HK1259350A1 - 柔性基板用聚倍半硅氧烷樹脂組合物 - Google Patents
柔性基板用聚倍半硅氧烷樹脂組合物Info
- Publication number
- HK1259350A1 HK1259350A1 HK19101716.0A HK19101716A HK1259350A1 HK 1259350 A1 HK1259350 A1 HK 1259350A1 HK 19101716 A HK19101716 A HK 19101716A HK 1259350 A1 HK1259350 A1 HK 1259350A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- resin composition
- flexible substrate
- polysilsesquioxane resin
- polysilsesquioxane
- flexible
- Prior art date
Links
- 229920000734 polysilsesquioxane polymer Polymers 0.000 title 1
- 239000011342 resin composition Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/20—Diluents or solvents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2150/00—Compositions for coatings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/65—Additives macromolecular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
- H01L27/1266—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Polymers (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150191064A KR101751904B1 (ko) | 2015-12-31 | 2015-12-31 | 유연기판용 폴리실세스퀴옥산 수지 조성물 |
PCT/KR2016/015491 WO2017116171A1 (ko) | 2015-12-31 | 2016-12-29 | 유연기판용 폴리실세스퀴녹산 수지 조성물 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1259350A1 true HK1259350A1 (zh) | 2019-11-29 |
Family
ID=59225021
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK19101716.0A HK1259350A1 (zh) | 2015-12-31 | 2019-01-31 | 柔性基板用聚倍半硅氧烷樹脂組合物 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10934455B2 (zh) |
JP (2) | JP2019504159A (zh) |
KR (1) | KR101751904B1 (zh) |
CN (1) | CN108473682B (zh) |
HK (1) | HK1259350A1 (zh) |
WO (1) | WO2017116171A1 (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101751904B1 (ko) | 2015-12-31 | 2017-07-12 | 엘티씨 (주) | 유연기판용 폴리실세스퀴옥산 수지 조성물 |
JP7263356B2 (ja) * | 2018-07-27 | 2023-04-24 | 富士フイルム株式会社 | ハードコートフィルム、ハードコートフィルムを備えた物品、及び画像表示装置 |
JP7535946B2 (ja) * | 2018-10-30 | 2024-08-19 | ダウ・東レ株式会社 | 紫外線硬化性オルガノポリシロキサン組成物およびその用途 |
JP7202253B2 (ja) * | 2019-05-10 | 2023-01-11 | 信越化学工業株式会社 | 放射線硬化性オルガノポリシロキサン組成物並びに剥離シート |
DE102019209346A1 (de) * | 2019-06-27 | 2020-12-31 | Siemens Aktiengesellschaft | Imprägnierformulierung, Isolationsmaterial, Verfahren zum Herstellen eines Isolationsmaterials und elektrische Maschine mit einem Isolationsmaterial |
KR102147297B1 (ko) * | 2019-09-30 | 2020-08-24 | 에스케이이노베이션 주식회사 | 윈도우 커버 필름 및 이를 포함하는 플렉서블 디스플레이 패널 |
WO2022059971A1 (ko) * | 2020-09-21 | 2022-03-24 | 주식회사 엘지화학 | 플렉서블 디스플레이 장치 제조용 복합 기판, 이를 이용한 플렉서블 디스플레이 장치의 제조 방법, 및 플렉서블 디스플레이 장치용 적층체 |
KR102618701B1 (ko) * | 2020-12-17 | 2023-12-29 | 주식회사 케이엔더블유 | 다층구조의 스트레처블 디스플레이용 연신기판 |
CN115505121A (zh) * | 2021-06-23 | 2022-12-23 | 中国石油化工股份有限公司 | 一种功能性共聚尼龙树脂及其制备方法和应用 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3244519B2 (ja) * | 1991-08-26 | 2002-01-07 | 昭和電工株式会社 | アクリル官能性メチルフルオロアルキルシルセスキオキサン化合物 |
JP3317716B2 (ja) * | 1992-02-21 | 2002-08-26 | 昭和電工株式会社 | フッ素含有ポリオルガノシルセスキオキサンを含む離型剤およびこの製造方法 |
JP3653976B2 (ja) * | 1997-08-11 | 2005-06-02 | 東亞合成株式会社 | 光カチオン硬化性樹脂組成物 |
JPH11292971A (ja) * | 1998-04-10 | 1999-10-26 | Mitsubishi Electric Corp | 高純度シリコーンラダーポリマーおよびその製造方法 |
