WO2009136603A1 - フレックスリジッド配線基板とその製造方法 - Google Patents
フレックスリジッド配線基板とその製造方法 Download PDFInfo
- Publication number
- WO2009136603A1 WO2009136603A1 PCT/JP2009/058565 JP2009058565W WO2009136603A1 WO 2009136603 A1 WO2009136603 A1 WO 2009136603A1 JP 2009058565 W JP2009058565 W JP 2009058565W WO 2009136603 A1 WO2009136603 A1 WO 2009136603A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- rigid
- flex
- wiring board
- manufacturing
- flexible
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1388—Temporary protective conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
Definitions
- the present invention relates to a flex-rigid wiring board having a flexible cable portion integrally extended from a mounting portion on which various electronic circuits are formed, and a method for manufacturing the same.
- a flexible wiring board having a structure in which a necessary wiring pattern is formed on the surface of an insulating film is used in various apparatuses.
- a flex-rigid wiring board in which a flexible cable portion is extended from a rigid mounting portion on which an electronic circuit is formed has been widely used in various electronic devices.
- the flex-rigid wiring board 2 includes a flexible part A in which a cable is wired inside and a rigid part B on which a circuit or an electronic device is mounted.
- the flexible part A is rigidly formed from the flexible part A. It is constituted by a copper clad laminate 10 extending continuously from the part B.
- the copper clad laminate 10 is provided with copper foils 6 on both surfaces of a base film 4 that is a core substrate, and the copper foils 6 are etched to be patterned into a predetermined circuit pattern 8. Then, a coverlay film 12 is attached to the circuit pattern 8 on one side or both sides of the base film 4, and an insulating layer 14 such as a glass epoxy prepreg is laminated.
- the other circuit pattern 8 is also laminated with an insulating layer 15 such as a prepreg. Further, a copper foil 16 is further laminated on both surfaces, via holes 18 and through holes are formed, and the copper foil 16 is patterned into a predetermined circuit shape.
- a manufacturing method of this flex-rigid wiring board 2 is provided with a copper clad laminate 10 in which a copper foil 6 is bonded to both surfaces of a base film 4 such as polyimide.
- a predetermined resist is applied to 6, a predetermined circuit pattern is exposed to form a mask having a circuit pattern shape, and a circuit pattern 8 is formed by etching (FIG. 3B).
- the unnecessary copper foil 6 on one surface of the flexible portion A is also removed.
- a coverlay film 12 made of an insulating film such as polyimide is attached to the circuit pattern 8 on one surface, or the coverlay film 12 is attached to both sides of the base film 4.
- prepreg insulating layers 14 and 15 such as glass epoxy are attached to both surfaces of the rigid portion B, and a copper foil 16 is laminated on both outer surfaces thereof.
- a via hole 18 is formed at a predetermined position of the rigid portion B by a laser or the like, and other necessary through holes are formed by drilling or the like.
- a desmear treatment is performed by dipping in an alkaline chemical such as sodium permanganate to clean the inside. Further, the flex-rigid wiring board 2 is completed through necessary plating processes, resist coating, exposure, etching, and other processes.
- Patent Document 1 discloses a method for manufacturing a flex-rigid wiring board that prevents the coverlay film from being melted due to the desmear treatment of the via-hole resist layer of the flex-rigid wiring board.
- the manufacturing method includes a step of laminating an adhesive layer on which an opening having a size corresponding to the conductor wiring of the flexible cable portion is formed on the coverlay film, and an outer side of the peripheral edge of the opening formed in the adhesive layer.
- the present invention has been made in view of the above-described background art, and provides a flex-rigid wiring board capable of reliably protecting a resin vulnerable to chemicals without increasing the number of man-hours during the manufacturing process, and a method for manufacturing the same. With the goal.
