CN108473682A - 柔性基板用聚倍半硅氧烷树脂组合物 - Google Patents
柔性基板用聚倍半硅氧烷树脂组合物 Download PDFInfo
- Publication number
- CN108473682A CN108473682A CN201680077335.0A CN201680077335A CN108473682A CN 108473682 A CN108473682 A CN 108473682A CN 201680077335 A CN201680077335 A CN 201680077335A CN 108473682 A CN108473682 A CN 108473682A
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- China
- Prior art keywords
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- polysilsesquioxane
- resin composition
- chemical formula
- heterocycloalkyl
- Prior art date
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- 229920000734 polysilsesquioxane polymer Polymers 0.000 title claims abstract description 60
- 239000000203 mixture Substances 0.000 title claims abstract description 10
- 229920005989 resin Polymers 0.000 title claims abstract description 7
- 239000011347 resin Substances 0.000 title claims abstract description 7
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 238000002161 passivation Methods 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 7
- -1 glycidyloxy group Chemical group 0.000 claims description 55
- 239000011342 resin composition Substances 0.000 claims description 40
- 239000000126 substance Substances 0.000 claims description 34
- 125000000592 heterocycloalkyl group Chemical group 0.000 claims description 27
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 26
- 229920005604 random copolymer Polymers 0.000 claims description 18
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical group O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 15
- LGRFSURHDFAFJT-UHFFFAOYSA-N phthalic anhydride Chemical group C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 claims description 15
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 13
- 125000003277 amino group Chemical group 0.000 claims description 12
- 125000001424 substituent group Chemical group 0.000 claims description 12
- RINCXYDBBGOEEQ-UHFFFAOYSA-N succinic anhydride Chemical group O=C1CCC(=O)O1 RINCXYDBBGOEEQ-UHFFFAOYSA-N 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 10
- 125000003545 alkoxy group Chemical group 0.000 claims description 9
- 125000004093 cyano group Chemical group *C#N 0.000 claims description 9
- 229910052736 halogen Inorganic materials 0.000 claims description 9
- 150000002367 halogens Chemical class 0.000 claims description 9
- 239000003960 organic solvent Substances 0.000 claims description 9
- 125000002947 alkylene group Chemical group 0.000 claims description 8
- 239000003431 cross linking reagent Substances 0.000 claims description 8
- 125000000217 alkyl group Chemical group 0.000 claims description 7
