CN108565329A - 发光元件封装体以及包括该发光元件封装体的背光单元 - Google Patents

发光元件封装体以及包括该发光元件封装体的背光单元 Download PDF

Info

Publication number
CN108565329A
CN108565329A CN201810540296.4A CN201810540296A CN108565329A CN 108565329 A CN108565329 A CN 108565329A CN 201810540296 A CN201810540296 A CN 201810540296A CN 108565329 A CN108565329 A CN 108565329A
Authority
CN
China
Prior art keywords
light
moulding compound
package body
emitting element
element package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810540296.4A
Other languages
English (en)
Chinese (zh)
Inventor
吴承炫
金平国
李承训
闵天基
林静亚
任峻亨
郑喆熏
郑普贤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Co Ltd's Lumen This
Lumens Co Ltd
Original Assignee
Co Ltd's Lumen This
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020110120496A external-priority patent/KR101260855B1/ko
Priority claimed from KR1020120097844A external-priority patent/KR101348097B1/ko
Application filed by Co Ltd's Lumen This filed Critical Co Ltd's Lumen This
Publication of CN108565329A publication Critical patent/CN108565329A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G02B6/0031—Reflecting element, sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133614—Illuminating devices using photoluminescence, e.g. phosphors illuminated by UV or blue light
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Physics & Mathematics (AREA)
  • Planar Illumination Modules (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
CN201810540296.4A 2011-11-17 2012-11-16 发光元件封装体以及包括该发光元件封装体的背光单元 Pending CN108565329A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
KR10-2011-0120496 2011-11-17
KR1020110120496A KR101260855B1 (ko) 2011-11-17 2011-11-17 발광소자 패키지 및 이를 구비하는 백라이트 유닛
KR1020120097844A KR101348097B1 (ko) 2012-09-04 2012-09-04 발광소자 패키지
KR10-2012-0097844 2012-09-04
CN201280067097.7A CN104054189B (zh) 2011-11-17 2012-11-16 发光元件封装体以及包括该发光元件封装体的背光单元

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201280067097.7A Division CN104054189B (zh) 2011-11-17 2012-11-16 发光元件封装体以及包括该发光元件封装体的背光单元

Publications (1)

Publication Number Publication Date
CN108565329A true CN108565329A (zh) 2018-09-21

Family

ID=48430309

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201280067097.7A Active CN104054189B (zh) 2011-11-17 2012-11-16 发光元件封装体以及包括该发光元件封装体的背光单元
CN201810540296.4A Pending CN108565329A (zh) 2011-11-17 2012-11-16 发光元件封装体以及包括该发光元件封装体的背光单元

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201280067097.7A Active CN104054189B (zh) 2011-11-17 2012-11-16 发光元件封装体以及包括该发光元件封装体的背光单元

Country Status (6)

Country Link
US (3) USRE47444E1 (ko)
EP (2) EP3410498A1 (ko)
JP (2) JP5902823B2 (ko)
CN (2) CN104054189B (ko)
ES (1) ES2693677T3 (ko)
WO (1) WO2013073897A2 (ko)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101413596B1 (ko) * 2012-12-07 2014-07-02 주식회사 루멘스 발광장치 및 이를 구비하는 백라이트 유닛
JP6476567B2 (ja) * 2013-03-29 2019-03-06 日亜化学工業株式会社 発光装置
TWI506828B (zh) * 2013-11-20 2015-11-01 Lextar Electronics Corp 發光裝置
DE102013114345A1 (de) * 2013-12-18 2015-06-18 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements
EP3547379A1 (en) * 2014-03-14 2019-10-02 Citizen Electronics Co., Ltd. Light emitting apparatus
JP6459354B2 (ja) 2014-09-30 2019-01-30 日亜化学工業株式会社 透光部材及びその製造方法ならびに発光装置及びその製造方法
CN107004751B (zh) * 2014-11-28 2019-05-03 夏普株式会社 发光装置以及照明器具
KR102237155B1 (ko) * 2015-03-11 2021-04-07 엘지이노텍 주식회사 발광 소자 및 이를 구비한 라이트 유닛
JP6168096B2 (ja) * 2015-04-28 2017-07-26 日亜化学工業株式会社 発光装置、パッケージ及びそれらの製造方法
JP6590579B2 (ja) * 2015-08-03 2019-10-16 シチズン電子株式会社 Ｌｅｄ発光素子
DE102015116263A1 (de) 2015-09-25 2017-03-30 Osram Opto Semiconductors Gmbh Herstellung eines elektronischen Bauelements
JP2017130588A (ja) * 2016-01-21 2017-07-27 旭化成株式会社 紫外線発光装置
JP6790416B2 (ja) 2016-03-31 2020-11-25 日亜化学工業株式会社 発光装置
US10658558B2 (en) * 2017-10-10 2020-05-19 Lumileds Llc LED package including converter confinement
JP7399678B2 (ja) * 2019-10-28 2023-12-18 株式会社ダイセル 光半導体装置用樹脂成形体及び光半導体装置