- the present invention relates to a method for manufacturing a flex-rigid wiring board comprising a flexible part having an insulating layer such as polyimide and a conductor layer such as copper foil, and a rigid part integrally provided with the flexible part and having a circuit wiring layer.
- an intermediate processing step such as desmear treatment with a chemical solution having resin solubility is performed in a state where at least one surface of the insulating layer of the flexible portion is covered with the conductor layer. is there.
- the conductor layer covering the entire surface of the flexible part is removed.
- the conductor layer covering the entire surface of the flexible portion is removed by using the wiring layer forming step of the rigid portion.
- the present invention is a flex-rigid wiring board comprising a flexible part having an insulating layer and a conductor layer, and a rigid part integrally provided with the flexible part and having a circuit wiring layer, and the insulating layer of the flexible part
- This is a flex-rigid wiring board in which the entire surface of at least one of the above is covered with the conductor layer.
- the conductor layer covering the entire surface of at least one of the insulating layers is removed after the intermediate treatment step, and a conductor layer extending from the removed conductor layer is formed at the boundary between the flexible portion and the rigid portion. A part is extended in the rigid part.
- the resin film material can be reliably protected against chemical treatment during the manufacturing process of the flex-rigid wiring board without increasing the manufacturing process.
- the conductive foil for protection is removed by a subsequent existing process, the number of processes is not increased here either.
- the flex-rigid wiring board of the present invention is formed in a state in which the conductor layer has penetrated into the rigid part, and the flexible part is more reliably protected without penetrating the chemical solution from the boundary between the flexible part and the rigid part. .
- a flexible flexible part A and a rigid rigid part B on which electronic components are mounted are integrally formed continuously.
- a copper clad laminate 20 having a copper foil 26 as a conductor layer attached thereto is provided.
- a predetermined circuit pattern 28 in which a wiring layer made of copper foil is formed is formed, and a coverlay film 32, which is an insulating layer, is further laminated.
- the coverlay film 32 is made of, for example, polyimide, is thicker than the base film 24 by about 10 to several tens ⁇ m, and is fixed by thermocompression bonding or the like through an adhesive.
- a circuit pattern 28 such as a cable made of the copper foil 26 is formed, and the coverlay film 32 is exposed to the outside.
- a circuit pattern 40 made of a copper foil 36 is provided via an insulating layer 34 made of a prepreg such as glass epoxy.
- a predetermined circuit pattern 29 is formed on the rigid portion B by the copper foil 26.
- the copper foil 26 remains as it is until the middle of the intermediate process.
- the copper foil 26 on the entire surface is removed in a later step as will be described later.
- a circuit pattern 41 made of copper foil 36 is provided outside the insulating layer 35 of the rigid portion B, and a via hole 38 and a through hole (not shown) are formed so as to be connected to the lower circuit pattern 29.
- the coverlay film 32 may be laminated on both sides of the base film 24.
- a manufacturing method of the flex-rigid wiring board 22 is as follows. First, a copper clad laminate 10 in which a copper foil 26 serving as a conductor layer is attached to both surfaces of a base film 24 such as polyimide. Provide. Then, a predetermined resist is applied to the copper foil 26, a predetermined circuit pattern is exposed to form a circuit pattern-shaped mask, and circuit patterns 28 and 29 are formed from the copper foil 26 by etching (FIG. 1B). . At this time, as shown in FIG. 1B, the copper foil 26 on one surface of the flexible portion A is left over.
- a cover lay film 32 made of an insulating film such as polyimide is bonded to the circuit pattern 28 on one surface by thermocompression bonding. Furthermore, prepreg insulating layers 34 and 35 such as glass epoxy are bonded to both sides of the rigid portion B by pressure bonding, and a copper foil 36 is pressure bonded and laminated on both outer surfaces thereof. At this time, at the boundary between the rigid part B and the flexible part A, which is the end part of the insulating layer 35 of the prepreg, the edge part of the copper foil 26 remaining in the part that becomes the flexible part A bites into the rigid part B, and is insulated. Covered by layer 35.
