TW405248B - Heat sink and memory module with heat sink - Google Patents
Heat sink and memory module with heat sink Download PDFInfo
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- TW405248B TW405248B TW088109945A TW88109945A TW405248B TW 405248 B TW405248 B TW 405248B TW 088109945 A TW088109945 A TW 088109945A TW 88109945 A TW88109945 A TW 88109945A TW 405248 B TW405248 B TW 405248B
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Description
----——έΛ5248---- 5·、發明說明(1) . 【發明之背景】 1.發明之領域 本發明係關於可裝著於一記憶體模組的一散熱體’以 及安裝有散熱體之一記憶體模組;尤有關於在一印刷電路 板上主要安裝有複數之⑽龍的記憶體模組中所安裝的散熱 體’以及安裝有散熱體之此一記憶體模組。 2 ·相關技術之描述 近來’半導體記憶體,如動態隨機存取記憶體 (DRAM ’dynamic random access memory)的運算速度和儲 存容量都快速地進步。由於半導體記憶體集積密度的增 加’半導體記憶體積體電路產生的熱量也相對增加。另 外’容納包括半導體記憶體丨c的微電子元件模組有縮小體 積的需求。另一方面,某些記憶體模組使用包括一 IC之類 的元件來補償因個別DRAM運算速度的提升而導致的信號時 間延遲。因此,除半導體記憶體丨C之外,許多IC和晶片型 ::兀:會安裝在印刷電路板上’因此安裝在記憶體模組 中的7L件數目有增多的趨勢。 u m 的筏術將以參照圖1 Α *1β的方 式加以次明,其中圖1 Α和1Β為典型習4 概略平面圖和概略側視圖。如‘:技術§己憶體椟、,且的 複數個安裝於印刷電路板丨各括面數上個/日|記憶體旧,以及 刷電路板1具有-接觸㈣列4的:片型電容152。該印 买·延著印刷電路板1各面
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五、發明說明(2) 的長邊排列,以和正確的對應插座進行電連接。 如圖1A和1B所示,半導體記憶體IC3和晶片型 以裸露的狀態安裝於印刷電路板丨的各面上,且記 組1 〇以此裸露狀態插入如個人電腦的系統插槽中。’“因此, 記憶體IC3產生的熱只能由記憶體! C3的表面幅射。 在上述的習知技術記憶體模組中,由於記憶體κ 面熱幅射是記憶體i C產生熱散發的唯一方式,ς 到-滿意的散熱效率…由於熱幅射效率本身斤會::達 裝形^影響’所以在增加集積度時會導致匪的 …、a加,而遭遇到記憶體性能下降的新問題。 另外,由於在習知技術記憶體模組中,所有元件都以 稞路的狀態安裝在模組上,因此如電容器和電阻器等位於 記憶體模組的印刷電路板周邊區域的元件,很搬 ==性震動而損壞或遺失。又,隨著記憶體模組之 :!電上安裝IC效能的提升’封裝1c的引針間距變得 =乍,導致另一個新問題產生,即外在因素導致引針的短 路0 另夕b卜丄通常包括記憶體IC之元件安裝於印刷電路板的 方式,疋先將7G件置於印刷在印刷電路板的焊錫 ,再 將印刷電路板放人回流爐中’以將元件焊在印刷電路板 上。在此程序中,印刷電路板常會彎曲,而若元件安裝於 f曲的印刷電路板上’ #記憶體模組插入到—如個人電腦 系統的插槽中時,有應力作用於印刷電路板上,該元 件從印刷電路板上剝離。