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000156528A (ja) * 1998-11-19 2000-06-06 Sharp Corp 発光素子
CN1497742A (zh) * 2002-10-07 2004-05-19 ������������ʽ���� Led器件
JP2004288937A (ja) * 2003-03-24 2004-10-14 Kyocera Corp 発光素子収納用パッケージおよび発光装置
CN1630113A (zh) * 2003-12-17 2005-06-22 夏普株式会社 半导体发光器件
JP2005353816A (ja) * 2004-06-10 2005-12-22 Olympus Corp 発光デバイス、発光デバイスの製造方法、発光デバイスを用いた照明装置、及び、プロジェクタ
CN1770488A (zh) * 2004-09-29 2006-05-10 斯坦雷电气株式会社 半导体发光器件的制造方法
CN1900792A (zh) * 2005-07-19 2007-01-24 三星电机株式会社 侧光led封装和使用该侧光led封装的背光单元
KR20070056233A (ko) * 2005-11-29 2007-06-04 삼성전기주식회사 발광 다이오드 패키지
KR20070056230A (ko) * 2005-11-29 2007-06-04 삼성전기주식회사 발광소자용 반사부재 및 이를 사용한 발광다이오드 패키지
JP2007227480A (ja) * 2006-02-21 2007-09-06 Toshiba Corp 半導体発光装置
CN101147270A (zh) * 2005-03-24 2008-03-19 京瓷株式会社 发光元件收纳用封装、发光装置以及照明装置
CN101150164A (zh) * 2006-09-22 2008-03-26 株式会社东芝 光半导体器件和光半导体器件的制造方法
CN101535366A (zh) * 2006-11-15 2009-09-16 日立化成工业株式会社 光反射用热固化性树脂组合物及其制造方法、及使用了所述树脂组合物的光半导体元件搭载用基板及光半导体装置
TW201024598A (en) * 2008-12-25 2010-07-01 Au Optronics Corp Light emitting diode apparatus
US20100277925A1 (en) * 2009-04-30 2010-11-04 Chin Nyap Tan Lighting Structure with Multiple Reflective Surfaces
CN101981716A (zh) * 2008-11-25 2011-02-23 Lg伊诺特有限公司 发光器件封装
CN102163682A (zh) * 2010-01-28 2011-08-24 Lg伊诺特有限公司 发光器件封装

