JP2002517898A - 剛直性／可撓性プリント回路基板及びその製造方法 - Google Patents

剛直性／可撓性プリント回路基板及びその製造方法

Info

Publication number
JP2002517898A
JP2002517898A JP2000552686A JP2000552686A JP2002517898A JP 2002517898 A JP2002517898 A JP 2002517898A JP 2000552686 A JP2000552686 A JP 2000552686A JP 2000552686 A JP2000552686 A JP 2000552686A JP 2002517898 A JP2002517898 A JP 2002517898A
Authority
JP
Japan
Prior art keywords
circuit board
flexible
rigid
protective barrier
barrier material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2000552686A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002517898A5 (enExample
Inventor
マッケンネイ，ダリル
デマソ，アーサー
ウィルソン，クライグ
Original Assignee
パーレックス コーポレイション
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パーレックス コーポレイション filed Critical パーレックス コーポレイション
Publication of JP2002517898A publication Critical patent/JP2002517898A/ja
Publication of JP2002517898A5 publication Critical patent/JP2002517898A5/ja
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Electric Cables (AREA)
JP2000552686A 1998-06-05 1999-06-02 剛直性／可撓性プリント回路基板及びその製造方法 Ceased JP2002517898A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US8828298P 1998-06-05 1998-06-05
US60/088,282 1998-06-05
US09/304,916 US6099745A (en) 1998-06-05 1999-05-04 Rigid/flex printed circuit board and manufacturing method therefor
US09/304,916 1999-05-04
PCT/US1999/012226 WO1999063552A1 (en) 1998-06-05 1999-06-02 Rigid/flex printed circuit board and manufacturing method therefor

Publications (2)

Publication Number Publication Date
JP2002517898A true JP2002517898A (ja) 2002-06-18
JP2002517898A5 JP2002517898A5 (enExample) 2006-07-20

Family

ID=26778507

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000552686A Ceased JP2002517898A (ja) 1998-06-05 1999-06-02 剛直性／可撓性プリント回路基板及びその製造方法

Country Status (7)

Country Link
US (1) US6099745A (enExample)
EP (1) EP1084498A1 (enExample)
JP (1) JP2002517898A (enExample)
KR (1) KR20010071409A (enExample)
CN (1) CN1095173C (enExample)
TW (1) TW456162B (enExample)
WO (1) WO1999063552A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009136603A1 (ja) * 2008-05-08 2009-11-12 ソニーケミカル＆インフォメーションデバイス株式会社 フレックスリジッド配線基板とその製造方法
US8102660B2 (en) 2008-05-12 2012-01-24 Fujitsu Limited Multi-layer printed wiring board, electronic device, and fabrication method of electronic device
US11229118B2 (en) 2018-11-14 2022-01-18 Samsung Electro-Mechanics Co., Ltd. Printed circuit board