US6187505B1 (en) * | 1999-02-02 | 2001-02-13 | International Business Machines Corporation | Radiation sensitive silicon-containing resists |
BR0012206B1 (pt) * | 1999-07-02 | 2010-08-24 | artigo fotocrâmico revestido e artigo fotocrâmico. | |
JP2003043682A (ja) * | 2001-08-01 | 2003-02-13 | Jsr Corp | 感放射線性誘電率変化性組成物、誘電率変化法 |
FR2838746B1 (fr) * | 2002-04-17 | 2004-07-09 | Corning Inc | Compositions photochromiques reticulables, reticulees; preparation; substrats revetus desdites compositions, lentilles en lesdites compositions reticulees |
JP4103702B2 (ja) * | 2003-07-04 | 2008-06-18 | 東亞合成株式会社 | 硬化性組成物及び反射防止膜 |
JP4690737B2 (ja) * | 2005-02-10 | 2011-06-01 | リンテック株式会社 | ラダー型ポリシルセスキオキサンを含む樹脂組成物およびその用途 |
US20090088547A1 (en) * | 2006-10-17 | 2009-04-02 | Rpo Pty Limited | Process for producing polysiloxanes and use of the same |
CN102007165B (zh) | 2008-02-14 | 2016-04-13 | 琳得科株式会社 | 由聚有机硅氧烷化合物构成的成型材料、密封材料及光元件密封体 |
KR20100097558A (ko) | 2009-02-26 | 2010-09-03 | 한국생산기술연구원 | 유리전이 특성이 억제된 열경화성 고분자 복합체 |
KR20100131312A (ko) | 2009-06-05 | 2010-12-15 | 한국과학기술연구원 | 폴리플루오로계실세스퀴옥산 및 그의 제조방법 |
KR20110016538A (ko) | 2009-08-12 | 2011-02-18 | 주식회사 이그잭스 | 다면체 올리고머 실세스퀴녹산 화합물을 함유하는 이방 도전성 접착제 |
JP5526321B2 (ja) * | 2009-08-24 | 2014-06-18 | 独立行政法人 宇宙航空研究開発機構 | 宇宙空間用硬化性組成物、宇宙空間用硬化物、及び、宇宙空間用複合膜 |
JP2012116990A (ja) * | 2010-12-02 | 2012-06-21 | Seiko Instruments Inc | 封止材用組成物、封止材用組成物を用いた発光デバイスおよび太陽電池モジュール |
MX368848B (es) * | 2011-07-11 | 2019-10-18 | Tokuyama Corp | Composición curable fotocrómica. |
CN103828062B (zh) * | 2011-12-26 | 2016-08-17 | 东亚合成株式会社 | 有机半导体绝缘膜用组合物及有机半导体绝缘膜 |
KR101406298B1 (ko) | 2011-12-30 | 2014-06-12 | 주식회사 삼양사 | 고내열성 네거티브 레지스트 조성물 |
KR102170818B1 (ko) * | 2013-12-26 | 2020-10-28 | 주식회사 동진쎄미켐 | 열 용융-압출 성형이 가능한 실세스퀴옥산, 이를 이용한 고투명 및 고내열 플라스틱 투명기판 및 이의 제조방법 |
KR101520793B1 (ko) * | 2014-08-28 | 2015-05-18 | 엘티씨 (주) | 고내열성 폴리실세스퀴녹산계 감광성 수지 조성물 |
KR101695793B1 (ko) * | 2014-10-21 | 2017-01-23 | 한국과학기술연구원 | 사다리형 폴리실세스퀴옥산을 이용한 기체분리막 및 그 제조방법 |
KR101751904B1 (ko) | 2015-12-31 | 2017-07-12 | 엘티씨 (주) | 유연기판용 폴리실세스퀴옥산 수지 조성물 |
-
2015
- 2015-12-31 KR KR1020150191064A patent/KR101751904B1/ko active IP Right Grant
-
2016
- 2016-12-29 CN CN201680077335.0A patent/CN108473682B/zh active Active
- 2016-12-29 WO PCT/KR2016/015491 patent/WO2017116171A1/ko active Application Filing
- 2016-12-29 US US16/067,512 patent/US10934455B2/en active Active
- 2016-12-29 JP JP2018533736A patent/JP2019504159A/ja active Pending
-
2019
- 2019-01-31 HK HK19101716.0A patent/HK1259350A1/zh unknown
-
2020
- 2020-07-03 JP JP2020115724A patent/JP6919941B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
WO2017116171A1 (ko) | 2017-07-06 |
JP2020183538A (ja) | 2020-11-12 |
CN108473682B (zh) | 2021-04-27 |
JP2019504159A (ja) | 2019-02-14 |
US20190023942A1 (en) | 2019-01-24 |
US10934455B2 (en) | 2021-03-02 |
CN108473682A (zh) | 2018-08-31 |
KR101751904B1 (ko) | 2017-07-12 |
JP6919941B2 (ja) | 2021-08-18 |
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