Family Cites Families (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3798195B2 (ja) * 1999-08-12 2006-07-19 ローム株式会社 チップ型発光装置
JP4125848B2 (ja) * 1999-12-17 2008-07-30 ローム株式会社 ケース付チップ型発光装置
US6729746B2 (en) * 2000-03-14 2004-05-04 Toyoda Gosei Co., Ltd. Light source device
DE10020465A1 (de) * 2000-04-26 2001-11-08 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement mit Lumineszenzkonversionselement
US20020085390A1 (en) * 2000-07-14 2002-07-04 Hironobu Kiyomoto Optical device and apparatus employing the same
US6949771B2 (en) * 2001-04-25 2005-09-27 Agilent Technologies, Inc. Light source
JP3891400B2 (ja) * 2001-07-25 2007-03-14 シチズン電子株式会社 発光ダイオード
JP3948650B2 (ja) * 2001-10-09 2007-07-25 アバゴ・テクノロジーズ・イーシービーユー・アイピー（シンガポール）プライベート・リミテッド 発光ダイオード及びその製造方法
ATE525755T1 (de) * 2001-10-12 2011-10-15 Nichia Corp Lichtemittierendes bauelement und verfahren zu seiner herstellung
US6791116B2 (en) * 2002-04-30 2004-09-14 Toyoda Gosei Co., Ltd. Light emitting diode
US7429757B2 (en) * 2002-06-19 2008-09-30 Sanken Electric Co., Ltd. Semiconductor light emitting device capable of increasing its brightness
JP4143732B2 (ja) * 2002-10-16 2008-09-03 スタンレー電気株式会社 車載用波長変換素子
KR101045507B1 (ko) * 2003-03-18 2011-06-30 스미토모 덴키 고교 가부시키가이샤 발광 소자 탑재용 부재 및 그것을 사용한 반도체 장치
CN100587560C (zh) * 2003-04-01 2010-02-03 夏普株式会社 发光装置用组件、发光装置、背侧光照射装置、显示装置
JP4070208B2 (ja) * 2003-04-21 2008-04-02 京セラ株式会社 発光素子収納用パッケージおよび発光装置
KR20040092512A (ko) * 2003-04-24 2004-11-04 (주)그래픽테크노재팬 방열 기능을 갖는 반사판이 구비된 반도체 발광장치
US20050133808A1 (en) * 2003-09-11 2005-06-23 Kyocera Corporation Package for housing light-emitting element, light-emitting apparatus and illumination apparatus
JP4888626B2 (ja) 2004-08-13 2012-02-29 株式会社フジクラ 発光ダイオードランプ
WO2006059828A1 (en) * 2004-09-10 2006-06-08 Seoul Semiconductor Co., Ltd. Light emitting diode package having multiple molding resins
JP4659421B2 (ja) * 2004-09-30 2011-03-30 株式会社トクヤマ 発光素子収納用パッケージの製造方法
JP2006128511A (ja) * 2004-10-29 2006-05-18 Ngk Spark Plug Co Ltd 発光素子用セラミック基板
JP2006186297A (ja) * 2004-12-03 2006-07-13 Toshiba Corp 半導体発光装置及びその製造方法
US8288942B2 (en) * 2004-12-28 2012-10-16 Cree, Inc. High efficacy white LED
TWI266079B (en) * 2005-01-10 2006-11-11 Shiu-Hua Huang Steering lens and light emitting system using the same
JP2006237049A (ja) * 2005-02-22 2006-09-07 Ngk Spark Plug Co Ltd 発光素子実装用配線基板
US8231251B2 (en) 2005-10-28 2012-07-31 Philips Lumileds Lighting Company Llc Multiple piece reflective angle transformer
US20100002455A1 (en) * 2005-11-24 2010-01-07 Yoichi Matsuoka Electronic Component Mounting Board and Method for Manufacturing Such Board
CN101852349B (zh) * 2005-12-22 2012-08-29 松下电器产业株式会社 具有led的照明器具
JP2007201420A (ja) * 2005-12-27 2007-08-09 Sharp Corp 半導体発光装置、半導体発光素子、および半導体発光装置の製造方法
US8044412B2 (en) * 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
JP2007305785A (ja) * 2006-05-11 2007-11-22 Nichia Chem Ind Ltd 発光装置
US7906794B2 (en) * 2006-07-05 2011-03-15 Koninklijke Philips Electronics N.V. Light emitting device package with frame and optically transmissive element
JP5205724B2 (ja) * 2006-08-04 2013-06-05 日亜化学工業株式会社 発光装置
CN101501875A (zh) * 2006-08-24 2009-08-05 夏普株式会社 发光元件、发光元件阵列、背光源单元和液晶显示装置
US8053799B2 (en) * 2006-09-29 2011-11-08 Seoul Semiconductor Co., Ltd. LED package
JP5168152B2 (ja) * 2006-12-28 2013-03-21 日亜化学工業株式会社 発光装置
JP2008186946A (ja) 2007-01-29 2008-08-14 Toshiba Corp 光半導体装置及びその製造方法
JP4205135B2 (ja) * 2007-03-13 2009-01-07 シャープ株式会社 半導体発光装置、半導体発光装置用多連リードフレーム
JP2008300544A (ja) 2007-05-30 2008-12-11 Sharp Corp 発光装置およびその製造方法
KR101374898B1 (ko) * 2007-09-28 2014-03-18 서울반도체 주식회사 계면 분리를 줄인 ｌｅｄ 패키지
JP5405731B2 (ja) * 2007-10-23 2014-02-05 日立コンシューマエレクトロニクス株式会社 光源モジュール
KR101104034B1 (ko) * 2007-12-06 2012-01-09 엘지이노텍 주식회사 발광다이오드, 발광장치 및 그 제조방법
KR101895831B1 (ko) * 2008-01-09 2018-09-07 히타치가세이가부시끼가이샤 열경화성 수지 조성물, 에폭시 수지 성형 재료 및 다가 카르복시산 축합체
US7923746B2 (en) * 2008-03-12 2011-04-12 Industrial Technology Research Institute Light emitting diode package structure and method for fabricating the same
US8324723B2 (en) * 2008-03-25 2012-12-04 Bridge Semiconductor Corporation Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump
KR20090104518A (ko) * 2008-03-31 2009-10-06 서울반도체 주식회사 프로젝션 시스템용 발광 다이오드 패키지
JP5320560B2 (ja) * 2008-05-20 2013-10-23 東芝ライテック株式会社 光源ユニット及び照明装置
JP5196551B2 (ja) * 2008-06-09 2013-05-15 Ｎｅｃライティング株式会社 発光装置
US8288785B2 (en) * 2008-12-03 2012-10-16 Seoul Semiconductor Co., Ltd. Lead frame having light-reflecting layer, light emitting diode having the lead frame, and backlight unit having the light emitting diode
JP5428358B2 (ja) * 2009-01-30 2014-02-26 ソニー株式会社 光学素子パッケージの製造方法
KR20110007633A (ko) 2009-07-09 2011-01-25 (주) 아모엘이디 엘이디 패키지
DE102009033287A1 (de) 2009-07-15 2011-01-20 Osram Opto Semiconductors Gmbh Leuchtdiode und Verfahren zur Herstellung einer Leuchtdiode
JP5139519B2 (ja) * 2009-09-01 2013-02-06 株式会社東芝 半導体発光素子及び半導体発光装置
CN102484189B (zh) * 2009-10-29 2015-04-22 京瓷株式会社 发光装置
CN106449937B (zh) * 2009-10-29 2020-11-03 日亚化学工业株式会社 发光装置及其制造方法
KR101064090B1 (ko) * 2009-11-17 2011-09-08 엘지이노텍 주식회사 발광소자 패키지
DE102009058421A1 (de) 2009-12-16 2011-06-22 OSRAM Opto Semiconductors GmbH, 93055 Verfahren zur Herstellung eines Gehäuses für ein optoelektronisches Halbleiterbauteil, Gehäuse und optoelektronisches Halbleiterbauteil
JP2011171365A (ja) 2010-02-16 2011-09-01 Panasonic Corp 半導体発光モジュール、光源装置、および液晶表示装置
KR101637581B1 (ko) * 2010-03-09 2016-07-07 엘지이노텍 주식회사 발광 소자 패키지 및 그 제조방법
JP5370232B2 (ja) 2010-03-25 2013-12-18 豊田合成株式会社 Ｌｅｄパッケージの製造方法
KR101090991B1 (ko) 2010-04-07 2011-12-08 (주) 아모엘이디 엘이디 패키지 및 이의 제조방법
US8354745B2 (en) * 2010-04-20 2013-01-15 Intellectual Discovery Co., Ltd. Electronic assembly
EP2557593A1 (en) * 2010-04-30 2013-02-13 Wavenics, Inc. Integrated-terminal-type metal base package module and a method for packaging an integrated terminal for a metal base package module
KR20110128693A (ko) * 2010-05-24 2011-11-30 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 라이트 유닛
JP5940775B2 (ja) * 2010-08-27 2016-06-29 ローム株式会社 液晶表示装置バックライト用ｌｅｄ光源装置および液晶表示装置
EP2613371B1 (en) * 2010-08-31 2019-04-24 Nichia Corporation Light emitting device and method for manufacturing same
WO2012049854A1 (ja) * 2010-10-14 2012-04-19 パナソニック株式会社 発光装置及びこれを用いた面光源装置
CN102544303A (zh) * 2010-12-21 2012-07-04 展晶科技(深圳)有限公司 发光二极管封装结构
US8569778B2 (en) * 2011-02-11 2013-10-29 Intellectual Discovery Co., Ltd. Narrow viewing angle plastic leaded chip carrier
KR101850431B1 (ko) * 2011-07-07 2018-05-31 엘지이노텍 주식회사 발광 모듈 및 이를 포함하는 조명 시스템
US9793456B2 (en) * 2011-09-30 2017-10-17 Kaneka Corporation Molded resin body for surface-mounted light-emitting device, manufacturing method thereof, and surface-mounted light-emitting device

