CN1095173C - 刚/柔性印刷电路板及其制造方法 - Google Patents

刚/柔性印刷电路板及其制造方法 Download PDF

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Publication number
CN1095173C
CN1095173C CN99807042A CN99807042A CN1095173C CN 1095173 C CN1095173 C CN 1095173C CN 99807042 A CN99807042 A CN 99807042A CN 99807042 A CN99807042 A CN 99807042A CN 1095173 C CN1095173 C CN 1095173C
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CN
China
Prior art keywords
flexible
circuit board
layer
copper
rigid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN99807042A
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English (en)
Chinese (zh)
Other versions
CN1304535A (zh
Inventor
达里尔·麦肯尼
阿瑟·德马绍
克雷格·威尔逊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Parlex Corp
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Parlex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Parlex Corp filed Critical Parlex Corp
Publication of CN1304535A publication Critical patent/CN1304535A/zh
Application granted granted Critical
Publication of CN1095173C publication Critical patent/CN1095173C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Structure Of Printed Boards (AREA)
CN99807042A 1998-06-05 1999-06-02 刚/柔性印刷电路板及其制造方法 Expired - Fee Related CN1095173C (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US8828298P 1998-06-05 1998-06-05
US60/088,282 1998-06-05
US09/304,916 US6099745A (en) 1998-06-05 1999-05-04 Rigid/flex printed circuit board and manufacturing method therefor
US09/304,916 1999-05-04

Publications (2)

Publication Number Publication Date
CN1304535A CN1304535A (zh) 2001-07-18
CN1095173C true CN1095173C (zh) 2002-11-27

Family

ID=26778507

Family Applications (1)

Application Number Title Priority Date Filing Date
CN99807042A Expired - Fee Related CN1095173C (zh) 1998-06-05 1999-06-02 刚/柔性印刷电路板及其制造方法

Country Status (7)

Country Link
US (1) US6099745A (enExample)
EP (1) EP1084498A1 (enExample)
JP (1) JP2002517898A (enExample)
KR (1) KR20010071409A (enExample)
CN (1) CN1095173C (enExample)
TW (1) TW456162B (enExample)
WO (1) WO1999063552A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100559920C (zh) * 2006-10-24 2009-11-11 揖斐电株式会社 刚挠性线路板
CN1939104B (zh) * 2004-04-09 2010-04-07 大日本印刷株式会社 刚性-柔性板及其制造方法
CN101098583B (zh) * 2006-06-30 2010-06-02 日本梅克特隆株式会社 柔性印刷配线板
CN101583237B (zh) * 2008-05-12 2011-06-08 富士通株式会社 多层印刷线路板、电子设备及电子设备的制造方法