- 125000003118 aryl group Chemical group 0.000 claims description 7
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 7
- 125000001072 heteroaryl group Chemical group 0.000 claims description 7
- 125000006649 (C2-C20) alkynyl group Chemical group 0.000 claims description 6
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 6
- 125000003342 alkenyl group Chemical group 0.000 claims description 6
- 125000000304 alkynyl group Chemical group 0.000 claims description 6
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 6
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 5
- 125000002843 carboxylic acid group Chemical group 0.000 claims description 5
- 239000004094 surface-active agent Substances 0.000 claims description 5
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 4
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 claims description 4
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 claims description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 4
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 claims description 3
- YGYCECQIOXZODZ-UHFFFAOYSA-N 4415-87-6 Chemical compound O=C1OC(=O)C2C1C1C(=O)OC(=O)C12 YGYCECQIOXZODZ-UHFFFAOYSA-N 0.000 claims description 3
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 claims description 3
- 239000011229 interlayer Substances 0.000 claims description 3
- YTVNOVQHSGMMOV-UHFFFAOYSA-N naphthalenetetracarboxylic dianhydride Chemical compound C1=CC(C(=O)OC2=O)=C3C2=CC=C2C(=O)OC(=O)C1=C32 YTVNOVQHSGMMOV-UHFFFAOYSA-N 0.000 claims description 3
- FENFUOGYJVOCRY-UHFFFAOYSA-N 1-propoxypropan-2-ol Chemical compound CCCOCC(C)O FENFUOGYJVOCRY-UHFFFAOYSA-N 0.000 claims description 2
- SGQHDGJJZODGHE-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethanol;methyl acetate Chemical compound COC(C)=O.OCCOCCO SGQHDGJJZODGHE-UHFFFAOYSA-N 0.000 claims description 2
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 claims description 2
- CUDYYMUUJHLCGZ-UHFFFAOYSA-N 2-(2-methoxypropoxy)propan-1-ol Chemical compound COC(C)COC(C)CO CUDYYMUUJHLCGZ-UHFFFAOYSA-N 0.000 claims description 2
- GICQWELXXKHZIN-UHFFFAOYSA-N 2-[2-[(2-methylpropan-2-yl)oxy]ethoxy]ethanol Chemical compound CC(C)(C)OCCOCCO GICQWELXXKHZIN-UHFFFAOYSA-N 0.000 claims description 2
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 claims description 2
- 229920000877 Melamine resin Polymers 0.000 claims description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 claims description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 claims description 2
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 2
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 claims description 2
