · · ••• 13 Jacks······14 Thermal Pads ••••15 吞己十思体···••20 Conventional Memory Heatsinks· ··· • 3 0 Thermal film · ••• 301 Heat sink · · · •• 30 Snap hook ··••• 302a Snap hole ··· •• 30 Snap seat ·· •••3 0 2 c Positioning plate · · · ••30 Clips·· •••303 Barbs···· ••30 Limiting slots ·· • · · 304 buttonholes···· ••30 i^ position holes· · •••306