WO2013073897A3 - 발광소자 패키지 및 이를 구비하는 백라이트 유닛 - Google Patents

발광소자 패키지 및 이를 구비하는 백라이트 유닛 Download PDF

Info

Publication number
WO2013073897A3
WO2013073897A3 PCT/KR2012/009752 KR2012009752W WO2013073897A3 WO 2013073897 A3 WO2013073897 A3 WO 2013073897A3 KR 2012009752 W KR2012009752 W KR 2012009752W WO 2013073897 A3 WO2013073897 A3 WO 2013073897A3
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
emitting device
device package
including same
opening
Prior art date
Application number
PCT/KR2012/009752
Other languages
English (en)
French (fr)
Other versions
WO2013073897A2 (ko
Inventor
오승현
김평국
이승훈
민천기
임정아
임준형
정철훈
정보현
Original Assignee
주식회사 루멘스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020110120496A external-priority patent/KR101260855B1/ko
Priority claimed from KR1020120097844A external-priority patent/KR101348097B1/ko
Priority to EP12850417.2A priority Critical patent/EP2782150B1/en
Priority to CN201280067097.7A priority patent/CN104054189B/zh
Priority to US16/168,198 priority patent/USRE48474E1/en
Priority to US14/358,994 priority patent/US9142747B2/en
Application filed by 주식회사 루멘스 filed Critical 주식회사 루멘스
Priority to EP18174472.3A priority patent/EP3410498A1/en
Priority to JP2014542249A priority patent/JP5902823B2/ja
Priority to US15/147,351 priority patent/USRE47444E1/en
Priority to ES12850417.2T priority patent/ES2693677T3/es
Publication of WO2013073897A2 publication Critical patent/WO2013073897A2/ko
Publication of WO2013073897A3 publication Critical patent/WO2013073897A3/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G02B6/0031—Reflecting element, sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133614—Illuminating devices using photoluminescence, e.g. phosphors illuminated by UV or blue light
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

본 발명은 방열성능이 우수하면서도 발광휘도가 높은 발광소자 패키지 및 이를 구비하는 백라이트 유닛을 위하여, 리드프레임과 상기 리드프레임 상에 배치된 발광소자와 상기 리드프레임과 결합되며 상기 발광소자에서 발생된 광을 방출하는 개구가 형성된 몰딩재를 갖는 패키지와, 상기 몰딩재의 상기 개구에 대응하는 개구부를 가지며 상기 몰딩재에 컨택하는 반사구조체를 구비하는, 발광소자 패키지 및 이를 구비하는 백라이트 유닛을 제공한다.
PCT/KR2012/009752 2011-11-17 2012-11-16 발광소자 패키지 및 이를 구비하는 백라이트 유닛 WO2013073897A2 (ko)

Priority Applications (8)

Application Number Priority Date Filing Date Title
ES12850417.2T ES2693677T3 (es) 2011-11-17 2012-11-16 Paquete de un dispositivo emisor de luz y retroiluminación que incluye el mismo
US15/147,351 USRE47444E1 (en) 2011-11-17 2012-11-16 Light emitting device package and backlight unit comprising the same
CN201280067097.7A CN104054189B (zh) 2011-11-17 2012-11-16 发光元件封装体以及包括该发光元件封装体的背光单元
US16/168,198 USRE48474E1 (en) 2011-11-17 2012-11-16 Light emitting device package and backlight unit comprising the same
US14/358,994 US9142747B2 (en) 2011-11-17 2012-11-16 Light emitting device package and backlight unit comprising the same
EP12850417.2A EP2782150B1 (en) 2011-11-17 2012-11-16 Light emitting device package and backlight including same
EP18174472.3A EP3410498A1 (en) 2011-11-17 2012-11-16 Light emitting element package
JP2014542249A JP5902823B2 (ja) 2011-11-17 2012-11-16 発光素子パッケージ及びそれを備えるバックライトユニット