- UHKJHMOIRYZSTH-UHFFFAOYSA-N ethyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OCC UHKJHMOIRYZSTH-UHFFFAOYSA-N 0.000 claims description 2
- DBLVXHJTZIDGHE-UHFFFAOYSA-N ethyl acetate;2-(2-hydroxyethoxy)ethanol Chemical compound CCOC(C)=O.OCCOCCO DBLVXHJTZIDGHE-UHFFFAOYSA-N 0.000 claims description 2
- 229940116333 ethyl lactate Drugs 0.000 claims description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 2
- 150000002460 imidazoles Chemical class 0.000 claims description 2
- 239000012948 isocyanate Substances 0.000 claims description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims description 2
- 150000007974 melamines Chemical class 0.000 claims description 2
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 claims description 2
- 125000003566 oxetanyl group Chemical group 0.000 claims description 2
- 150000002989 phenols Chemical class 0.000 claims description 2
- OAXARSVKYJPDPA-UHFFFAOYSA-N tert-butyl 4-prop-2-ynylpiperazine-1-carboxylate Chemical compound CC(C)(C)OC(=O)N1CCN(CC#C)CC1 OAXARSVKYJPDPA-UHFFFAOYSA-N 0.000 claims description 2
- CQMIJLIXKMKFQW-UHFFFAOYSA-N 4-phenylbenzene-1,2,3,5-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C(O)=O)=C1C1=CC=CC=C1 CQMIJLIXKMKFQW-UHFFFAOYSA-N 0.000 claims 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 9
- 239000004642 Polyimide Substances 0.000 abstract description 8
- 239000011521 glass Substances 0.000 abstract description 8
- 229920001721 polyimide Polymers 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 8
- 230000032798 delamination Effects 0.000 abstract description 3
- 238000002834 transmittance Methods 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 abstract 1
- 238000007711 solidification Methods 0.000 abstract 1
- 230000008023 solidification Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 31
- 239000011248 coating agent Substances 0.000 description 14
- 238000000576 coating method Methods 0.000 description 14
- 238000011156 evaluation Methods 0.000 description 10
- XKZQKPRCPNGNFR-UHFFFAOYSA-N 2-(3-hydroxyphenyl)phenol Chemical compound OC1=CC=CC(C=2C(=CC=CC=2)O)=C1 XKZQKPRCPNGNFR-UHFFFAOYSA-N 0.000 description 6
- 230000008859 change Effects 0.000 description 6
- 230000008961 swelling Effects 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 238000005401 electroluminescence Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000003786 synthesis reaction Methods 0.000 description 4
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical group ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 229920006026 co-polymeric resin Polymers 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000007865 diluting Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000007791 liquid phase Substances 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 229940014800 succinic anhydride Drugs 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 0 CNO/*=S/SC Chemical compound CNO/*=S/SC 0.000 description 2