五、發明說明(3) 曰本專 (JP-A-07-併入本案中 率地散發I C —散熱基板 熱基板的表 此習知 個高散熱效 路板上時能 雜而昂貴, 方法不能解 英文摘 記憶體 憶體1C 憶體I C 效率, 安裝於 體結構 貴。此 要全文 以有效 連接在 和該散 以使數 印刷電 變得複 外,該 【發明的概述】 因此,本發明的 成配合一記憶體模組 組,以克服上述習知 本發明的另一目 一記憶體模組,且可 封裝半導體記憶體, 記憶體模組印刷電路 判別印刷電路板贊曲 半導體記憶體和其它 本發明的另—目 述之散熱體。 405248 利公開公報第JP-A07-2 02 1 20號 202120的英文摘要可取得,且該 作為參考資料)提出一種高散熱 產生的熱量’其係藉由將封裝記 表面上,且以樹脂覆蓋該封裝記 面。 技術欲提升個別記憶體I c的散熱 率記憶體IC組成的記憶體模組在 有高散熱效率。然而,個別記情 因此’對應的記憶體模組變得昂 決印刷電路板彎曲的問題。 目的之一,為提出一種散熱體,其構 ,以及一種配合該散熱體的記憶體模 技術中的問題。 的’為提出—種散熱體,其構成配合 以有效地散發安裝在記憶體模組上之 ,RAM所A生的#,可以保護安裝在 板上的元件不受機械性震動,也可以 的程度,該印;gll Φ _ “丨刷電路板上安裝有封裝 兀件。 的’為提出-種記憶體模組以配合上
第8頁 404-2 4 & 五、發明說明(4) 本發明上述和其它的目的,係藉由本發明之一種散熱 體達成’該散熱體安裝於由裝設在印刷電路板之數個封裝 S己憶積體電路構成的一記憶體模組中,該散熱體的載面呈 ϋ形’記憶體模組可以插入散熱體的U形凹槽,其間並有一 熱傳導物質和散熱體及記憶積體電路接觸。 在一實施例中,該熱傳導物質具有高熱傳導率,且該 散熱體由彈性物質形成’具有夾持功&,所以記憶體模: :散熱體經由該高熱傳導率物質夾持。該散熱體最好在外 表面具有數個凸面,以增加外表面區域。 其由月之另一實施樣態,提出-種記憶體模組, 於印1電路板之封裝記憶積體電路構成,且 和具有υ形載面之散熱體配合,其 組插入散熱體的U形凹槽中,方法為將記憶體模 物質和散熱體及封裝記:積體電間 在一實施例中,該熱傳導物質 散熱體由彈性物質形成,具有央y有-熱傳導率’且該 以散熱體經由該高熱傳導率物能,所以記憶體模組 為一具有絕緣性之高導熱性橡膠、。該熱傳導物質最好 數個凸面,以增加外表面區::,且散熱體在外表面具有 散熱體可從記憶體模組上移 熱傳導物質為一種矽潤滑脂。;。在另一實施例中,該 該散熱體的長度和其υ形凹楢 有安裝在印刷電路板上的封的深度最好足以覆蓋所 上述本發明之目的、特徵=積體電路。 ' 優點將對照相關圖示於以 五、發明說明(5) 下的較佳實施例中加以說明。 【圖示之簡單說明】 圖1 A和1 B分別為習知技術記憶體模組典型實施例之俯 視圖和概略側視圖; 圖2A和2B分別為本發明第一實施例中,配合散熱體的 記憶體模組之概略俯視圖和概略側視圖; 圖2C為沿圖2B中A-A線之概略部份截面圖; 圖3 A和3B分別為本發明第二實施例中,配合散熱體的 記憶體模組之概略俯視圖和概略側視圖;及 圖3C為沿圖3B中B-B線之概略部份截面圖。 【符號之說明】 1〜印刷電路板 2〜晶片型電容器
3〜記憶體IC 4〜接觸墊 5〜覆蓋及散熱體 5A〜頂板 5B-側板 50側板 5D〜凸面 6 ~碎潤滑脂 7〜夾型覆蓋及散熱體