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KR100278609B1 (ko) * 1998-10-08 2001-01-15 윤종용 인쇄회로기판
JP2002246748A (ja) * 2001-02-16 2002-08-30 Nippon Mektron Ltd フレキシブルプリント基板およびその製造方法
JP3788917B2 (ja) * 2001-04-02 2006-06-21 日東電工株式会社 フレキシブル多層配線回路基板の製造方法
US6483037B1 (en) * 2001-11-13 2002-11-19 Motorola, Inc. Multilayer flexible FR4 circuit
US6808866B2 (en) * 2002-05-01 2004-10-26 Mektec Corporation Process for massively producing tape type flexible printed circuits
US7371970B2 (en) * 2002-12-06 2008-05-13 Flammer Jeffrey D Rigid-flex circuit board system
KR100511965B1 (ko) * 2002-12-13 2005-09-02 엘지전자 주식회사 테이프기판의 주석도금방법
US20050092519A1 (en) * 2003-11-05 2005-05-05 Beauchamp John K. Partially flexible circuit board
US7189929B2 (en) * 2004-01-16 2007-03-13 Hewlett-Packard Development Company, L.P. Flexible circuit with cover layer
US6927344B1 (en) 2004-02-27 2005-08-09 Motorola, Inc. Flexible circuit board assembly
KR100594299B1 (ko) * 2004-10-29 2006-06-30 삼성전자주식회사 유연성 인쇄 회로 및 이것이 구비된 하드 디스크 드라이브
JP4064988B2 (ja) * 2005-02-25 2008-03-19 三星電機株式会社 リジッドフレキシブルプリント回路基板およびその製造方法
JP2007053212A (ja) * 2005-08-17 2007-03-01 Denso Corp 回路基板の製造方法
JP2007067244A (ja) * 2005-08-31 2007-03-15 Sony Corp 回路基板
JP3993211B2 (ja) * 2005-11-18 2007-10-17 シャープ株式会社 多層プリント配線板およびその製造方法
US7867169B2 (en) * 2005-12-02 2011-01-11 Abbott Cardiovascular Systems Inc. Echogenic needle catheter configured to produce an improved ultrasound image
US20070149001A1 (en) * 2005-12-22 2007-06-28 Uka Harshad K Flexible circuit
KR100752660B1 (ko) * 2006-03-31 2007-08-29 삼성전자주식회사 가요성 인쇄회로 및 이를 구비한 하드디스크 드라이브
US7794402B2 (en) * 2006-05-15 2010-09-14 Advanced Cardiovascular Systems, Inc. Echogenic needle catheter configured to produce an improved ultrasound image
EP2071907B1 (en) 2006-09-21 2014-01-22 Daisho Denshi Co. Ltd. Flex-rigid printed circuit board, and method for manufacturing the flex-rigid printed circuit board
CN101631424B (zh) * 2006-10-24 2013-07-03 揖斐电株式会社 刚挠性线路板及其制造方法
KR100809608B1 (ko) 2006-12-15 2008-03-04 삼성전자주식회사 신호 왜곡을 줄일 수 있는 연결 구조체
WO2008102795A1 (ja) * 2007-02-20 2008-08-28 Hitachi Chemical Company, Ltd. フレキシブル多層配線板
JP2009272444A (ja) * 2008-05-08 2009-11-19 Sony Chemical & Information Device Corp フレックスリジッド配線基板とその製造方法
JP5422921B2 (ja) * 2008-05-28 2014-02-19 デクセリアルズ株式会社 接着フィルム
CN101610645B (zh) * 2008-06-17 2012-03-21 欣兴电子股份有限公司 软硬板的制作方法
US7942999B2 (en) * 2008-08-22 2011-05-17 Unimicron Technology Corp. Fabrication method of rigid-flex circuit board
KR20100095033A (ko) * 2008-08-29 2010-08-27 이비덴 가부시키가이샤 플렉스 리지드 배선판 및 전자 디바이스
DE102008052244A1 (de) * 2008-10-18 2010-04-22 Carl Freudenberg Kg Flexible Leiterplatte
KR101044200B1 (ko) * 2009-09-25 2011-06-28 삼성전기주식회사 리지드-플렉서블 회로기판 및 그 제조방법
CN102340937B (zh) * 2010-07-22 2013-06-12 富葵精密组件(深圳)有限公司 柔性多层电路板的制作方法
WO2012030299A1 (en) 2010-09-03 2012-03-08 Jsb Tech Private Limited A rigid-flex circuit board and manufacturing method
