CN109563330B - 热耗散树脂组合物、其固化产物及其使用方法 - Google Patents

热耗散树脂组合物、其固化产物及其使用方法 Download PDF

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CN109563330B
CN109563330B CN201780047982.1A CN201780047982A CN109563330B CN 109563330 B CN109563330 B CN 109563330B CN 201780047982 A CN201780047982 A CN 201780047982A CN 109563330 B CN109563330 B CN 109563330B
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resin composition
heat
semiconductor element
heat dissipating
component
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CN109563330A (zh
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川手恒一郎
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3M Innovative Properties Co
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3M Innovative Properties Co
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CN201780047982.1A 2016-08-05 2017-07-24 热耗散树脂组合物、其固化产物及其使用方法 Active CN109563330B (zh)

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JP2016-154987 2016-08-05
JP2016154987A JP6879690B2 (ja) 2016-08-05 2016-08-05 放熱用樹脂組成物、その硬化物、及びこれらの使用方法
PCT/US2017/043499 WO2018026556A2 (en) 2016-08-05 2017-07-24 Heat-dissipating resin composition, cured product thereof, and method of using same

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JP7172319B2 (ja) * 2018-09-12 2022-11-16 富士通株式会社 放熱構造体、電子装置、及び放熱構造体の製造方法
US12331182B2 (en) 2019-03-28 2025-06-17 Mitsui Mining & Smelting Co., Ltd. Resin composition and resin-attached copper foil
CN110208977A (zh) * 2019-06-13 2019-09-06 京东方科技集团股份有限公司 一种显示装置及显示装置的制备方法
CN111378250B (zh) * 2020-04-10 2022-05-03 南通大学 一种环氧树脂复合定形相变材料及其制备方法和应用
US20250157979A1 (en) * 2023-11-09 2025-05-15 Electronics And Telecommunications Research Institute Reflow flip chip bonding tool apparatus and operating method thereof

Family Cites Families (100)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0680947A (ja) 1992-09-02 1994-03-22 Furukawa Electric Co Ltd:The エポキシ樹脂組成物
JP3458196B2 (ja) 1994-03-16 2003-10-20 東洋アルミニウム株式会社 高熱伝導性樹脂組成物
JP3501905B2 (ja) * 1996-08-20 2004-03-02 三菱電機株式会社 成形用樹脂組成物並びにそれを用いた高電圧機器用モールド製品およびその製造方法
TW398163B (en) 1996-10-09 2000-07-11 Matsushita Electric Industrial Co Ltd The plate for heat transfer substrate and manufacturing method thereof, the heat-transfer substrate using such plate and manufacturing method thereof
US6136758A (en) 1998-08-17 2000-10-24 Shin-Etsu Chemical Co., Ltd. Aluminum nitride powder and thermally conductive grease composition using the same
JP3948642B2 (ja) 1998-08-21 2007-07-25 信越化学工業株式会社 熱伝導性グリース組成物及びそれを使用した半導体装置
JP2000109373A (ja) 1998-10-02 2000-04-18 Shin Etsu Chem Co Ltd 放熱用シリコーングリース組成物及びそれを使用した半導体装置
JP2001081418A (ja) 1999-09-10 2001-03-27 Polymatech Co Ltd 熱伝導性接着フィルムおよびその製造方法ならびに電子部品