第10頁 405248 五、發明說明(6) ' - — 〜頂板 〜側板 7 C ~側板 7D〜凸面 8〜高導熱性橡膠 1 〇〜記憶體模組 【較佳實施例之詳細說明】 參考圖2Α和28,顯示一本發明第一實施例中,配合散 ”,、體的記憶體模組之概略俯視圖和概略側視圖。圖2 c為 _中^線之概略部份截面圖。在圖2八、2心2(:中^/ 圖1A和1B中相同的元件將使用相同的對照號碼,並省略且 說明以求簡化。 八 如比較圖ΙΑ、1B和圖2A、2B所示,第一實施例的特 徵,為習知記憶體模組1〇(包括複數個記憶體IC3,複數個 安裝於印刷電路板1上的晶片型電容器2,及數個位於印刷 電路板1 一邊緣上的接觸墊4)和一根據本發明之「覆蓋及 散熱體」5配合。此「覆蓋及散熱體」5具有一如圖2B所示 的u形截面《即,「覆蓋及散熱體」5具有一頂板5A,和一 對側板5 B及5 C從頂板兩側縱向垂直向下延伸,以在其間形 成一U形深凹槽。側板5B和5C相對内平面間的距離s比記憶 體模組1 0的厚度T大。此距離S從側板5B和5C的上緣到下緣 是安裝的。「覆蓋及散熱體」5的長度L和U形深凹槽的深 度D(從頂板5A的内部平面到該對側板5B及5C自由邊的距
III
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五、發明說明(7) T)上以覆蓋安裝在印刷電路板1上所有的封裝 :70件,:維持接觸墊4為曝露的狀態。在顯示%的 J ,「覆蓋及散熱體」5的長度匕比從最左邊封裝呓憶: 之左側到最右邊封裝記憶體Ic之右側的距離長,、在圖、 ,但比印刷電路板1的長度短,且其深度D稍微比從印刷 =狀之:端到封裝記憶體Κ之底端的距離長,如嶋 另外,如圖2A和2B所示,至少「覆蓋及散熱 該對側板5B和5C在外平面最好有數個凸面或小凸起^。、 因此、,該「覆蓋及散熱體」5配合於記憶體模組1〇上 =方式,為將記憶體模組丨〇插入該對侧板5B和5(:間的u形 罙凹槽且所有女裝在印刷電路板1各面的記憶體IC3和其 它=2都以側板5W5C覆蓋,但接觸墊4並未被侧板冗和 覆盍。在此狀態下,如圖2C所示,以具有良好導熱性及 絕緣性的矽潤滑脂6填入各側板5B和5(:和各封裝記 之間的空間,使各封裝記憶體IC3產生的熱經由矽^滑脂6 ,導至對應的側板5B或5C。由於該矽潤滑脂6存在於「覆 ,及,熱體」5的側板5B和5C與各封裝記憶體IC3之間, 「覆蓋及散熱體」5可和記憶體模組丨〇分開。 如上所述,在第一實施例中,該「覆蓋及散熱體」5 ,合於習知記憶體模組1 〇上,矽潤滑脂6填充於「覆蓋及 散熱體」5與封裝記憶體IC3之間。在此安排下,由各封裝 記憶體IC3產生的熱經由矽潤滑脂6傳導至「覆蓋及散熱 體」5,且熱經由「覆蓋及散熱體」5幅射。由於「覆蓋及 第12頁 五、發明說明(8) 散熱體」5的外类, h 表面區域比女裝在印刷電路板1 的埶可瘦A「费表面區域顯者為大,封裝記憶體iC3產生 ▲散熱體」5散發出去,其散熱比圖1A 矛所不之1知記憶體模組1〇更有效率。此處,即使「覆 蓋及散熱體」5的外表面沒^ S5D,若 y吏覆 I」5/:卜/面比安裝在印刷電路板1上之封裝記上 ^目對外表面區域顯著為大,則「覆蓋及散熱體」5的外 表面就不必要具有凸面51)。然而,由於可以更增加「覆蓋 及散熱體」5的外表面,所以最好在「覆蓋及散熱體」5的 外表面上具備有凸面5D。 