US20120325524A1 (en) * 2011-06-23 2012-12-27 Ibiden Co., Ltd. Flex-rigid wiring board and method for manufacturing the same
CN102523683B (zh) * 2011-11-16 2014-11-26 深圳崇达多层线路板有限公司 一种刚挠结合板及其制作方法
CN103635006B (zh) * 2012-08-23 2016-09-28 富葵精密组件(深圳)有限公司 电路板及其制作方法
KR101462724B1 (ko) * 2012-09-27 2014-11-17 삼성전기주식회사 리지드 플렉시블 인쇄회로기판 제조방법
US9560748B2 (en) 2013-01-04 2017-01-31 Bose Corporation Flexible printed circuit
KR102051803B1 (ko) 2013-07-29 2020-01-09 삼성디스플레이 주식회사 접이식 표시 장치
US9554465B1 (en) 2013-08-27 2017-01-24 Flextronics Ap, Llc Stretchable conductor design and methods of making
KR102067148B1 (ko) 2013-09-30 2020-01-17 삼성디스플레이 주식회사 표시 장치
US9338915B1 (en) 2013-12-09 2016-05-10 Flextronics Ap, Llc Method of attaching electronic module on fabrics by stitching plated through holes
US9521748B1 (en) * 2013-12-09 2016-12-13 Multek Technologies, Ltd. Mechanical measures to limit stress and strain in deformable electronics
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JP6439636B2 (ja) * 2015-09-10 2018-12-19 株式会社デンソー プリント基板の製造方法
JP6168258B1 (ja) * 2015-09-25 2017-07-26 株式会社村田製作所 アンテナモジュールおよび電子機器
CN105338733A (zh) * 2015-09-30 2016-02-17 安徽省大富光电科技有限公司 一种图形导电材料、电子设备
CN105722314B (zh) * 2016-04-20 2019-04-16 高德（无锡）电子有限公司 一种防盖板断裂的软硬结合板及其开盖打切片工艺
CN107484323B (zh) * 2016-06-07 2019-09-20 鹏鼎控股(深圳)股份有限公司 多层柔性电路板及其制作方法
TWI582704B (zh) * 2016-08-05 2017-05-11 Primax Electronics Ltd 組裝指紋辨識模組之方法
CN107818884A (zh) * 2016-09-13 2018-03-20 光宝电子(广州)有限公司 直下式发光键盘
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CN110545636B (zh) * 2018-05-29 2022-02-22 鹏鼎控股(深圳)股份有限公司 电路板及其制作方法
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CN110446371A (zh) * 2019-09-05 2019-11-12 高德（江苏）电子科技有限公司 一种软硬结合板使用纯胶半压的加工方法
CN110795874A (zh) * 2019-09-30 2020-02-14 武汉大学 一种用于柔性电路板制造工艺过程的数字孪生模型
CN113973420B (zh) * 2020-07-22 2024-05-31 庆鼎精密电子（淮安）有限公司 软硬结合板及软硬结合板的制作方法
CN112105175B (zh) * 2020-11-09 2021-02-19 广东科翔电子科技股份有限公司 一种具有空气腔的不对称多层刚挠结合板的工艺方法
KR20220108846A (ko) * 2021-01-27 2022-08-04 삼성디스플레이 주식회사 표시 장치
CN113133229A (zh) * 2021-04-13 2021-07-16 深圳市三维电路科技有限公司 一种多层软硬结合线路板的加工方法
CN117616557A (zh) * 2021-11-17 2024-02-27 华为技术有限公司 一种刚柔电路板、电路板组件和电子设备
TWI808614B (zh) * 2022-01-17 2023-07-11 大陸商廣東則成科技有限公司 軟硬複合板的製程
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Publication number Priority date Publication date Assignee Title
CN1939104B (zh) * 2004-04-09 2010-04-07 大日本印刷株式会社 刚性-柔性板及其制造方法
CN101098583B (zh) * 2006-06-30 2010-06-02 日本梅克特隆株式会社 柔性印刷配线板
CN100559920C (zh) * 2006-10-24 2009-11-11 揖斐电株式会社 刚挠性线路板
CN101583237B (zh) * 2008-05-12 2011-06-08 富士通株式会社 多层印刷线路板、电子设备及电子设备的制造方法

Also Published As

Publication number Publication date
EP1084498A1 (en) 2001-03-21
CN1304535A (zh) 2001-07-18
JP2002517898A (ja) 2002-06-18
WO1999063552A1 (en) 1999-12-09
KR20010071409A (ko) 2001-07-28
TW456162B (en) 2001-09-21
US6099745A (en) 2000-08-08

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Granted publication date: 20021127