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2011-0120496 2011-11-17
KR1020110120496A KR101260855B1 (ko) 2011-11-17 2011-11-17 발광소자 패키지 및 이를 구비하는 백라이트 유닛
KR10-2012-0097844 2012-09-04
KR1020120097844A KR101348097B1 (ko) 2012-09-04 2012-09-04 발광소자 패키지

Publications (2)

Publication Number Publication Date
WO2013073897A2 WO2013073897A2 (ko) 2013-05-23
WO2013073897A3 true WO2013073897A3 (ko) 2013-07-11

Family

ID=48430309

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/009752 WO2013073897A2 (ko) 2011-11-17 2012-11-16 발광소자 패키지 및 이를 구비하는 백라이트 유닛

Country Status (6)

Country Link
US (3) USRE48474E1 (ko)
EP (2) EP3410498A1 (ko)
JP (2) JP5902823B2 (ko)
CN (2) CN108565329A (ko)
ES (1) ES2693677T3 (ko)
WO (1) WO2013073897A2 (ko)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101413596B1 (ko) * 2012-12-07 2014-07-02 주식회사 루멘스 발광장치 및 이를 구비하는 백라이트 유닛
JP6476567B2 (ja) 2013-03-29 2019-03-06 日亜化学工業株式会社 発光装置
TWI506828B (zh) * 2013-11-20 2015-11-01 Lextar Electronics Corp 發光裝置
DE102013114345A1 (de) * 2013-12-18 2015-06-18 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements
EP3547379A1 (en) * 2014-03-14 2019-10-02 Citizen Electronics Co., Ltd. Light emitting apparatus
JP6459354B2 (ja) 2014-09-30 2019-01-30 日亜化学工業株式会社 透光部材及びその製造方法ならびに発光装置及びその製造方法
WO2016084437A1 (ja) * 2014-11-28 2016-06-02 シャープ株式会社 発光装置および照明器具
KR102237155B1 (ko) * 2015-03-11 2021-04-07 엘지이노텍 주식회사 발광 소자 및 이를 구비한 라이트 유닛
JP6168096B2 (ja) * 2015-04-28 2017-07-26 日亜化学工業株式会社 発光装置、パッケージ及びそれらの製造方法
JP6590579B2 (ja) * 2015-08-03 2019-10-16 シチズン電子株式会社 Ｌｅｄ発光素子
DE102015116263A1 (de) 2015-09-25 2017-03-30 Osram Opto Semiconductors Gmbh Herstellung eines elektronischen Bauelements
JP2017130588A (ja) * 2016-01-21 2017-07-27 旭化成株式会社 紫外線発光装置
JP6790416B2 (ja) 2016-03-31 2020-11-25 日亜化学工業株式会社 発光装置
US10658558B2 (en) 2017-10-10 2020-05-19 Lumileds Llc LED package including converter confinement
JP7399678B2 (ja) * 2019-10-28 2023-12-18 株式会社ダイセル 光半導体装置用樹脂成形体及び光半導体装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070056230A (ko) * 2005-11-29 2007-06-04 삼성전기주식회사 발광소자용 반사부재 및 이를 사용한 발광다이오드 패키지
KR20070056233A (ko) * 2005-11-29 2007-06-04 삼성전기주식회사 발광 다이오드 패키지
KR20100058978A (ko) * 2008-11-25 2010-06-04 엘지이노텍 주식회사 발광 소자 패키지
KR20100119513A (ko) * 2009-04-30 2010-11-09 아바고 테크놀로지스 이씨비유 아이피 (싱가포르) 피티이 리미티드 다수의 반사면을 갖는 발광 구조체
KR20110112539A (ko) * 2010-04-07 2011-10-13 (주) 아모엘이디 엘이디 패키지 및 이의 제조방법