又,由於所有安裝在印刷電路板】上的封裝記憶體K3 和其它元件2都被「覆蓋及散熱體」5覆蓋,位於印刷電路 板1周邊區域的晶片型元件,如電容器和電阻器都受到保 護不受機械性震動,所以位於記憶體模組印刷電路板周邊 區域的晶片型元件不會因為運輸而損壞或遺失。 另外’如上所述,當包括記憶體丨C的元件以融化印刷 電路板上焊錫膏的方式安裝在印刷電路板上時,印刷電路 板常會彎曲。如果印刷電路板的彎曲程度超過一定的界限 時’ 「覆蓋及散熱體」5不能和記憶體模組1 〇配合。因 此’可以基於「覆蓋及散熱體」5是否可以和記憶體模組 1 0配合,來判別印刷電路板彎曲的程度。如此,可以防止 印刷電路板上的元件因為彎曲超過了限度,而在插入如個 人電腦的插槽時,產生元件從印刷電路板剝離的情形。 在此第一實施例中’ 「覆蓋及散熱體」5必須有好的
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_405248 五、發明說明(9) 導熱性和機械強度,1 〜 元件2和3不受到機械^ ^女裝在P刷電路板1上的 5可由金屬或陶磁製成。另:所以,該覆蓋及散熱體」 與其相同的黏滞度Λ/定V石夕二f脂6可以用任何具有 料取代。又,若「涛ΐ 絕緣性和良好導熱性的材 合後不f Μ # 0覆盍及散熱體」5在與記憶體模組10配 2:而要拆卸’則矽濁滑脂 性和良好導熱性的緊密接觸型黏接劑取代 絕緣 *,二其分別顯示根據本發明的第二實施例 & = 5散熱體的概略平面圖和概略截面圖。 圖3C為:圖3B中"’線的概略部份截面圖 碼,並省略其說明以求2同的-件使用相同的對照號 如=圖3A、3B及離、2,及2(:所示,第二實施例 :第-“例之不同處’在於第一實施例的「覆蓋及散熱 」5和矽潤滑脂6,在第二實施例中分別以夾型「覆蓋及 散熱體」7和-種具有絕緣特性的高導熱性橡膠8取代。 該夾型「覆蓋及散熱體」7由彈性材料形成,例如且 有彈性的金屬或陶磁,以及,的截面,如圖3B所示:、 更明確地,該夾型「覆蓋及散熱體」7具有一頂板7a和一 對侧板7B及7C,其先從頂板7A的縱向兩邊稍微向内延伸— 短距離,再向下垂直延伸’以在其間形成一U形深凹槽, 且在側板7 B及7 C間具有夾持功能。 另外’和第一實施例相同,至少在該對夾型「覆蓋及 散熱體」7的側板7B和7C外表面上最好具有數個凸面或小
第14頁 五'發明說明(10) --- 凸起7D,增加表面區域以提升熱幅射效率。但,不只該對 側板7B與7C,頂板7A的外表面也可具有凸面或小凸起7D。 和第一貫施例相同,側板7B和7C相對内平面間的距離 S比記憶體模組10的厚度TA。「覆蓋及散熱體」7的長度L 和ϋ形深凹槽的深度D(從頂板7A的内部平面到該對側板几 及7C自由邊的距離)足以覆蓋安裝在印刷電路板i上所有的 封裝記憶體IC和其它元件,只維持接觸墊4為曝露的狀 態。另外,各側板7B和7C垂直部份的大小,足以覆蓋所有 安裝在印刷電路板1上的封裝記憶體丨c和其它元件,如圖 3B所示。 因此,该夾型「覆蓋及散熱體」7配合於記憶體模組 1 0上的方式,為將記憶體模組丨〇插入該對侧板7B和7(:間的 U形深凹槽,且所有安裝在印刷電路板丨各面的記憶體IC3 和其它元件2都以侧板几和几覆蓋,且以高導熱性橡膠8安 裝於側板7B和7C間,該高導熱性橡膠8插入於各側板7β和 7C之内表面及各封裝記憶體〗C3之間。 ,此第二實施例中,由於「覆蓋及散熱體」5以夾型 「覆蓋及散熱體」7取代,其係以具有高導熱性之彈性橡 膠8插入於側板7B及7C和封裝記憶體IC3間,所以和第一實 施例相比丄夾型「覆蓋及散熱體」7和封裝記憶體IC3間的 密接性提高。因此,各封裝記憶體丨C3產生的熱可以更有 效率地經由南導熱性橡膠8傳導至夾型「覆蓋及散熱體」 7,以將熱自夾型「覆蓋及散熱體」7表面幅射出去。 和第一實施例相同,由於夾型「覆蓋及散熱體」7的