- a via hole 38 is formed at a predetermined position of the rigid portion B by a laser or the like, and other necessary through holes are formed by drilling or the like.
- desmear treatment is performed by immersing them in an alkaline chemical such as sodium permanganate to clean the inside of the via holes 38 and roughen them. I do.
- copper plating is performed to form a conductor layer 42 by plating. As shown in FIG. 2E, copper is buried in the via hole 38 to connect the lower circuit pattern 29 and the copper foil 36.
- a predetermined resist is applied to the copper foil 36, a predetermined circuit pattern is exposed to form a circuit pattern-shaped mask, and circuit patterns 40 and 41 are formed from the copper foil 36 by etching (FIG. 2 (f)). .
- the copper foil 26 of the flexible part A and the copper-plated conductor layer 42 are also removed, but a part 26a of the copper foil extending from the copper foil 26 of the flexible part A remains in the rigid part B. Further, through a necessary process, the flex-rigid wiring board 22 is completed.
- the manufacturing process of the flex-rigid wiring board 22 does not substantially increase the manufacturing process, and the copper foil 26 on one side left without etching ensures In addition, damage to the base film 24 in the desmear process can be prevented. Moreover, the remaining copper foil 26 is simultaneously removed by etching when forming the circuit patterns 40 and 41 to be formed later, and there is no increase in man-hours in the manufacturing process. Furthermore, the flex-rigid wiring board 22 is formed in a state in which a part of the copper foil 26 has digged into the rigid part B, so that an alkaline chemical solution does not permeate from the boundary between the flexible part A and the rigid part B. Problems such as dissolution do not occur inside the part A. In addition, since the coverlay film 32 is thicker than the base film 24, the influence by a chemical
- the flex-rigid wiring board and the manufacturing method thereof according to the present invention are not limited to the above-described embodiment, and other materials may be used for each part, and the laminated structure may be different.
- the insulating material may be polyester or flexible glass epoxy material depending on the application
- the metal foil may be gold or aluminum other than copper foil, and has the same structure and process as the above embodiment. What is necessary is just to protect the resin layer leaving the metal foil of the flexible part.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
22 フレックスリジッド配線基板
24 ベースフィルム
34,35 絶縁層
26,36 銅箔
28,29,40,41 回路パターン
A フレキシブル部
B リジッド部
Claims (7)
- 絶縁層と導体層を備えたフレキシブル部と、このフレキシブル部と一体に設けられ回路の配線層を有したリジッド部から成るフレックスリジッド配線基板の製造方法において、
前記フレキシブル部の絶縁層の少なくとも一方の表面全面が前記導体層により覆われた状態で、樹脂溶解性を有する薬液による中間処理工程を行うことを特徴とするフレックスリジッド配線基板の製造方法。 - 前記中間処理工程は、前記リジッド部の絶縁層に孔あけを行う工程の後、前記絶縁層に形成された孔のデスミア処理である請求項1記載のフレックスリジッド配線基板の製造方法。