Family Cites Families (83)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000156528A (ja) 1998-11-19 2000-06-06 Sharp Corp 発光素子
JP3798195B2 (ja) * 1999-08-12 2006-07-19 ローム株式会社 チップ型発光装置
JP4125848B2 (ja) * 1999-12-17 2008-07-30 ローム株式会社 ケース付チップ型発光装置
EP1146572A3 (en) * 2000-03-14 2005-03-23 Toyoda Gosei Co., Ltd. Light source device
DE10020465A1 (de) * 2000-04-26 2001-11-08 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement mit Lumineszenzkonversionselement
US20020085390A1 (en) * 2000-07-14 2002-07-04 Hironobu Kiyomoto Optical device and apparatus employing the same
US6949771B2 (en) * 2001-04-25 2005-09-27 Agilent Technologies, Inc. Light source
JP3891400B2 (ja) * 2001-07-25 2007-03-14 シチズン電子株式会社 発光ダイオード
JP3948650B2 (ja) * 2001-10-09 2007-07-25 アバゴ・テクノロジーズ・イーシービーユー・アイピー（シンガポール）プライベート・リミテッド 発光ダイオード及びその製造方法
ATE525755T1 (de) * 2001-10-12 2011-10-15 Nichia Corp Lichtemittierendes bauelement und verfahren zu seiner herstellung
US6791116B2 (en) * 2002-04-30 2004-09-14 Toyoda Gosei Co., Ltd. Light emitting diode
JP3912607B2 (ja) * 2002-06-19 2007-05-09 サンケン電気株式会社 半導体発光装置の製法
JP3910517B2 (ja) * 2002-10-07 2007-04-25 シャープ株式会社 Ｌｅｄデバイス
JP4143732B2 (ja) * 2002-10-16 2008-09-03 スタンレー電気株式会社 車載用波長変換素子
JP3918858B2 (ja) * 2003-03-18 2007-05-23 住友電気工業株式会社 発光素子搭載用部材およびそれを用いた半導体装置
JP4072084B2 (ja) * 2003-03-24 2008-04-02 京セラ株式会社 発光素子収納用パッケージおよび発光装置
CN102290409B (zh) * 2003-04-01 2014-01-15 夏普株式会社 发光装置
JP4070208B2 (ja) * 2003-04-21 2008-04-02 京セラ株式会社 発光素子収納用パッケージおよび発光装置
KR20040092512A (ko) * 2003-04-24 2004-11-04 (주)그래픽테크노재팬 방열 기능을 갖는 반사판이 구비된 반도체 발광장치
US20050133808A1 (en) * 2003-09-11 2005-06-23 Kyocera Corporation Package for housing light-emitting element, light-emitting apparatus and illumination apparatus
JP2005183531A (ja) * 2003-12-17 2005-07-07 Sharp Corp 半導体発光装置
JP2005353816A (ja) 2004-06-10 2005-12-22 Olympus Corp 発光デバイス、発光デバイスの製造方法、発光デバイスを用いた照明装置、及び、プロジェクタ
JP4888626B2 (ja) 2004-08-13 2012-02-29 株式会社フジクラ 発光ダイオードランプ
JP5192811B2 (ja) * 2004-09-10 2013-05-08 ソウル セミコンダクター カンパニー リミテッド 多重モールド樹脂を有する発光ダイオードパッケージ
JP4756841B2 (ja) 2004-09-29 2011-08-24 スタンレー電気株式会社 半導体発光装置の製造方法
JP4659421B2 (ja) * 2004-09-30 2011-03-30 株式会社トクヤマ 発光素子収納用パッケージの製造方法
JP2006128511A (ja) * 2004-10-29 2006-05-18 Ngk Spark Plug Co Ltd 発光素子用セラミック基板
JP2006186297A (ja) * 2004-12-03 2006-07-13 Toshiba Corp 半導体発光装置及びその製造方法
US8288942B2 (en) * 2004-12-28 2012-10-16 Cree, Inc. High efficacy white LED
TWI266079B (en) * 2005-01-10 2006-11-11 Shiu-Hua Huang Steering lens and light emitting system using the same
JP2006237049A (ja) * 2005-02-22 2006-09-07 Ngk Spark Plug Co Ltd 発光素子実装用配線基板
CN101147270B (zh) 2005-03-24 2010-05-26 京瓷株式会社 发光装置