JP2001139833A (ja) 1999-11-16 2001-05-22 Jsr Corp 高熱伝導性シート用組成物、高熱伝導性シート、高熱伝導性シートの製造方法および高熱伝導性シートを用いた放熱構造
JP2001214075A (ja) 2000-02-04 2001-08-07 Jsr Corp 高熱伝導性シート用組成物、高熱伝導性シート、高熱伝導性シートの製造方法および高熱伝導性シートを用いた放熱構造
US20030125418A1 (en) 2001-10-10 2003-07-03 Show A Denko K.K. Particulate alumina, method for producing particulate alumina, and composition containing particulate alumina
DE10297611T5 (de) 2001-12-27 2005-01-13 Showa Denko K.K. Teilchemförmiges Aluminiumoxid, Verfahren zur Herstellung von teilchenförmigem Aluminiumoxid und Zusammensetzung, die teilchenförmiges Aluminiumoxid enthält
US6906396B2 (en) * 2002-01-15 2005-06-14 Micron Technology, Inc. Magnetic shield for integrated circuit packaging
JP4130091B2 (ja) 2002-04-10 2008-08-06 信越化学工業株式会社 放熱用シリコーングリース組成物
JP4014454B2 (ja) 2002-06-12 2007-11-28 電気化学工業株式会社 樹脂組成物、その製造方法及び放熱部材
JP4474607B2 (ja) * 2002-11-12 2010-06-09 アキレス株式会社 熱伝導性樹脂成形体用組成物およびそれから得られる成形体
JP4027820B2 (ja) 2003-03-06 2007-12-26 シャープ株式会社 半導体装置及びその製造方法
KR100975088B1 (ko) * 2003-11-21 2010-08-11 로드코포레이션 이중 단계 웨이퍼 적용 언더필
JP4219793B2 (ja) 2003-11-25 2009-02-04 信越化学工業株式会社 放熱用シリコーングリース組成物
JP2005206761A (ja) 2004-01-26 2005-08-04 Ge Toshiba Silicones Co Ltd 耐熱性シリコーン組成物
JP4089636B2 (ja) 2004-02-19 2008-05-28 三菱電機株式会社 熱伝導性樹脂シートの製造方法およびパワーモジュールの製造方法
JP2005330426A (ja) 2004-05-21 2005-12-02 Shin Etsu Chem Co Ltd 放熱用シリコーングリース組成物
US7560519B2 (en) 2004-06-02 2009-07-14 Lord Corporation Dual-stage wafer applied underfills
JP4725708B2 (ja) 2004-10-12 2011-07-13 信越化学工業株式会社 放熱部品
JP4687887B2 (ja) 2004-10-14 2011-05-25 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP4460433B2 (ja) 2004-12-15 2010-05-12 信越化学工業株式会社 放熱性シリコーングリース組成物の製造方法
JP4662339B2 (ja) 2005-02-04 2011-03-30 エプソンイメージングデバイス株式会社 液晶表示パネル
KR20060089564A (ko) 2005-02-05 2006-08-09 엘지이노텍 주식회사 쉴드캔 표면실장 구조 및 표면실장 공정
US7692318B2 (en) * 2005-03-25 2010-04-06 Shin-Etsu Chemical Co., Ltd. Liquid epoxy resin composition and semiconductor device
JP2006273948A (ja) 2005-03-28 2006-10-12 Mitsui Chemicals Inc 熱伝導性樹脂組成物およびその用途
JP2006307030A (ja) 2005-04-28 2006-11-09 Fujikura Rubber Ltd 放熱性グリース状組成物
JP5048974B2 (ja) * 2005-06-20 2012-10-17 アキレス株式会社 電磁波吸収性と熱伝導性を有するアクリル系樹脂組成物及び樹脂シート
JP4634891B2 (ja) 2005-08-18 2011-02-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物およびその硬化物
JP4942978B2 (ja) 2005-09-30 2012-05-30 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性シリコーングリース組成物及びそれを用いた半導体装置
JP4860229B2 (ja) 2005-10-11 2012-01-25 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性グリース組成物
JP4933094B2 (ja) 2005-12-27 2012-05-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP4206501B2 (ja) 2006-03-01 2009-01-14 ヤスハラケミカル株式会社 熱伝導性ホットメルト接着剤組成物
JP4927426B2 (ja) 2006-03-27 2012-05-09 太陽ホールディングス株式会社 硬化性樹脂組成物及びその硬化物
JP2007291344A (ja) * 2006-03-28 2007-11-08 Achilles Corp アクリル系樹脂組成物及びそれを用いたシート状成形体