第15頁 五、發明說明(11) 2表面區域比安裝在印刷電路板1上之封裝記憶體丨C3的相 外表面區域顯著為大,封裝記憶體IC3產生的熱可經由 ^型2覆蓋及散熱體」7散發出去’其散熱比圖1A和1B所 不之白知s己憶體模組1 〇更有效率。另外,和第一實施例相 =由於夾型「覆蓋及散熱體」7和封裝記憶體IC3間沒有 #接,封裝§己憶體IC 3產生的熱可比第一實施例中的「覆 盖及散熱體」5更有效率地散發。 「 由於失型「覆蓋及散熱體」7具有彈性,當夾型 覆蓋及散熱體」7夾持記憶體模組1 〇時,會施加一適當 f上,所以和第一實施例中使用矽潤滑脂6比較, 覆蓋及散熱體」從記憶體模組1 〇上脫落的可能性較小。 ’和第一實施例相同,由於安褒在印刷電路板1上 =】:fIC3和其它元件2由爽型「覆蓋及散熱體」7 G阻;;:刷電路板1周邊區域的晶片型元件如電容器 ,益等都觉到保護不受機餘震動, 體柄組印刷電路板周邊區域的晶片型 才貝壞或遺失。 會因為運輸而 另外,如上所述,當包括記憶體丨c 電路板上焊錫膏的方式忠姑—f ,杂 疋件以融化印刷 妬赍$ _:式文裝在印刷電路板上時,印刷雷政 Ξ Π ί果印刷電路板的·f曲程度超過-Γ的:: 因Λ 1覆盍及散熱體」7不能和記憶體模〇配入| ( 因此,和筮一杳# A丨h η 叫柄組1 U配合。 矛第實加例相同’可以基於夾型 體」7是否可以和記憶體模組i 覆盍及散熱 ^ ^ ^ . . , ep ,(J , 双上的7L件因為彎 >5248 五、發明說明G2) 曲超過了限度’而在插入如個 從印刷電路板剝離的情形。電細的插槽時’產生元件 如上所述’根據本發明,知批# μ 有以下的優點·· 散.、·、體配合之記憶體模組 優點為’安裝在記憶 “件所產生的熱可以有效率 :裝:己隐體1 C和其 4 i f L 丨寺的發熱體經由具有高導埶性之矽f # 脂或尚導熱性之橡膠連接$ 「w从ΛΓ= ,、 矽潤滑 體所產决沾舶士 覆蓋及散熱體J ,所以發孰 遐所屋生的熱有效率地傳導至「 … :。有大表面區域的「覆蓋及散熱體」表面散發出 受機由;路板上的元件受到保護不 機械強度可:保d 散熱體」具有足夠的 需動,所u r °隻裝於印刷電路板上的元件不受機械性 元件上。。卩施加的力不會施加到安裝於印刷電路板的 第二優點為,可以判別印刷電路板的彎曲程度是否超 触允許的界限。因$ ’若印刷電路板的彎曲(當包括 心 的元件女裳在印刷電路板上時,由於熱或其它原 因而發生)超過-界限,「覆蓋及散熱體」就不能配合於 記憶體模組上。另夕卜,即使「覆蓋及散熱體」可以配合於 有輕微彎曲的記憶體模組上,也可以經由對配合有「覆蓋 及散熱體」的記憶體模組進行一電子測試,以檢查安裝在 405248 五、發明說明(13) 印刷電路板上的元件是否有從印刷電路板剝離。因此,可 以避免有缺陷的記憶體模組供應到市場去。 本發明已根據特定實施例加以描述和說明。然而,應 注意本發明可在不離開後附申請專利範圍之範疇内進行變 化及修改,故不能被舉例性的詳細結構所限制。
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Claims (1)