KR100649679B1 (ko) 2005-07-19 2006-11-27 삼성전기주식회사 측면 발광형 엘이디 패키지 및 이를 이용한 백 라이트 유닛
US8231251B2 (en) 2005-10-28 2012-07-31 Philips Lumileds Lighting Company Llc Multiple piece reflective angle transformer
US20100002455A1 (en) * 2005-11-24 2010-01-07 Yoichi Matsuoka Electronic Component Mounting Board and Method for Manufacturing Such Board
CN101846247B (zh) * 2005-12-22 2013-04-17 松下电器产业株式会社 具有led的照明器具
JP2007201420A (ja) * 2005-12-27 2007-08-09 Sharp Corp 半導体発光装置、半導体発光素子、および半導体発光装置の製造方法
US8044412B2 (en) * 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
JP2007227480A (ja) 2006-02-21 2007-09-06 Toshiba Corp 半導体発光装置
JP2007305785A (ja) * 2006-05-11 2007-11-22 Nichia Chem Ind Ltd 発光装置
US7906794B2 (en) * 2006-07-05 2011-03-15 Koninklijke Philips Electronics N.V. Light emitting device package with frame and optically transmissive element
JP5205724B2 (ja) * 2006-08-04 2013-06-05 日亜化学工業株式会社 発光装置
WO2008023467A1 (fr) * 2006-08-24 2008-02-28 Sharp Kabushiki Kaisha Élément émettant de la lumière, ensemble d'éléments émettant de la lumière, unité de rétroéclairage, et dispositif d'affichage à cristaux liquides
JP4846498B2 (ja) 2006-09-22 2011-12-28 株式会社東芝 光半導体装置及び光半導体装置の製造方法
WO2008039010A1 (en) * 2006-09-29 2008-04-03 Seoul Semiconductor Co., Ltd. Led package
JP2008144127A (ja) * 2006-11-15 2008-06-26 Hitachi Chem Co Ltd 熱硬化性光反射用樹脂組成物、ならびにこれを用いた光半導体素子搭載用基板、光半導体装置およびこれらの製造方法
US8093619B2 (en) * 2006-12-28 2012-01-10 Nichia Corporation Light emitting device
JP2008186946A (ja) 2007-01-29 2008-08-14 Toshiba Corp 光半導体装置及びその製造方法
JP4205135B2 (ja) * 2007-03-13 2009-01-07 シャープ株式会社 半導体発光装置、半導体発光装置用多連リードフレーム
JP2008300544A (ja) 2007-05-30 2008-12-11 Sharp Corp 発光装置およびその製造方法
KR101374898B1 (ko) * 2007-09-28 2014-03-18 서울반도체 주식회사 계면 분리를 줄인 ｌｅｄ 패키지
JP5405731B2 (ja) * 2007-10-23 2014-02-05 日立コンシューマエレクトロニクス株式会社 光源モジュール
KR101104034B1 (ko) * 2007-12-06 2012-01-09 엘지이노텍 주식회사 발광다이오드, 발광장치 및 그 제조방법
KR20150140868A (ko) * 2008-01-09 2015-12-16 히타치가세이가부시끼가이샤 열경화성 수지 조성물, 에폭시 수지 성형 재료 및 다가 카르복시산 축합체
US7923746B2 (en) * 2008-03-12 2011-04-12 Industrial Technology Research Institute Light emitting diode package structure and method for fabricating the same
US8324723B2 (en) * 2008-03-25 2012-12-04 Bridge Semiconductor Corporation Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump
KR20090104518A (ko) * 2008-03-31 2009-10-06 서울반도체 주식회사 프로젝션 시스템용 발광 다이오드 패키지
JP5320560B2 (ja) * 2008-05-20 2013-10-23 東芝ライテック株式会社 光源ユニット及び照明装置
JP5196551B2 (ja) * 2008-06-09 2013-05-15 Ｎｅｃライティング株式会社 発光装置
US8288785B2 (en) * 2008-12-03 2012-10-16 Seoul Semiconductor Co., Ltd. Lead frame having light-reflecting layer, light emitting diode having the lead frame, and backlight unit having the light emitting diode