- 229910004205 SiNX Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- CQUTXCKGINHWKG-UHFFFAOYSA-N isocyanato prop-2-enoate Chemical compound C=CC(=O)ON=C=O CQUTXCKGINHWKG-UHFFFAOYSA-N 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000002105 nanoparticle Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 125000005005 perfluorohexyl group Chemical group FC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)* 0.000 description 2
- 125000005007 perfluorooctyl group Chemical group FC(C(C(C(C(C(C(C(F)(F)F)(F)F)(F)F)(F)F)(F)F)(F)F)(F)F)(F)* 0.000 description 2
- 125000005009 perfluoropropyl group Chemical group FC(C(C(F)(F)F)(F)F)(F)* 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- AVYKQOAMZCAHRG-UHFFFAOYSA-N triethoxy(3,3,4,4,5,5,6,6,7,7,8,8,8-tridecafluorooctyl)silane Chemical compound CCO[Si](OCC)(OCC)CCC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F AVYKQOAMZCAHRG-UHFFFAOYSA-N 0.000 description 2
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 2
- MNUHUVIZSPCLFF-UHFFFAOYSA-N 1-methylhept-6-ene-1,2,4,5-tetracarboxylic acid Chemical compound OC(=O)C(C)C(C(O)=O)CC(C(O)=O)C(C=C)C(O)=O MNUHUVIZSPCLFF-UHFFFAOYSA-N 0.000 description 1
- YWFPGFJLYRKYJZ-UHFFFAOYSA-N 9,9-bis(4-hydroxyphenyl)fluorene Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 YWFPGFJLYRKYJZ-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- ZFVMWEVVKGLCIJ-UHFFFAOYSA-N bisphenol AF Chemical compound C1=CC(O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(O)C=C1 ZFVMWEVVKGLCIJ-UHFFFAOYSA-N 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 150000001925 cycloalkenes Chemical class 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001523 electrospinning Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000005343 heterocyclic alkyl group Chemical group 0.000 description 1
- 239000012761 high-performance material Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000012074 organic phase Substances 0.000 description 1
- 150000001282 organosilanes Chemical class 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- GAMLUOSQYHLFCT-UHFFFAOYSA-N triethoxy-[3-[(3-ethyloxetan-3-yl)methoxy]propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1(CC)COC1 GAMLUOSQYHLFCT-UHFFFAOYSA-N 0.000 description 1
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
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Abstract