- 六、申請專利範圍 數個1封裝電安裝在-印刷電路板上的複 的截面呈U形,兮4 斤汲成之一記憶體模組,該散熱體 其間並有—熱傳導?體模組可以插入散熱體的U形凹槽’ 板上的該封裝記憶2置於散熱體和該安裝在該印刷電路 憶積體電路接觸Γ 電路之間,並和散熱體及該封裝記 2. 如申.請專利範圍 該熱傳導物質且古:也▲散熱體 中. 料形成,❿具有夾持:南熱傳導性,且該散熱體由彈性材 由該高熱傳導性物質:,該記憶體模組由該散熱體經 3. 如申請專利範 $ 該散熱體之外表面 之散熱體. 域。 $具有數個凸面以增#其外表面區 4該=::專#卜園第1項之散熱體,其中: ~ ’、、、之$表面具有數個凸面以增加其外表面區 域0 個封模紐,由安裝在-印刷電路板上的複數 埶體配合,盆事μ方=成,且裝設有一具有ϋ形截面之散 U形凹槽中/並~將°"一鼓式#為將該記憶體模組插入該散熱體的 記憶積體電路之間Γ並傳5導物質爽置於該散熱體和該封裝 接觸。 I和該散熱體及該封裝記憶積體電路 6^專利申請範圍第 該熱傳導物質I右^ & 己11體模組其中· 〃力円熱傳導性,且該散熱體由彈性材 _405248_ 六、申請專利範圍 料形成,而具有夾持作用,該記憶體模組由該散熱體經由 該高熱傳導性物質夾持。 7. 如專利申請範圍第6項之記憶體模組,其中: 該熱傳導物質為一具有電絕緣性之高導熱性橡膠。 8. 如專利申請範圍第6項之記憶體模組,其中: 該散熱體之外表面具有數個凸面以增加其外表面區 域。 9. 如專利申請範圍第6項之記憶體模組,其中: 該散熱體可從記憶體模組拆卸。 1 0.如專利申請範圍第5項之記憶體模組,其中: 該熱傳導物質為一矽潤滑脂。 11.如專利申請範圍第1 0項之記憶體模組,其中: 該散熱體之外表面具有數個凸面以增加其外表面區 域。 1 2.如專利申請範圍第1 0項之記憶體模組,其中: 該散熱體可從記憶體模組拆卸。 1 3.如專利申請範圍第5項之記憶體模組,其中: 該散熱體之外表面具有數個凸面以增加其外表面區 域。 1 4.如專利申請範圍第5項之記憶體模組,其中: 該散熱體可從記憶體模組拆卸。 1 5.如專利申請範圍第5項之記憶體模組,其中: 該熱傳導物質為一具有電絕緣性之高導熱性橡膠。 1 6.如專利申請範圍第5項之記憶體模組,其中:第20頁 405248第21頁
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- 1999-06-12 KR KR1019990021875A patent/KR100297226B1/ko not_active IP Right Cessation
- 1999-06-14 CN CNB991090365A patent/CN1157783C/zh not_active Expired - Fee Related
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DE19928075A1 (de) | 2000-01-27 |
JPH11354701A (ja) | 1999-12-24 |
KR20000006134A (ko) | 2000-01-25 |
US20020001180A1 (en) | 2002-01-03 |
CN1157783C (zh) | 2004-07-14 |
KR100297226B1 (ko) | 2001-11-01 |
CN1239327A (zh) | 1999-12-22 |
JP3109479B2 (ja) | 2000-11-13 |
US6424532B2 (en) | 2002-07-23 |
DE19928075B4 (de) | 2010-04-08 |
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