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000156528A (ja) * 1998-11-19 2000-06-06 Sharp Corp 発光素子
CN1497742A (zh) * 2002-10-07 2004-05-19 ������������ʽ���� Led器件
JP2004288937A (ja) * 2003-03-24 2004-10-14 Kyocera Corp 発光素子収納用パッケージおよび発光装置
CN1630113A (zh) * 2003-12-17 2005-06-22 夏普株式会社 半导体发光器件
JP2005353816A (ja) * 2004-06-10 2005-12-22 Olympus Corp 発光デバイス、発光デバイスの製造方法、発光デバイスを用いた照明装置、及び、プロジェクタ
CN1770488A (zh) * 2004-09-29 2006-05-10 斯坦雷电气株式会社 半导体发光器件的制造方法
CN101147270A (zh) * 2005-03-24 2008-03-19 京瓷株式会社 发光元件收纳用封装、发光装置以及照明装置
CN1900792A (zh) * 2005-07-19 2007-01-24 三星电机株式会社 侧光led封装和使用该侧光led封装的背光单元
KR20070056230A (ko) * 2005-11-29 2007-06-04 삼성전기주식회사 발광소자용 반사부재 및 이를 사용한 발광다이오드 패키지
KR20070056233A (ko) * 2005-11-29 2007-06-04 삼성전기주식회사 발광 다이오드 패키지
JP2007227480A (ja) * 2006-02-21 2007-09-06 Toshiba Corp 半導体発光装置
CN101150164A (zh) * 2006-09-22 2008-03-26 株式会社东芝 光半导体器件和光半导体器件的制造方法
CN101535366A (zh) * 2006-11-15 2009-09-16 日立化成工业株式会社 光反射用热固化性树脂组合物及其制造方法、及使用了所述树脂组合物的光半导体元件搭载用基板及光半导体装置
CN101981716A (zh) * 2008-11-25 2011-02-23 Lg伊诺特有限公司 发光器件封装
TW201024598A (en) * 2008-12-25 2010-07-01 Au Optronics Corp Light emitting diode apparatus
US20100277925A1 (en) * 2009-04-30 2010-11-04 Chin Nyap Tan Lighting Structure with Multiple Reflective Surfaces
CN102163682A (zh) * 2010-01-28 2011-08-24 Lg伊诺特有限公司 发光器件封装