TWI419931B (zh) 2006-06-16 2013-12-21 信越化學工業股份有限公司 導熱聚矽氧潤滑脂組成物
JP2008007590A (ja) 2006-06-28 2008-01-17 Mitsui Chemicals Inc 熱伝導性樹脂組成物およびその用途
EP1878767A1 (en) 2006-07-12 2008-01-16 Shin-Etsu Chemical Co., Ltd. Heat conductive silicone grease composition and cured product thereof
JP4917380B2 (ja) 2006-07-31 2012-04-18 信越化学工業株式会社 放熱用シリコーングリース組成物及びその製造方法
JP4884182B2 (ja) 2006-11-22 2012-02-29 独立行政法人国立高等専門学校機構 熱伝導性組成物
JP2008255275A (ja) 2007-04-06 2008-10-23 Momentive Performance Materials Japan Kk 熱伝導性シリコーングリース組成物及びそれを用いた半導体装置
JP2008274036A (ja) 2007-04-26 2008-11-13 Shin Etsu Chem Co Ltd 放熱用シリコーングリース組成物
JP2008274141A (ja) 2007-04-27 2008-11-13 Nok Kluber Kk グリース組成物
JP5228385B2 (ja) 2007-07-06 2013-07-03 ダイソー株式会社 放熱シート及びその製造方法
JP2009096961A (ja) 2007-10-19 2009-05-07 Shin Etsu Chem Co Ltd リワーク性に優れた熱伝導性シリコーングリース組成物
JP5266719B2 (ja) 2007-10-29 2013-08-21 住友ベークライト株式会社 樹脂組成物及び樹脂組成物を使用して作製した半導体装置
JP5274007B2 (ja) 2007-12-27 2013-08-28 三菱電機株式会社 熱伝導性樹脂シートおよびこれを用いたパワーモジュール
JP5549061B2 (ja) 2007-12-27 2014-07-16 ダイソー株式会社 熱硬化性樹脂組成物
JP5061939B2 (ja) 2008-02-18 2012-10-31 住友ベークライト株式会社 熱伝導性樹脂組成物、接着剤層、及びそれらを用いて作製した半導体装置。
JP4656340B2 (ja) 2008-03-03 2011-03-23 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP2009215362A (ja) 2008-03-07 2009-09-24 Momentive Performance Materials Inc 熱伝導性シリコーングリース組成物及びそれを用いた半導体装置
JP5047024B2 (ja) 2008-03-25 2012-10-10 三菱電機株式会社 熱伝導性樹脂組成物、熱伝導性樹脂シート及びパワーモジュール
US20090258963A1 (en) * 2008-04-10 2009-10-15 Freudenberg-Nok General Partnership Liquid acrylic elastomer
KR101505237B1 (ko) 2008-04-30 2015-03-23 덴키 가가쿠 고교 가부시기가이샤 알루미나 분말, 그의 제조 방법 및 그것을 사용한 수지 조성물
EP2291066B1 (en) 2008-05-23 2012-08-01 Hitachi Chemical Company, Ltd. Heat radiation sheet and heat radiation device
JP5507059B2 (ja) 2008-05-27 2014-05-28 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物および電子装置
JP4994305B2 (ja) 2008-06-03 2012-08-08 横浜ゴム株式会社 高熱伝導性エポキシ樹脂系組成物
JP5105308B2 (ja) 2008-06-04 2012-12-26 信越化学工業株式会社 低温加熱時における硬化速度を促進した熱伝導性シリコーン組成物
JP4993135B2 (ja) 2008-07-08 2012-08-08 信越化学工業株式会社 熱伝導性シリコーン組成物
JP2010050239A (ja) 2008-08-21 2010-03-04 Hitachi Ltd 放熱シート、それを用いた放熱用積層板及び半導体装置
JP2010053224A (ja) 2008-08-27 2010-03-11 Kyocera Chemical Corp 熱伝導性樹脂シート、熱伝導板、熱伝導性プリント配線板及び放熱部材
US8030619B2 (en) 2008-09-08 2011-10-04 Siemens Medical Solutions Usa, Inc. Radiation sensor array using conductive nanostructures
JP5316254B2 (ja) 2008-10-28 2013-10-16 日立化成株式会社 熱伝導シート、熱伝導シートの製造方法及び熱伝導シートを用いた放熱装置
JP2010171402A (ja) * 2008-12-24 2010-08-05 Nitto Denko Corp 熱硬化型ダイボンドフィルム
US8465666B2 (en) 2009-02-25 2013-06-18 Panasonic Corporation Thermoconductive composition, heat dissipating plate, heat dissipating substrate and circuit module using thermoconductive composition, and process for production of thermoconductive composition