- 前記中間処理工程の後、前記孔を含む前記リジッド部にメッキにより導体層を形成する請求項2記載のフレックスリジッド配線基板の製造方法。
- 前記中間処理工程の後、前記フレキシブル部の全面を覆った導体層を除去する請求項3記載のフレックスリジッド配線基板の製造方法。
- 前記中間処理工程の後、前記リジッド部の前記配線層の形成工程を利用して、前記フレキシブル部の全面を覆った導体層を除去する請求項4記載のフレックスリジッド配線基板の製造方法。
- 絶縁層と導体層を備えたフレキシブル部と、このフレキシブル部と一体に設けられ回路の配線層を有したリジッド部から成るフレックスリジッド配線基板において、
前記フレキシブル部の絶縁層の少なくとも一方の表面全面が前記導体層により覆われていることを特徴とするフレックスリジッド配線基板。 - 前記絶縁層の少なくとも一方の表面全面を覆った前記導体層は、中間処理工程の後除去され、前記フレキシブル部と前記リジッド部のとの境界に、前記除去された導体層から延びた導体層の一部が、前記リジッド部内に位置している請求項6記載のフレックスリジッド配線基板。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/990,821 US20110056732A1 (en) | 2008-05-08 | 2009-05-01 | Flex-rigid wiring board and method for manufacturing the same |
CN2009801127079A CN101999257A (zh) | 2008-05-08 | 2009-05-01 | 刚柔结合电路板及其制造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008-121791 | 2008-05-08 | ||
JP2008121791A JP2009272444A (ja) | 2008-05-08 | 2008-05-08 | フレックスリジッド配線基板とその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009136603A1 true WO2009136603A1 (ja) | 2009-11-12 |
Family
ID=41264659
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2009/058565 WO2009136603A1 (ja) | 2008-05-08 | 2009-05-01 | フレックスリジッド配線基板とその製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20110056732A1 (ja) |
JP (1) | JP2009272444A (ja) |
KR (1) | KR20110003496A (ja) |
CN (1) | CN101999257A (ja) |
TW (1) | TW200950635A (ja) |
WO (1) | WO2009136603A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011084519A1 (de) * | 2011-10-14 | 2013-04-18 | Evonik Industries Ag | Verwendung einer Mehrschichtfolie für die Herstellung photovoltaischer Module |
JP5933996B2 (ja) * | 2012-03-09 | 2016-06-15 | 日本メクトロン株式会社 | 多層フレキシブル配線板の製造方法 |
KR101452076B1 (ko) | 2012-12-28 | 2014-10-16 | 삼성전기주식회사 | 무선 충전용 코일 및 이를 구비하는 무선 충전 장치 |
WO2015015975A1 (ja) * | 2013-07-30 | 2015-02-05 | 株式会社村田製作所 | 多層基板および多層基板の製造方法 |
KR20160014456A (ko) * | 2014-07-29 | 2016-02-11 | 삼성전기주식회사 | 연성 인쇄회로기판 및 그 제조 방법 |
CN110662369B (zh) * | 2018-06-28 | 2021-02-09 | 庆鼎精密电子(淮安)有限公司 | 电路板及其制作方法 |
CN112739017A (zh) * | 2020-12-11 | 2021-04-30 | 厦门市铂联科技股份有限公司 | 一种软硬结合线路板制作方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002111212A (ja) * | 2000-10-04 | 2002-04-12 | Nippon Mektron Ltd | 多層プリント基板の製造方法 |
JP2002517898A (ja) * | 1998-06-05 | 2002-06-18 | パーレックス コーポレイション | 剛直性/可撓性プリント回路基板及びその製造方法 |
JP2003115665A (ja) * | 2001-10-02 | 2003-04-18 | Nippon Mektron Ltd | プリント基板の製造方法 |
JP2005236205A (ja) * | 2004-02-23 | 2005-09-02 | Sharp Corp | 多層プリント配線板の製造方法及び多層プリント配線板 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1765161B (zh) * | 2003-04-18 | 2011-06-22 | 揖斐电株式会社 | 刚挠性电路板 |
US7729570B2 (en) * | 2007-05-18 | 2010-06-01 | Ibiden Co., Ltd. | Photoelectric circuit board and device for optical communication |
US8178789B2 (en) * | 2007-07-17 | 2012-05-15 | Ibiden Co., Ltd. | Wiring board and method of manufacturing wiring board |
-
2008
- 2008-05-08 JP JP2008121791A patent/JP2009272444A/ja active Pending