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KR100278609B1 (ko) * 1998-10-08 2001-01-15 윤종용 인쇄회로기판
JP2002246748A (ja) * 2001-02-16 2002-08-30 Nippon Mektron Ltd フレキシブルプリント基板およびその製造方法
JP3788917B2 (ja) * 2001-04-02 2006-06-21 日東電工株式会社 フレキシブル多層配線回路基板の製造方法
US6483037B1 (en) * 2001-11-13 2002-11-19 Motorola, Inc. Multilayer flexible FR4 circuit
US6808866B2 (en) * 2002-05-01 2004-10-26 Mektec Corporation Process for massively producing tape type flexible printed circuits
US7371970B2 (en) * 2002-12-06 2008-05-13 Flammer Jeffrey D Rigid-flex circuit board system
KR100511965B1 (ko) * 2002-12-13 2005-09-02 엘지전자 주식회사 테이프기판의 주석도금방법
US20050092519A1 (en) * 2003-11-05 2005-05-05 Beauchamp John K. Partially flexible circuit board
US7189929B2 (en) * 2004-01-16 2007-03-13 Hewlett-Packard Development Company, L.P. Flexible circuit with cover layer
US6927344B1 (en) 2004-02-27 2005-08-09 Motorola, Inc. Flexible circuit board assembly
JP4574288B2 (ja) * 2004-04-09 2010-11-04 大日本印刷株式会社 リジッド−フレキシブル基板の製造方法
KR100594299B1 (ko) * 2004-10-29 2006-06-30 삼성전자주식회사 유연성 인쇄 회로 및 이것이 구비된 하드 디스크 드라이브
JP4064988B2 (ja) * 2005-02-25 2008-03-19 三星電機株式会社 リジッドフレキシブルプリント回路基板およびその製造方法
JP2007053212A (ja) * 2005-08-17 2007-03-01 Denso Corp 回路基板の製造方法
JP2007067244A (ja) * 2005-08-31 2007-03-15 Sony Corp 回路基板
JP3993211B2 (ja) * 2005-11-18 2007-10-17 シャープ株式会社 多層プリント配線板およびその製造方法
US7867169B2 (en) * 2005-12-02 2011-01-11 Abbott Cardiovascular Systems Inc. Echogenic needle catheter configured to produce an improved ultrasound image
US20070149001A1 (en) * 2005-12-22 2007-06-28 Uka Harshad K Flexible circuit
KR100752660B1 (ko) * 2006-03-31 2007-08-29 삼성전자주식회사 가요성 인쇄회로 및 이를 구비한 하드디스크 드라이브
US7794402B2 (en) * 2006-05-15 2010-09-14 Advanced Cardiovascular Systems, Inc. Echogenic needle catheter configured to produce an improved ultrasound image
JP4901332B2 (ja) * 2006-06-30 2012-03-21 日本メクトロン株式会社 フレキシブルプリント配線板
EP2071907B1 (en) 2006-09-21 2014-01-22 Daisho Denshi Co. Ltd. Flex-rigid printed circuit board, and method for manufacturing the flex-rigid printed circuit board
CN101631424B (zh) * 2006-10-24 2013-07-03 揖斐电株式会社 刚挠性线路板及其制造方法
EP2268112B1 (en) * 2006-10-24 2012-08-22 Ibiden Co., Ltd. Method of manufacturing a flex-rigid wiring board
KR100809608B1 (ko) 2006-12-15 2008-03-04 삼성전자주식회사 신호 왜곡을 줄일 수 있는 연결 구조체
CN101617575B (zh) * 2007-02-20 2011-06-22 日立化成工业株式会社 挠性多层配线板
JP5422921B2 (ja) * 2008-05-28 2014-02-19 デクセリアルズ株式会社 接着フィルム
CN101610645B (zh) * 2008-06-17 2012-03-21 欣兴电子股份有限公司 软硬板的制作方法
US7942999B2 (en) * 2008-08-22 2011-05-17 Unimicron Technology Corp. Fabrication method of rigid-flex circuit board
KR20100095033A (ko) * 2008-08-29 2010-08-27 이비덴 가부시키가이샤 플렉스 리지드 배선판 및 전자 디바이스
DE102008052244A1 (de) * 2008-10-18 2010-04-22 Carl Freudenberg Kg Flexible Leiterplatte
KR101044200B1 (ko) * 2009-09-25 2011-06-28 삼성전기주식회사 리지드-플렉서블 회로기판 및 그 제조방법
CN102340937B (zh) * 2010-07-22 2013-06-12 富葵精密组件(深圳)有限公司 柔性多层电路板的制作方法
WO2012030299A1 (en) 2010-09-03 2012-03-08 Jsb Tech Private Limited A rigid-flex circuit board and manufacturing method