JP2010229269A (ja) 2009-03-26 2010-10-14 Panasonic Electric Works Co Ltd 熱伝導性エポキシ樹脂シート材
JP5476826B2 (ja) 2009-07-14 2014-04-23 堺化学工業株式会社 酸化マグネシウム粒子、その製造方法、放熱性フィラー、樹脂組成物、放熱性グリース及び放熱性塗料組成物
JP2011021069A (ja) 2009-07-14 2011-02-03 Sakai Chem Ind Co Ltd 放熱性フィラー組成物、樹脂組成物、放熱性グリース及び放熱性塗料組成物
JP5476839B2 (ja) 2009-07-31 2014-04-23 住友ベークライト株式会社 樹脂組成物及び樹脂組成物を使用して作製した半導体装置
JP5373545B2 (ja) 2009-10-20 2013-12-18 信越化学工業株式会社 放熱用熱伝導性シリコーングリース組成物及びその使用方法
JP5499670B2 (ja) 2009-12-04 2014-05-21 トヨタ自動車株式会社 放熱用グリース組成物
JP5171798B2 (ja) 2009-12-07 2013-03-27 三菱電機株式会社 熱硬化性樹脂組成物、熱伝導性樹脂シート及びその製造方法、並びにパワーモジュール
JP5759191B2 (ja) * 2010-01-29 2015-08-05 日東電工株式会社 パワーモジュール
US20110262728A1 (en) 2010-01-29 2011-10-27 Nitto Denko Corporation Thermal conductive sheet, light-emitting diode mounting substrate, and thermal conductive adhesive sheet
JP5552883B2 (ja) 2010-04-26 2014-07-16 堺化学工業株式会社 低導電性酸化亜鉛粒子、放熱性フィラー、放熱性樹脂組成物、放熱性グリース、放熱性塗料組成物及び低導電性酸化亜鉛粒子の製造方法
JP5516034B2 (ja) 2010-04-30 2014-06-11 日立化成株式会社 絶縁性の高い熱伝導シート及びこれを用いた放熱装置
JP5392178B2 (ja) 2010-05-13 2014-01-22 日立化成株式会社 高熱伝導性複合粒子及びそれを用いた放熱材料
JP2012015273A (ja) 2010-06-30 2012-01-19 Hitachi Chem Co Ltd 熱伝導シート、熱伝導シートの製造方法、及び熱伝導シートを用いた放熱装置
JP5308409B2 (ja) 2010-07-27 2013-10-09 パナソニック株式会社 電子部品封止用シート状エポキシ樹脂組成物材料の製造方法と電子部品
JP2012054511A (ja) 2010-09-03 2012-03-15 Sekisui Chem Co Ltd 熱伝導シート、熱伝導シートの製造方法及び積層構造体
JPWO2012039324A1 (ja) * 2010-09-22 2014-02-03 日立化成株式会社 熱伝導性樹脂組成物、樹脂シート、樹脂付金属箔、樹脂シート硬化物及び放熱部材
JP5472055B2 (ja) 2010-11-19 2014-04-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP5542280B2 (ja) 2010-11-24 2014-07-09 トヨタ自動車株式会社 放熱グリース組成物
JP2012136575A (ja) 2010-12-24 2012-07-19 Daicel Corp 導電性放熱フィルム及びその製造方法
JP2012144638A (ja) 2011-01-12 2012-08-02 Daicel Corp 絶縁性放熱フィルム及びその製造方法
JP5795168B2 (ja) 2011-02-07 2015-10-14 明和化成株式会社 熱伝導性樹脂組成物及び半導体パッケージ
JP2012224711A (ja) 2011-04-18 2012-11-15 Daicel Corp 絶縁性放熱フィルム及びその製造方法
JP2012224758A (ja) 2011-04-20 2012-11-15 Panasonic Corp エポキシ樹脂組成物及び半導体装置
JP5815292B2 (ja) 2011-06-03 2015-11-17 タキロン株式会社 熱伝導性軟質エポキシ樹脂シート及びそれを用いた放熱構造
JP2012052137A (ja) 2011-11-28 2012-03-15 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーングリース組成物
JP2015088593A (ja) * 2013-10-30 2015-05-07 日東電工株式会社 通信モジュール
WO2015127179A1 (en) * 2014-02-24 2015-08-27 Henkel IP & Holding GmbH Thermally conductive pre-applied underfill formulations and uses thereof
KR101474690B1 (ko) * 2014-04-24 2014-12-17 주식회사 동부하이텍 반도체 소자들을 패키징하는 방법 및 이를 수행하기 위한 장치
KR102286337B1 (ko) * 2014-10-17 2021-08-04 쓰리엠 이노베이티브 프로퍼티즈 컴파니 전자파 차폐 구조물과 방열패드 및 이들을 포함하는 전자회로기판 조립체
JP6119832B2 (ja) * 2015-12-04 2017-04-26 住友ベークライト株式会社 半導体装置
TW201809128A (zh) * 2016-06-16 2018-03-16 信越化學工業股份有限公司 環氧樹脂組成物

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