CN201725266U - 内存条散热组件 - Google Patents

内存条散热组件 Download PDF

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CN201725266U
CN201725266U CN201020227461XU CN201020227461U CN201725266U CN 201725266 U CN201725266 U CN 201725266U CN 201020227461X U CN201020227461X U CN 201020227461XU CN 201020227461 U CN201020227461 U CN 201020227461U CN 201725266 U CN201725266 U CN 201725266U
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radiating
memory bar
radiating piece
pilot hole
buckles
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何金民
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Shenzhen Futaihong Precision Industry Co Ltd
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Shenzhen Futaihong Precision Industry Co Ltd
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本实用新型公开一种内存条散热组件，用于对一内存条进行散热，其包括一第一散热件、一第二散热件及二固定件，第一散热件配合第二散热件以夹持内存条于其间，该二固定件分别将该第一散热件、第二散热件及内存条固定于一体。

Description

内存条散热组件
技术领域
本实用新型是关于一种内存条散热组件。
背景技术
随着电脑技术的迅速发展，内存条的储容量和频率不断提升，工作过程产生的热量也相应地不断增加，如何在使用过程中对内存条进行散热已越来越重要。目前常用的散热方法是在内存条上加装散热片进行散热。现有技术一种是采用一次性固定，但是午无法进行维修或更换芯片；另一种是通过螺丝固定件并配合内存条上相应的开孔将散热片紧密贴合内存条上，但上述方法拆装过程较繁琐。
实用新型内容
有鉴于此，有必要提供一种拆装方便的内存条散热组件。
一种内存条散热组件，用于对一内存条进行散热，其包括一第一散热件、一第二散热件及二固定件，第一散热件配合第二散热件以夹持内存条于其间，该二固定件分别将该第一散热件、第二散热件及内存条固定于一体。
优选地，该固定件包括主体和设于主体的二相对的卡扣，该第一散热件两端设有第一定位孔，第二散热件两端设有与第一定位孔相对的第二定位孔，挤压二卡扣发生变形连同该主体一同穿过第二定位孔及第一定位孔后，二卡扣露出第一定位孔恢复原状从而与第一定位孔周缘卡持。
优选地，该固定件包括卡扣部，该卡扣部设有一空隙，该空隙将卡扣部分割为二卡扣。
优选地，该主体为“T”形，其与卡扣部连接的一端设有与该空隙相贯通的通槽。
优选地，该第一散热件相对两端分别设有一凸耳，该第一定位孔开设于该凸耳上。
优选地，该第二散热件相对两端分别设有一凸耳，该第二定位孔开设于该凸耳上并与第一定位孔相对。
优选地，该第一散热件与第二散热件均还设有间隔设置的散热槽及散热片。
优选地，该第一散热件与第二散热件内侧面涂有散热胶。
优选地，该第一定位孔及第二定位孔内壁均涂有散热胶。
一种内存条散热组件，用于对一内存条进行散热，其包括第一散热件、第二散热件及二固定件，第一散热件配合第二散热件以夹持内存条于其间，每一固定件均设有二卡扣，将二卡扣相对挤压形变使每一固定件均穿过该第一散热件与第二散热件并通过二卡扣恢复原状卡持固定。
相较现有的内存条散热组件，所述内存条散热组件的第一散热件及第二散热件的散热通槽提升空气流动空间加快散热速度，该散热片增大散热面积，通过固定件的二卡扣的变形实现第一散热件与第二散热件对内存条的夹持固定，便于该内存条散热组件的装卸。
附图说明
图1是本实用新型较佳实施例的内存条散热组件的立体示意图。
图2是具有本实用新型较佳实施例的内存条散热组件的分解图。
主要元件符号说明
  第一散热件   10
  散热片   12
  散热通槽   13
  凸耳   14
  第一定位孔   15
  第二散热件   20
  收容槽   21
  散热片   22
  散热通槽   23
  凸耳   24
  第二定位孔   25
  固定件   30
  主体   31
  通槽   311
  卡扣部   32
  空隙   321
  卡扣   322
  内存条   40
  内存芯片   41
具体实施方式
请参阅图1及图2，本实用新型内存条散热组件用以对一内存条40进行散热，其包括一第一散热件10、一第二散热件20和二固定件30。该内存条40设有若干内存芯片41。
该第一散热件10为条状板，其内侧面涂有散热胶并设有收容内存芯片41的收容槽(图未示)，外侧表面垂直凸设有若干散热片12，并且设有贯通该内侧面及外侧面的若干散热通槽13。该第一散热件10相对两端延伸有凸耳14。该二凸耳14上均开设有第一定位孔15。该第一定位孔15内壁上涂有散热胶，加快散热速度。
该第二散热件20与该第一散热件10结构相似，其内侧面设有收容内存条40的与第一散热件10的收容槽结构实质上相同的收容槽21。该收容槽21周壁涂有散热胶，外侧表面垂直凸设有若干散热片22，并且设有贯通该内侧面及外侧面的若干散热通槽23。该第二散热件20相对两端延伸有凸耳24。该二凸耳24上均开设有第二定位孔25。该第二定位孔25内壁上涂有散热胶以加快散热速度。该第一定位孔15、第二定位孔25内壁及收容槽21周壁上的散热胶有利于内存条40的散热。
该二固定件30结构相同，其包括一“T”形圆柱体的主体31及卡扣部32。该主体31端部向主体31内开设有通槽311。该卡扣部32为一圆锥形的弹性体，其凸设于该主体31端部，该卡扣部32中部开设有与该通槽311连通的空隙321。该空隙321将该卡扣部32分割为二卡扣322。该卡扣部32可与该主体31为相同金属材质一体成型，也可以为橡胶材质与主体31双射形成。该通槽311可以为二卡扣322提供更大的弹性力。
请复参阅图1，组装时，将该内存条40凸出有内存芯片41的侧面收容于该第一散热件10的收容槽，将第二散热件20的收容槽21朝向内存条40，并将第一散热件10的第一定位孔15与第二散热件20的第二定位孔25相对，在将该固定件30设有卡扣部32的一端穿过从第二定位孔25穿入，当该卡扣部32的二卡扣322容于第二定位孔25内时收到挤压相对靠近，同时第二定位孔25内壁的散热胶是受到挤压产生变形，使该固定件30顺利穿过第一定位孔15及第二定位孔25。当二卡扣322穿过第一定位孔15后恢复原状与该第一定位孔15的边缘卡持，从而将该内存条40加紧于第一散热件10与第二散热件20之间。
拆卸时，相对按压并抵推二卡扣322，使二卡扣322变形穿过第一定位孔15及第二定位孔25。
所述内存条散热组件的第一散热件10及第二散热件20的散热通槽13提升空气流动空间加快散热速度，该散热片12增大散热面积，通过固定件30的二卡扣322的变形实现第一散热件10与第二散热件20对内存条40的夹持固定，便于该内存条40散热组件的装卸。