-
2009
- 2009-05-01 CN CN2009801127079A patent/CN101999257A/zh active Pending
- 2009-05-01 US US12/990,821 patent/US20110056732A1/en not_active Abandoned
- 2009-05-01 KR KR1020107023315A patent/KR20110003496A/ko not_active Application Discontinuation
- 2009-05-01 WO PCT/JP2009/058565 patent/WO2009136603A1/ja active Application Filing
- 2009-05-06 TW TW098114973A patent/TW200950635A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002517898A (ja) * | 1998-06-05 | 2002-06-18 | パーレックス コーポレイション | 剛直性/可撓性プリント回路基板及びその製造方法 |
JP2002111212A (ja) * | 2000-10-04 | 2002-04-12 | Nippon Mektron Ltd | 多層プリント基板の製造方法 |
JP2003115665A (ja) * | 2001-10-02 | 2003-04-18 | Nippon Mektron Ltd | プリント基板の製造方法 |
JP2005236205A (ja) * | 2004-02-23 | 2005-09-02 | Sharp Corp | 多層プリント配線板の製造方法及び多層プリント配線板 |
Also Published As
Publication number | Publication date |
---|---|
KR20110003496A (ko) | 2011-01-12 |
JP2009272444A (ja) | 2009-11-19 |
CN101999257A (zh) | 2011-03-30 |
TW200950635A (en) | 2009-12-01 |
US20110056732A1 (en) | 2011-03-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101156751B1 (ko) | 리지드 플렉서블 프린트 배선판 및 리지드 플렉서블 프린트배선판의 제조방법 | |
WO2009136603A1 (ja) | フレックスリジッド配線基板とその製造方法 | |
JP4520392B2 (ja) | プリント基板の製造方法 | |
WO2010013366A1 (ja) | フレックスリジッド配線板及びその製造方法 | |
JPWO2009069683A1 (ja) | 多層プリント配線板の製造方法 | |
US20160113120A1 (en) | Printed wiring board and method for manufacturing the same | |
WO2010140214A1 (ja) | 多層プリント配線板の製造方法 | |
JP2009231770A (ja) | 多層フレキシブルプリント配線板およびその製造方法 | |
US8604346B2 (en) | Flex-rigid wiring board and method for manufacturing the same | |
JP2006269979A (ja) | フレックスリジッドプリント配線板およびフレックスリジッドプリント配線板の製造方法 | |
US20080277146A1 (en) | Radiant heat printed circuit board and method of fabricating the same | |
KR20150075841A (ko) | 경연성 인쇄회로기판 및 그의 제조 방법 | |
TW201347639A (zh) | 多層配線基板之製造方法 | |
JP2005236205A (ja) | 多層プリント配線板の製造方法及び多層プリント配線板 | |
KR101229967B1 (ko) | 케이블부를 가지는 다층회로기판 및 그 제조방법 | |
JP2010278261A (ja) | 多層プリント配線板の製造方法 | |
KR100571726B1 (ko) | 리지드 플렉시블 인쇄회로기판의 제조방법 | |
JP2009176897A (ja) | 多層プリント配線板の製造方法、多層プリント配線板 | |
JP7389666B2 (ja) | リジッド・フレックス多層プリント配線板の製造方法 | |
JP2006073819A (ja) | プリント配線板及びプリント配線板の作製方法 | |
KR100704911B1 (ko) | 전자소자 내장형 인쇄회로기판 및 그 제조방법 | |
KR101720264B1 (ko) | 회로기판 제조방법 | |
CN111629513B (zh) | 同时具有贯孔及盲孔的多层电路板结构及其制法 | |
JP7390846B2 (ja) | リジッド・フレックス多層プリント配線板及びその製造方法 | |
KR101108816B1 (ko) | 다층 인쇄회로기판 및 이의 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200980112707.9 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 09742727 Country of ref document: EP Kind code of ref document: A1 |
|
DPE1 | Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101) | ||
ENP | Entry into the national phase |
Ref document number: 20107023315 Country of ref document: KR Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12990821 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 09742727 Country of ref document: EP Kind code of ref document: A1 |