TWI426206B (zh) * 2008-12-25 2014-02-11 Au Optronics Corp 發光二極體裝置
JP5428358B2 (ja) * 2009-01-30 2014-02-26 ソニー株式会社 光学素子パッケージの製造方法
KR20110007633A (ko) 2009-07-09 2011-01-25 (주) 아모엘이디 엘이디 패키지
DE102009033287A1 (de) 2009-07-15 2011-01-20 Osram Opto Semiconductors Gmbh Leuchtdiode und Verfahren zur Herstellung einer Leuchtdiode
JP5139519B2 (ja) * 2009-09-01 2013-02-06 株式会社東芝 半導体発光素子及び半導体発光装置
IN2012DN02644A (ko) * 2009-10-29 2015-09-11 Nichia Corp
EP2495774B1 (en) * 2009-10-29 2018-07-18 Kyocera Corporation Light emitting device
KR101064090B1 (ko) * 2009-11-17 2011-09-08 엘지이노텍 주식회사 발광소자 패키지
DE102009058421A1 (de) 2009-12-16 2011-06-22 OSRAM Opto Semiconductors GmbH, 93055 Verfahren zur Herstellung eines Gehäuses für ein optoelektronisches Halbleiterbauteil, Gehäuse und optoelektronisches Halbleiterbauteil
TW201145597A (en) 2010-01-28 2011-12-16 Lg Innotek Co Ltd Light emitting device package
JP2011171365A (ja) 2010-02-16 2011-09-01 Panasonic Corp 半導体発光モジュール、光源装置、および液晶表示装置
KR101637581B1 (ko) * 2010-03-09 2016-07-07 엘지이노텍 주식회사 발광 소자 패키지 및 그 제조방법
JP5370232B2 (ja) 2010-03-25 2013-12-18 豊田合成株式会社 Ｌｅｄパッケージの製造方法
US8354745B2 (en) * 2010-04-20 2013-01-15 Intellectual Discovery Co., Ltd. Electronic assembly
WO2011136417A1 (ko) * 2010-04-30 2011-11-03 주식회사 웨이브닉스이에스피 단자 일체형 금속베이스 패키지 모듈 및 금속베이스 패키지 모듈을 위한 단자 일체형 패키지방법
KR20110128693A (ko) * 2010-05-24 2011-11-30 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 라이트 유닛
JP5940775B2 (ja) * 2010-08-27 2016-06-29 ローム株式会社 液晶表示装置バックライト用ｌｅｄ光源装置および液晶表示装置
CN103081141B (zh) * 2010-08-31 2016-10-12 日亚化学工业株式会社 发光装置及其制造方法
JPWO2012049854A1 (ja) * 2010-10-14 2014-02-24 パナソニック株式会社 発光装置及びこれを用いた面光源装置
CN102544303A (zh) * 2010-12-21 2012-07-04 展晶科技(深圳)有限公司 发光二极管封装结构
US8569778B2 (en) * 2011-02-11 2013-10-29 Intellectual Discovery Co., Ltd. Narrow viewing angle plastic leaded chip carrier
KR101850431B1 (ko) * 2011-07-07 2018-05-31 엘지이노텍 주식회사 발광 모듈 및 이를 포함하는 조명 시스템
US9793456B2 (en) * 2011-09-30 2017-10-17 Kaneka Corporation Molded resin body for surface-mounted light-emitting device, manufacturing method thereof, and surface-mounted light-emitting device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070056230A (ko) * 2005-11-29 2007-06-04 삼성전기주식회사 발광소자용 반사부재 및 이를 사용한 발광다이오드 패키지
KR20070056233A (ko) * 2005-11-29 2007-06-04 삼성전기주식회사 발광 다이오드 패키지
KR20100058978A (ko) * 2008-11-25 2010-06-04 엘지이노텍 주식회사 발광 소자 패키지
KR20100119513A (ko) * 2009-04-30 2010-11-09 아바고 테크놀로지스 이씨비유 아이피 (싱가포르) 피티이 리미티드 다수의 반사면을 갖는 발광 구조체
KR20110112539A (ko) * 2010-04-07 2011-10-13 (주) 아모엘이디 엘이디 패키지 및 이의 제조방법