US20120325524A1 (en) * 2011-06-23 2012-12-27 Ibiden Co., Ltd. Flex-rigid wiring board and method for manufacturing the same
CN102523683B (zh) * 2011-11-16 2014-11-26 深圳崇达多层线路板有限公司 一种刚挠结合板及其制作方法
CN103635006B (zh) * 2012-08-23 2016-09-28 富葵精密组件(深圳)有限公司 电路板及其制作方法
KR101462724B1 (ko) * 2012-09-27 2014-11-17 삼성전기주식회사 리지드 플렉시블 인쇄회로기판 제조방법
US9560748B2 (en) 2013-01-04 2017-01-31 Bose Corporation Flexible printed circuit
KR102051803B1 (ko) 2013-07-29 2020-01-09 삼성디스플레이 주식회사 접이식 표시 장치
US9554465B1 (en) 2013-08-27 2017-01-24 Flextronics Ap, Llc Stretchable conductor design and methods of making
KR102067148B1 (ko) 2013-09-30 2020-01-17 삼성디스플레이 주식회사 표시 장치
US9521748B1 (en) * 2013-12-09 2016-12-13 Multek Technologies, Ltd. Mechanical measures to limit stress and strain in deformable electronics
US9338915B1 (en) 2013-12-09 2016-05-10 Flextronics Ap, Llc Method of attaching electronic module on fabrics by stitching plated through holes
KR101666476B1 (ko) 2015-08-17 2016-10-25 두두테크 주식회사 차량용 전자제어 라이닝 다층 인쇄회로기판의 제조 방법
JP6439636B2 (ja) * 2015-09-10 2018-12-19 株式会社デンソー プリント基板の製造方法
WO2017051649A1 (ja) * 2015-09-25 2017-03-30 株式会社村田製作所 アンテナモジュールおよび電子機器
CN105338733A (zh) * 2015-09-30 2016-02-17 安徽省大富光电科技有限公司 一种图形导电材料、电子设备
CN105722314B (zh) * 2016-04-20 2019-04-16 高德（无锡）电子有限公司 一种防盖板断裂的软硬结合板及其开盖打切片工艺
CN107484323B (zh) * 2016-06-07 2019-09-20 鹏鼎控股(深圳)股份有限公司 多层柔性电路板及其制作方法
TWI582704B (zh) * 2016-08-05 2017-05-11 Primax Electronics Ltd 組裝指紋辨識模組之方法
CN107818884A (zh) * 2016-09-13 2018-03-20 光宝电子(广州)有限公司 直下式发光键盘
US10420208B2 (en) * 2017-09-06 2019-09-17 Microsoft Technology Licensing, Llc Metal layering construction in flex/rigid-flex printed circuits
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CN110545636B (zh) * 2018-05-29 2022-02-22 鹏鼎控股(深圳)股份有限公司 电路板及其制作方法
CN110446371A (zh) * 2019-09-05 2019-11-12 高德（江苏）电子科技有限公司 一种软硬结合板使用纯胶半压的加工方法
CN110795874A (zh) * 2019-09-30 2020-02-14 武汉大学 一种用于柔性电路板制造工艺过程的数字孪生模型
CN113973420B (zh) * 2020-07-22 2024-05-31 庆鼎精密电子（淮安）有限公司 软硬结合板及软硬结合板的制作方法
CN112105175B (zh) * 2020-11-09 2021-02-19 广东科翔电子科技股份有限公司 一种具有空气腔的不对称多层刚挠结合板的工艺方法
KR20220108846A (ko) * 2021-01-27 2022-08-04 삼성디스플레이 주식회사 표시 장치
CN113133229A (zh) * 2021-04-13 2021-07-16 深圳市三维电路科技有限公司 一种多层软硬结合线路板的加工方法
CN117616557A (zh) * 2021-11-17 2024-02-27 华为技术有限公司 一种刚柔电路板、电路板组件和电子设备
TWI808614B (zh) * 2022-01-17 2023-07-11 大陸商廣東則成科技有限公司 軟硬複合板的製程
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Publication number Priority date Publication date Assignee Title
WO2009136603A1 (ja) * 2008-05-08 2009-11-12 ソニーケミカル＆インフォメーションデバイス株式会社 フレックスリジッド配線基板とその製造方法
US8102660B2 (en) 2008-05-12 2012-01-24 Fujitsu Limited Multi-layer printed wiring board, electronic device, and fabrication method of electronic device
US11229118B2 (en) 2018-11-14 2022-01-18 Samsung Electro-Mechanics Co., Ltd. Printed circuit board

Also Published As

Publication number Publication date
CN1304535A (zh) 2001-07-18
CN1095173C (zh) 2002-11-27
WO1999063552A1 (en) 1999-12-09
TW456162B (en) 2001-09-21
US6099745A (en) 2000-08-08
EP1084498A1 (en) 2001-03-21
KR20010071409A (ko) 2001-07-28

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