Claims (10)

1.一种内存条散热组件，用于对一内存条进行散热，其包括一第一散热件及一第二散热件，第一散热件配合第二散热件以夹持内存条于其间，其特征在于：该内存条散热组件还包括二固定件，该二固定件分别将该第一散热件、第二散热件及内存条固定于一体。
2.如权利要求1所述的内存条散热组件，其特征在于：该固定件包括主体和设于主体的二相对的卡扣，该第一散热件两端设有第一定位孔，第二散热件两端设有与第一定位孔相对的第二定位孔，挤压二卡扣发生变形连同该主体一同穿过第二定位孔及第一定位孔后，二卡扣露出第一定位孔恢复原状从而与第一定位孔周缘卡持。
3.如权利要求1所述的内存条散热组件，其特征在于：该固定件包括卡扣部，该卡扣部设有一空隙，该空隙将卡扣部分割为二卡扣。
4.如权利要求3所述的内存条散热组件，其特征在于：该主体为“T”形体，其与卡扣部连接的一端设有与该空隙相贯通的通槽。
5.如权利要求2述的内存条散热组件，其特征在于：该第一散热件相对两端分别设有一凸耳，该第一定位孔开设于该凸耳上。
6.如权利要求2述的内存条散热组件，其特征在于：该第二散热件相对两端分别设有一凸耳，该第二定位孔开设于该凸耳上并与第一定位孔相对。
7.如权利要求2的内存条散热组件，其特征在于：该第一散热件与第二散热件均还设有间隔设置的散热槽及散热片。
8.如权利要求7所述的内存条散热组件，其特征在于：该第一散热件与第二散热件内侧面涂有散热胶。
9.如权利要求2述的内存条散热组件，其特征在于：该第一定位孔及第二定位孔内壁均涂有散热胶。
10.一种内存条散热组件，用于对一内存条进行散热，其包括第一散热件及第二散热件，第一散热件配合第二散热件以夹持内存条于其间，其特征在于：该内存条散热组件还包括二固定件，每一固定件均设有二卡扣，将二卡扣相对挤压形变使每一固定件均穿过该第一散热件与第二散热件并通过二卡扣恢复原状卡持固定。
CN201020227461XU 2010-06-17 2010-06-17 内存条散热组件 Expired - Fee Related CN201725266U (zh)

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