Also Published As

Publication number Publication date
CN104054189B (zh) 2018-06-26
JP5902823B2 (ja) 2016-04-13
JP6167196B2 (ja) 2017-07-19
ES2693677T3 (es) 2018-12-13
EP2782150B1 (en) 2018-08-15
US9142747B2 (en) 2015-09-22
JP2016106431A (ja) 2016-06-16
EP3410498A1 (en) 2018-12-05
CN104054189A (zh) 2014-09-17
US20140328083A1 (en) 2014-11-06
USRE47444E1 (en) 2019-06-18
JP2014533889A (ja) 2014-12-15
CN108565329A (zh) 2018-09-21
USRE48474E1 (en) 2021-03-16
EP2782150A2 (en) 2014-09-24
WO2013073897A2 (ko) 2013-05-23
EP2782150A4 (en) 2015-08-19

Similar Documents

Publication Publication Date Title
WO2013073897A3 (ko) 발광소자 패키지 및 이를 구비하는 백라이트 유닛
WO2012128966A3 (en) Light emitting diode package comprising encapsulant with index matched thixotropic agent
WO2012076296A3 (de) Leuchtvorrichtung
JP2016503342A5 (ko)
WO2013022283A3 (en) Lighting device
WO2013012217A3 (en) Lighting device
WO2012122095A3 (en) Led luminaire
WO2010104275A3 (en) Lamp cover and led lamp using the same
WO2012058004A3 (en) Lighting apparatus
WO2012070895A3 (ko) 엘이디 조명기구
EP2660885A4 (en) LIGHTING DEVICE, PACKAGE OF LIGHT-EMITTING DIODES THEREFOR AND BACKLIGHTING DEVICE
WO2012047255A3 (en) Insulating glass (ig) or vacuum insulating glass (vig) unit including light source, and/or methods of making the same
WO2012135744A3 (en) White light-emitting device
WO2013005971A3 (ko) 조명 장치
WO2014039833A3 (en) Integrated led based illumination device
WO2010071386A3 (ko) 발광소자 패키지, 백라이트 유닛, 디스플레이 장치 및 조명장치
EP2515355A3 (en) Light emitting device package including uv light emitting diode
AU2012246705A8 (en) Headlamp assembly with planar heat sink structure
WO2008146290A3 (en) Method and device for providing circumferential illumination
WO2011141846A3 (en) Lighting module
WO2012076294A3 (de) Leuchtvorrichtung
EP4276922A3 (en) Display apparatus based on light-emitting diode packages
TR201900206T4 (tr) Işık kaynağından ısı aktarmaya yönelik yansıtıcıya sahip elektrik lambası.
WO2013039317A3 (ko) 아이시클형 확산유닛을 적용한 엘이디 조명 엔진
EP2565950A3 (en) Light emitting device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12850417

Country of ref document: EP

Kind code of ref document: A2

ENP Entry into the national phase

Ref document number: 2014542249

Country of ref document: JP

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 14358994

Country of ref document: US

WWE Wipo information: entry into national phase

Ref document number: 2012850417

Country of ref document: EP