本发明涉及柔性基板用聚倍半硅氧烷树脂组合物。更具体地,本发明涉及作为可用于柔性显示器基板的树脂组合物,具有优秀的耐热性及透明性的柔性基板用聚倍半硅氧烷树脂组合物。更具体地,可形成透明的薄膜,即使固化后在可见光区域也呈现优秀的透射性,并且耐热性优秀,可调节柔性和耐裂痕性。与现有的聚酰亚胺类基板材料相比,可同时满足优秀的绝缘特性及钝化(Passivation)特性。并且,确保从玻璃基板的剥离(Delamination)工序时的脱模特性,从而有利于生产性。
Description
技术领域
本发明涉及柔性基板用聚倍半硅氧烷树脂组合物,更具体地,本发明涉及作为可用于柔性显示器基板的树脂组合物,具有优秀的耐热性及透明性的柔性基板用聚倍半硅氧烷树脂组合物。
背景技术
近年来,随着柔性显示器、电子纸及可穿戴设备的发展,对支持这些的高性能的基板用材料的需求日益增加。尤其,显示器产品要求更轻及更薄,然而现有的商用化的玻璃基板存在易碎、难以制造成薄且轻的缺点。
对此,为了克服现有的玻璃基板的问题,进行了将聚酰亚胺用作基板用材料的许多研究,然而尽管具有优秀的热稳定性、绝缘特性及柔性,也存在因反复且规则的苯基结构的pi-电子的相互作用而具有深色,从而缺乏作为显示用途的基本特性的透明性,并且溶解度低并缺乏加工性的缺点。
并且,在使用现有的聚酰亚胺制造柔性基板的工艺中,在下载体(carrier)玻璃基板上涂敷聚酰亚胺前体并长时间干燥形成膜后,经超薄膜晶体管(TFT)工艺后,通过使用激光(laser)从载体(carrier)玻璃基板进行剥离(Delamination)过程来制造。但是,当通过这种制造过程制造时,产生收率急剧降低的问题。
因此,迫切需要开发适合所述柔性基板制造的耐热性、透明性、加工性、剥离特性、耐划痕特性及钝化(Passivation)特性优秀的新型高分子组合物。
发明内容
技术问题
本发明的目的在于,提供柔性基板用聚倍半硅氧烷树脂组合物。
本发明的另一目的在于,提供高温下的耐热性、透明性、剥离特性、钝化特性及耐划痕效果优秀的新型聚倍半硅氧烷树脂组合物。
本发明的其他另一目的在于,提供包含可用于柔性基板的新型聚倍半硅氧烷无规共聚物、笼型聚倍半硅氧烷化合物、交联剂及有机溶剂的聚倍半硅氧烷树脂组合物。
本发明的其他目的及优点通过以下发明的详细说明及发明要求保护范围变得更加明显。
解决问题的方案
为了向本领域普通技术人员更完整地说明本发明而提供本发明的实施例,以下实施例可变形实施为各种其他形状,然而本发明的范围不限定于以下实施例。相反,这些实施例是为了使本发明更彻底和完整并将本发明的精神完整地传达给本领域普通技术人员而提供的。
在本发明的一具体例中,本发明涉及由以下化学式1表示的聚倍半硅氧烷无规共聚物:
化学式1:
其中,
n为2至100的整数,
R1至R4为选自由C1-20的烷基、C2-20的亚烷基、C2-20的烯基、C2-20的炔基、C6-18的芳基、C6-18的杂芳基、C6-18的环烷基、氨基、核原子数为3至40的杂环烷基、缩水甘油氧基、环己基环氧基、C3-10的杂环烷基、丙烯酰氧基、异氰酸酯基、羟基、邻苯二甲酸酐基、马来酸酐基、琥珀酸酐基组成的组中的一种以上,所述R1至R4的烷基、亚烷基、烯基、炔基、芳基、杂芳基、环烷基、杂环烷基及丙烯酰氧基可各自独立地被选自由卤素、羟基、-CN、直链或支链的C1-6的烷基及C1-6的烷氧基组成的组中的一种以上的取代基取代或非取代。
更具体地,所述化学式1的R1至R4为选自由C1-20的烷基、C1-20的亚烷基、C1-20的烯基、C1-20的炔基、C6-18的芳基、C6-18的杂芳基、C6-18的环烷基、氨基、核原子数为3至40的杂环烷基、缩水甘油氧基,环己基环氧基,C3-10的杂环烷基、丙烯酰氧基、异氰酸酯基、羟基、邻苯二甲酸酐基、马来酸酐基、琥珀酸酐基组成的组中的一种以上,优选地,R1为CF3-(CF2)m-,m为0至18的整数,R2为选自由C2-20的亚烷基,R4为选自由缩水甘油氧基、环己基环氧基、氧杂环丁烷、丙烯酰氧基、甲基丙烯酰氧基、异氰酸酯基、羟基、邻苯二甲酸酐基、马来酸酐基及琥珀酸酐基组成的组中的一种以上的取代基。
更优选地,R1为选自由三氟甲基(Trifluoromethyl),全氟丙基(Perflouropropyl),全氟己基(Perfluorohexyl),全氟辛基(Perfluorooctyl)及全氟癸基(Perfluorodecyl)组成的组中的一种以上,R2为选自由丙基(Propyl)、己基(hexyl)、辛基(octyl)及癸基(decyl)组成的组中的一种以上,用于耐裂痕特性和柔性,R3为选自由C6-18的芳基、C6-18的杂芳基及C6-18的环烷基组成的组中的一种以上,用于表示耐热性及高玻璃化温度(Tg),R4为选自由缩水甘油氧基、环己基环氧基、氧杂环丁烷、丙烯酰氧基、甲基丙烯酰氧基、异氰酸酯基、羟基、邻苯二甲酸酐基、马来酸酐基及琥珀酸酐基组成的组中的一种以上,用于表示固化特性,但不限定于例示。
所述化学式1的聚倍半硅氧烷无规共聚物为通过溶胶-凝胶反应共聚两种以上的功能性有机硅烷单体来制备且不限定于每个共聚单元的排列顺序的无规共聚物。所述功能性有机硅烷单体包括氟类、环氧基苯类、烷基类及环烯烃类。
在本发明的一具体例中,本发明的无规共聚物重均分子量(Mw)为1000至50000,分散度为1.5至8.0。
在本发明的一具体例中,本发明涉及包含以下化学式1的聚倍半硅氧烷无规共聚物、以下化学式2的化合物、有机溶剂及交联剂的聚倍半硅氧烷树脂组合物:
化学式1:
化学式2:
其中,n为2至100的整数,R1至R4为选自由C1-20的烷基、C2-20的亚烷基、C2-20的烯基、C2-20的炔基、C6-18的芳基、C6-18的杂芳基、C6-18的环烷基、氨基、核原子数为3至40的杂环烷基、缩水甘油氧基、环己基环氧基、C3-10的杂环烷基、丙烯酰氧基、异氰酸酯基、羟基、邻苯二甲酸酐基、马来酸酐基、琥珀酸酐基组成的组中的一种以上,R5为选自由缩水甘油氧基、环己基环氧基、C3-10的杂环烷基、丙烯酰氧基、异氰酸酯基、羟基、邻苯二甲酸酐基、马来酸酐基、琥珀酸酐基、氨基及羧酸基组成的组中的一种以上,所述R1至R5的烷基、亚烷基、烯基、炔基、芳基、杂芳基、环烷基、杂环烷基及丙烯酰氧基可各自独立地被选自由卤素、羟基、-CN、直链或支链的C1-6的烷基及C1-6的烷氧基组成的组中的一种以上的取代基取代或非取代。