Also Published As

Publication number Publication date
JP2016106431A (ja) 2016-06-16
USRE47444E1 (en) 2019-06-18
JP5902823B2 (ja) 2016-04-13
US20140328083A1 (en) 2014-11-06
JP6167196B2 (ja) 2017-07-19
ES2693677T3 (es) 2018-12-13
US9142747B2 (en) 2015-09-22
CN104054189A (zh) 2014-09-17
CN104054189B (zh) 2018-06-26
USRE48474E1 (en) 2021-03-16
EP2782150B1 (en) 2018-08-15
EP3410498A1 (en) 2018-12-05
EP2782150A4 (en) 2015-08-19
WO2013073897A2 (ko) 2013-05-23
EP2782150A2 (en) 2014-09-24
JP2014533889A (ja) 2014-12-15
WO2013073897A3 (ko) 2013-07-11

Similar Documents

Publication Publication Date Title
CN104054189B (zh) 发光元件封装体以及包括该发光元件封装体的背光单元
CN105674207B (zh) 照明装置
KR101190414B1 (ko) 광학 요소를 가지는 플렉시블 필름을 포함한 반도체 발광소자들 및 이를 조립하는 방법
CN105874265B (zh) 低和高光束led灯
CN103367621B (zh) 发光器件封装件
CN103486460B (zh) 照明装置
CN103367600B (zh) 发光灯
CN104798214B (zh) 发光装置及包括该发光装置的电子设备
JP2002261333A (ja) 発光装置
US20110062470A1 (en) Reduced angular emission cone illumination leds
JP5488310B2 (ja) 車両用灯具の半導体型光源の光源ユニット、車両用灯具
US7964420B2 (en) LED chip package structure with an embedded ESD function and method for manufacturing the same
US9231176B2 (en) Narrow viewing angle plastic leaded chip carrier
KR20150092423A (ko) 발광소자 패키지
JP2012043750A (ja) 車両用灯具の半導体型光源の光源ユニット、車両用灯具
CN202373623U (zh) Led支架和led模组
JP2013077463A (ja) 車両用灯具の半導体型光源、車両用灯具の半導体型光源ユニット、車両用灯具
JP5828714B2 (ja) 車両用灯具の半導体型光源、車両用灯具の半導体型光源ユニット、車両用灯具
CN104157769A (zh) 发光二极管封装结构
TW201401566A (zh) 發光二極體的封裝方法
CN208045495U (zh) Led发光装置
TWI459600B (zh) 發光二極體封裝體及其製造方法
KR20080061564A (ko) 발광 다이오드 램프 및 그것을 제조하는 방법
US8247830B2 (en) Light-emitting device package structure
JP5965800B2 (ja) 車両用灯具の半導体型光源の製造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20180921

RJ01 Rejection of invention patent application after publication