具体地,为了与所述化学式1的聚倍半硅氧烷无规共聚物发生固化反应,所述化学式2的化合物包含R5的取代基,所述R5的取代基为选自由缩水甘油氧基、环己基环氧基,C3-10的杂环烷基、丙烯酰氧基、异氰酸酯基、羟基、邻苯二甲酸酐基、马来酸酐基、琥珀酸酐基、氨基及羧酸基组成的组中的一种以上,但不限定于例示。所述R5的杂环烷基及丙烯酰氧基可各自独立地被选自由卤素、羟基、-CN、直链或支链的C1-6的烷基及C1-6的烷氧基组成的组中的一种以上的取代基取代或非取代。通常,在聚倍半硅氧烷树脂组合物的情况下,具有固化后容易产生裂纹的问题。然而,通过包含如本发明的化学式2的化合物的笼型化合物而提供如纳米尺寸的孔隙等的结构,通过包含上述纳米尺寸的孔隙而充当用于防止裂缝的缓冲颗粒作用。在现有的聚酰亚胺的情况下,利用钝化层来对SiOx、SiNx层进行无机沉积,并且需要额外的缓冲层,但本发明的情况下,由于是SiOx骨架(backbone),因此与后续的钝化工艺中所使用的SiOx、SiNx之间的相容性优秀。
并且,由于化学式1的聚倍半硅氧烷无规共聚物与化学式2的化合物可进行因热引起的交联反应,因而可进一步提高耐热性。并且,由于包含化学式2的化合物,在用作柔性基板用材料时,可体现出适当的耐热性、柔性及防裂特性。
在本发明的一具体例中,本发明的聚倍半硅氧烷树脂组合物所包含的交联剂包括选自由三聚氰胺类化合物、酸酐类化合物、异氰酸酯类化合物、胺类化合物、咪唑类化合物、苯酚类化合物、羟基类化合物、羧基类化合物及它们的混合物组成的组中的一种以上,更具体地,包括选自由双氰胺、三聚氰胺、均苯四甲酸二酐(Pyromellitic dianhydride)、环丁烷-1,2,3,4-四羧酸二酐(Cyclobutane-1,2,3,4-tetracarboxylic dianhydride)、1,4,5,8-萘四羧酸二酐(1,4,5,8-Naphthalenetetracarboxylic dianhydride)、二苯甲酮-3,3’,4,4’-四羧酸二酐(Benzophenone-3,3′,4,4′-tetracarboxylic dianhydride)、3,3’,4,4’-联苯四羧酸二酐(3,3′,4,4′-Biphenyltetracarboxylic dianhydride)、双环[2.2.2]辛-7-烯-2,3,5,6-四羧酸二酐(Bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylicdianhydride)、1,2,4-苯三羧酸(1,2,4-Benzenetricarboxylic acid)、4,4’-(9-亚芴基)二苯酚(4,4′-(9-Fluorenylidene)diphenol)、4,4’-(1,3-金刚烷二基)二苯酚(4,4′-(1,3-Adamantanediyl)diphenol)、4,4’-(六氟异亚丙基)二苯酚(4,4′-(Hexafluoroisopropylidene)diphenol)及4,4’-二羟基联苯(4,4′-Dihydroxybiphenyl)组成的组中的一种以上,但不限定于例示。
在本发明的一具体例中,本发明的聚倍半硅氧烷树脂组合物所包含的有机溶剂为选自由二甘醇二甲基乙基醚、甲氧基丙酸甲酯、乙氧基丙酸乙酯、乳酸乙酯、丙二醇甲醚乙酸酯、丙二醇甲醚、丙二醇丙醚、甲基溶纤剂乙酸酯、乙基溶纤剂乙酸酯、二甘醇甲基乙酸酯、二甘醇乙酸乙酯、甲基异丁基酮、环己酮、N-甲基-2-吡咯烷酮(NMP)、乙二醇二甲醚、二甘醇甲醚、二甘醇乙醚及二丙二醇甲醚组成的组中的一种以上,但不限定于例示。如上所述,本发明的散热片通过电纺丝方法来制成网形态,使得厚度变薄,因而具有能够适用于厚度薄的电子设备的优点。
在本发明的一具体例中,本发明的所述聚倍半硅氧烷树脂组合物包含5重量百分比至50重量百分比的由以下化学式1表示的聚倍半硅氧烷无规共聚物树脂、1重量百分比至30重量百分比的化学式3的化合物1重量百分比至10重量百分比的交联剂及10重量百分比至92.9重量百分比的有机溶剂:
化学式1:
化学式2:
其中,n为2至100的整数,R1至R5为选自由C1-20的烷基、C2-20的亚烷基、C2-20的烯基、C2-20的炔基、C6-18的芳基、C6-18的杂芳基、C6-18的环烷基、氨基、核原子数为3至40的杂环烷基、缩水甘油氧基、环己基环氧基、C3-10的杂环烷基、丙烯酰氧基、异氰酸酯基、羟基、邻苯二甲酸酐基、马来酸酐基、琥珀酸酐基组成的组中的一种以上,R5为选自由缩水甘油氧基、环己基环氧基、C3-10的杂环烷基、丙烯酰氧基、异氰酸酯基、羟基、邻苯二甲酸酐基、马来酸酐基、琥珀酸酐基、氨基及羧酸基组成的组中的一种以上,所述R1至R5的烷基、亚烷基、烯基、炔基、芳基、杂芳基、环烷基、杂环烷基及丙烯酰氧基可各自独立地被选自由卤素、羟基、-CN、直链或支链的C1-6的烷基及C1-6的烷氧基组成的组中的一种以上的取代基取代或非取代。
在本发明的一具体例中,本发明的聚倍半硅氧烷树脂组合物还可包含表面活性剂及二醇类溶剂。为了提高包含本发明的聚倍半硅氧烷树脂组合物的膜的流平特性及涂敷不均匀特性,还可包含0.01重量百分比至10重量百分比的所述表面活性剂。
在本发明的一具体例中,涉及包含本发明的聚倍半硅氧烷树脂组合物的层间绝缘膜,所述层间绝缘膜可用于液晶显示器、有机电致发光(EL)显示器、柔性显示器或触摸面板,但不限定于例示。
在本发明的一具体例中,涉及包含本发明的聚倍半硅氧烷树脂组合物的平坦化膜,所述平坦化膜可用于液晶显示器、有机电致发光显示器、柔性显示器或触摸面板,但不限定于例示。
在本发明的一具体例中,涉及包含本发明的聚倍半硅氧烷树脂组合物的钝化绝缘膜,所述钝化绝缘膜可用于液晶显示器、有机电致发光显示器、柔性显示器或触摸面板,但不限定于例示。
在本发明的一具体例中,涉及包含本发明的聚倍半硅氧烷树脂组合物的基板用材料,所述基板用材料可用于液晶显示器、有机电致发光显示器、柔性显示器或触摸面板,但不限定于例示。
发明的效果
本发明的聚倍半硅氧烷类树脂组合物可形成透明的薄膜,即使固化后在可见光区域也呈现优秀的透射性,并且耐热性优秀,可调节柔性和耐裂痕性。与现有的聚酰亚胺类基板材料相比,可同时满足优秀的绝缘特性及钝化(Passivation)特性。并且,确保从玻璃基板的剥离(Delamination)工序时的脱模特性,从而有利于生产性。
附图说明
图1涉及本发明的聚倍半硅氧烷无规共聚物的分子量。
具体实施方式
由以下化学式1表示的聚倍半硅氧烷无规共聚物:
化学式1:
在所述化学式1中,
n为2至100的整数,
R1至R4为选自由C1-20的烷基、C2-20的亚烷基、C2-20的烯基、C2-20的炔基、C6-18的芳基、C6-18的杂芳基、C6-18的环烷基、氨基、核原子数为3至40的杂环烷基、缩水甘油氧基、环己基环氧基、C3-10的杂环烷基、丙烯酰氧基、异氰酸酯基、羟基、邻苯二甲酸酐基、马来酸酐基、琥珀酸酐基组成的组中的一种以上,
所述R1至R4的烷基、亚烷基、烯基、炔基、芳基、杂芳基、环烷基、杂环烷基及丙烯酰氧基能够各自独立地被选自由卤素、羟基、-CN、直链或支链的C1-6的烷基及C1-6的烷氧基组成的组中的一种以上的取代基取代或非取代。
下面,通过实施例更详细地说明本发明。这些实施例仅用于更具体地说明本发明,根据本发明的主旨,本发明的范围不限定于这些实施例,这对于本领域普通技术人员是显而易见的。
合成例1
聚倍半硅氧烷无规共聚物的合成
在具备漏斗、制冷管、搅拌器的2L的烧瓶中称量并加入51.04g(0.10摩尔)的1H,1H,2H,2H-全氟辛基三乙氧基硅烷(1H,1H,2H,2H-Perfluorooct yltriethoxysilane)、73.31g(0.30摩尔)的二苯基二甲氧基硅烷、88.49g(0.30摩尔)的三乙氧基[3-[(3-乙基-3-氧杂环丁烷基)甲氧基]丙基]硅烷、70.32g(0.30摩尔)的三甲氧基辛基硅烷、200g的丙二醇单甲醚乙酸酯,搅拌所述溶液的同时缓慢滴加3.01g(0.1摩尔)的35%的HCl水溶液和60g的超纯水混合液。此时,保持温度以使放热温度不超过50℃。滴加结束后,将反应温度升至90℃并搅拌24小时。
反应结束后,加入蒸馏水,通过相分离回收有机相,蒸发去除残留溶剂及水分来获得90g的聚倍半硅氧烷共聚物树脂。将获得的共聚物树脂溶解于500g的丙二醇单甲醚乙酸酯中。
图1涉及合成例1中所制备的聚倍半硅氧烷无规共聚物的重均分子量,作为凝胶渗透色谱(GPC)测定结果,共聚物树脂的分散度(PDI)为2.05,重均分子量为(Mw)7500。
实施例1
聚倍半硅氧烷类树脂组合物的制备
将所述合成例1中所制备的聚倍半硅氧烷无规共聚物树脂溶液以100重量百分比的固体成分比率,使用以固体成分比率为20重量百分比的八-环氧环己基乙基聚倍半硅氧烷(Hybridplastics公司,笼(Cage)型),作为固化剂使用3重量百分比的1,2,4-苯三羧酸(1,2,4-Benzenetricarboxylic acid)、0.5重量百分比的硅类表面活性剂,作为稀释溶剂使用丙二醇单甲醚乙酸酯来使组合物的固体成分含量稀释至30重量百分比后,通过孔径为0.1um的聚四氟乙烯(PTFE)膜过滤器过滤来获得液相的树脂组合物。
实施例2
除了使用八-缩水甘油基聚倍半硅氧烷(Hybridplastics公司,笼型)代替八-环氧环己基乙基聚倍半硅氧烷之外,以与实施例1相同的方法制备。
实施例3
除了使用八-马来酸聚倍半硅氧烷(Hybridplastics公司,笼型)代替八-环氧环己基乙基聚倍半硅氧烷之外,以与实施例1相同的方法制备。
比较例
代替本发明的合成树脂,将以下西格玛奥德里奇(Sigma Aldrich)公司的(均苯四甲酸二酐-共-4,4’-氧基二苯胺)(Poly(pyromellitic dianhydride-co-4,4′-oxydianiline))、酰胺酸溶液(amic acid solution)以100重量百分比的固体成分比率,使用0.5重量百分比的额硅类表面活性剂,作为稀释溶剂使用丙二醇单甲醚乙酸酯来使组合物的固体成分含量稀释至30重量百分比后,通过孔径为0.1um的聚四氟乙烯膜过滤器过滤来获得液相的树脂组合物。
对所述实施例及比较例的树脂组合物进行如下所述的物性评价,在下列表1中示出评价结果。
1.涂敷膜形成
通过在硅晶片或玻璃基板上以500rpm的速度旋转涂敷液相树脂组合物来形成涂膜后,在软烘焙工序中,在100℃的温度下对热板(Hot plate)进行烘焙120秒,使用光学式厚度测定仪(产品名称:Kmac公司ST-4000)测定涂敷膜的厚度,测定结果为10um。
2.裂痕评价
将所述获得的涂敷膜通过在250℃的烘箱中对基板进行第一次加热30分钟来固化涂膜后,再次在300℃的温度下进行30分钟的第二次加热,利用光学显微镜观察,若无裂痕,则判断为“优秀”,若产生裂痕,则判断为“不良”。
3.残膜率评价
通过下式1计算残膜率。
式1:
残膜率(%)=(在250℃的温度下,固化30分钟后的膜厚度/初始厚度)×100
4.耐热性评价
在250℃的温度下,在300℃的温度下进行第一次固化30分钟后,通过进行第二次固化30分钟来测定渗透度。利用紫外可见(UV/Vis)分光计(spectrometer)(300nm~800nm平均渗透度)进行测定,若为95%以上,则判断为“优秀”,若为95%~90%,则判断为“一般”,若为小于90%,则判断为“不良”。
5.耐化学性评价
在形成涂敷膜后,在250℃的温度下进行固化工序30分钟,将PR剥离液(商品名,LT-360)在40℃的温度下浸渍10分钟后,计算膜厚度的膨胀(Swelling)变化率。当小于5%的膨胀变化率时,判断为“优秀”,当5%以上的膨胀变化率或存在膜厚度减小时,判断为“不良”。
6.介电常数评价
在ITO基板上形成涂膜并经固化工序后,通过沉积1.0mm的直径的铝电极来制造金属-绝缘体-金属(Metal-Insulator-Metal)(MIM)评价单元。为了测定介电常数,所述评价单元使用LCR-测定仪(meter)(安捷伦公司4284)来测定所涂敷的抗蚀膜的电容C并通过下式2来计算介电常数。
式2:
C=(ε0εA)/d
其中,
d=固化膜的厚度,
A=沉积电极的面积,
ε0为真空介电常数(8.855×10-12F/m),
ε为所要获得的涂膜的介电常数。
7.水分吸湿率评价
在形成涂敷膜后,经固化工序,然后在常温下浸渍于蒸馏水中72小时后,计算膜厚度膨胀变化率。将小于2%的膨胀变化判断为“优秀”,当2%以上膨胀变化时,判断为“不良”。
8.接触角测定
在形成涂敷膜后,经250℃的固化工序30分钟,然后在涂膜表面滴加(Dropping)DI滴来测定接触角,若为80度以上,则判断为“优秀”,若为80度以下,则判断为“一般”。
表1
从所述表1可知,在本发明中,与使用现有的聚酰亚胺的基板不同,使用由所述化学式1和2及固化剂的混合组成的聚倍半硅氧烷树脂组合物的柔性基板用高透明高耐热液相涂敷组合物不仅呈现优秀的透明性及耐热性,而且残膜率、耐化学性非常优秀。
并且,相对于比较例,由本发明的组合物形成的透明涂膜呈现低介电特性及低水分吸湿率,从而当用作柔性基板时,可期待元件的优秀的可靠性,因高的接触角而在耐污染特性方面或在玻璃基板上进行剥离(delamination)工序时有利。因此,可知由本发明的树脂组合物获得的涂膜可有效地用作液晶显示元件的层间绝缘膜、有机电致发光显示元件、柔性显示器或触摸面板用材料。
工业利用可能性
本发明涉及柔性基板用聚倍半硅氧烷树脂组合物。更具体地,本发明涉及作为可用于柔性显示器基板的树脂组合物,具有优秀的耐热性及透明性的柔性基板用聚倍半硅氧烷树脂组合物。
Claims (13)
1.一种聚倍半硅氧烷无规共聚物,其特征在于,由以下化学式1表示:
化学式1:
在所述化学式1中,
n为2至100的整数,
R1至R4为选自由C1-20的烷基、C2-20的亚烷基、C2-20的烯基、C2-20的炔基、C6-18的芳基、C6-18的杂芳基、C6-18的环烷基、氨基、核原子数为3至40的杂环烷基、缩水甘油氧基、环己基环氧基、C3-10的杂环烷基、丙烯酰氧基、异氰酸酯基、羟基、邻苯二甲酸酐基、马来酸酐基、琥珀酸酐基组成的组中的一种以上,
所述R1至R4的烷基、亚烷基、烯基、炔基、芳基、杂芳基、环烷基、杂环烷基及丙烯酰氧基能够各自独立地被选自由卤素、羟基、-CN、直链或支链的C1-6的烷基及C1-6的烷氧基组成的组中的一种以上的取代基取代或非取代。
2.根据权利要求1所述的聚倍半硅氧烷无规共聚物,其特征在于,
所述化学式1的R1为CF3-(CF2)m-,
m为0至18的整数,
R2为C2-20的亚烷基,
R4为选自由缩水甘油氧基、环己基环氧基、氧杂环丁烷、丙烯酰氧基、甲基丙烯酰氧基、异氰酸酯基、羟基、邻苯二甲酸酐基、马来酸酐基及琥珀酸酐基组成的组中的一种以上,
所述R2至R4的亚烷基、芳基、杂芳基、环烷基、杂环烷基及丙烯酰氧基各自独立地被选自由卤素、羟基、-CN、直链或支链的C1-6的烷基及C1-6的烷氧基组成的组中的一种以上的取代基取代或非取代。
3.根据权利要求1所述的聚倍半硅氧烷无规共聚物,其特征在于,所述无规共聚物的重均分子量Mw为1000至50000,分散度为1.5至8.0。
4.一种聚倍半硅氧烷树脂组合物,其特征在于,包含:
权利要求1至3中任一项所述的聚倍半硅氧烷无规共聚物;
以下化学式2的化合物;
有机溶剂;以及
交联剂:
化学式2:
在所述化学式2中,
R5为选自由缩水甘油氧基、环己基环氧基、C3-10的杂环烷基、丙烯酰氧基、异氰酸酯基、羟基、邻苯二甲酸酐基、马来酸酐基、琥珀酸酐基、氨基及羧酸基组成的组中的一种以上,
所述R5的杂环烷基及丙烯酰氧基能够各自独立地被选自由卤素、羟基、-CN、直链或支链的C1-6的烷基及C1-6的烷氧基组成的组中的一种以上的取代基取代或非取代。
5.根据权利要求4所述的聚倍半硅氧烷树脂组合物,其特征在于,所述交联剂为选自由三聚氰胺类化合物、酸酐类化合物、异氰酸酯类化合物、胺类化合物、咪唑类化合物、苯酚类化合物、羟基类化合物、羧基类化合物及它们的混合物组成的组中的一种以上。
6.根据权利要求5所述的聚倍半硅氧烷树脂组合物,其特征在于,所述交联剂为选自由双氰胺、三聚氰胺、均苯四甲酸二酐、环丁烷-1,2,3,4-四羧酸二酐、1,4,5,8-萘四羧酸二酐、二苯甲酮-3,3’,4,4’-四羧酸二酐、3,3’,4,4’-联苯四羧酸二酐、双环[2.2.2]辛-7-烯-2,3,5,6-四羧酸二酐、1,2,4-苯三羧酸、4,4’-(9-亚芴基)二苯酚、4,4’-(1,3-金刚烷二基)二苯酚、4,4’-(六氟异亚丙基)二苯酚及4,4’-二羟基联苯组成的组中的一种以上。
7.根据权利要求4所述的聚倍半硅氧烷树脂组合物,其特征在于,所述有机溶剂为选自由二甘醇二甲基乙基醚、甲氧基丙酸甲酯、乙氧基丙酸乙酯、乳酸乙酯、丙二醇甲醚乙酸酯、丙二醇甲醚、丙二醇丙醚、甲基溶纤剂乙酸酯、乙基溶纤剂乙酸酯、二甘醇甲基乙酸酯、二甘醇乙酸乙酯、甲基异丁基酮、环己酮、N-甲基-2-吡咯烷酮、乙二醇二甲醚,二甘醇甲醚、二甘醇乙醚及二丙二醇甲醚组成的组中的一种以上。
8.根据权利要求4所述的聚倍半硅氧烷树脂组合物,其特征在于,
所述聚倍半硅氧烷树脂组合物包含5重量百分比至50重量百分比的由以下化学式1表示的聚倍半硅氧烷无规共聚物树脂、1重量百分比至30重量百分比的由以下化学式2表示的化合物、1重量百分比至10重量百分比的交联剂及10重量百分比至92.9重量百分比的有机溶剂:
化学式1:
化学式2:
其中,
n为2至100的整数,
R1至R5为选自由C1-20的烷基、C2-20的亚烷基、C2-20的烯基、C2-20的炔基、C6-18的芳基、C6-18的杂芳基、C6-18的环烷基、氨基、核原子数为3至40的杂环烷基、缩水甘油氧基、环己基环氧基、C3-10的杂环烷基、丙烯酰氧基、异氰酸酯基、羟基、邻苯二甲酸酐基、马来酸酐基、琥珀酸酐基组成的组中的一种以上,
R5为选自由缩水甘油氧基、环己基环氧基、C3-10的杂环烷基、丙烯酰氧基、异氰酸酯基、羟基、邻苯二甲酸酐基、马来酸酐基、琥珀酸酐基、氨基及羧酸基组成的组中的一种以上,
所述R1至R5的烷基、亚烷基、烯基、炔基、芳基、杂芳基、环烷基、杂环烷基及丙烯酰氧基能够各自独立地被选自由卤素、羟基、-CN、直链或支链的C1-6的烷基及C1-6的烷氧基组成的组中的一种以上的取代基取代或非取代。
9.根据权利要求4所述的聚倍半硅氧烷树脂组合物,其特征在于,所述聚倍半硅氧烷树脂组合物还包含表面活性剂及二醇类溶剂。
10.一种层间绝缘膜,其特征在于,包含权利要求4所述的聚倍半硅氧烷树脂组合物。
11.一种平坦化膜,其特征在于,包含权利要求4所述的聚倍半硅氧烷树脂组合物。
12.一种钝化绝缘膜,其特征在于,包含权利要求4所述的聚倍半硅氧烷树脂组合物。
13.一种基板用材料,其特征在于,包含权利要求4所述的聚倍半硅氧烷树脂组合物。
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